Thermal Expansion
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Expansion Card
PMC238
The PMC238 is a 6U form factor card that expands a single PMC site on a VMEbus processor board to two PMC sites and one PCMCIA/CardBus socket or to three PMC sites. Compatible with many VMEbus single board computers, it provides an extension of PCI and PCMCIA capacity within the VMEbus form factor. The PMC238 has the option for the PCMCIA/CardBus cards to be mounted outside the chassis using an 18-inch cable.
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Expansion Board
MSXB 044
The MSXB 044 expansion board works with the iDSC 1816 to add signal conditioning to the data acquisition and anti-aliasing capabilities. Four MSXB 044 boards are included in each MSSC-8 module. Purchase the MSXB 044 as part of a complete SCS system: an enclosure and 1, 2, 3, or 4 MSSC-8 modules, for a total of 8, 16, 24, or 32 channels.
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Row Expansion Cables
Y1134A
Easily configure an expanded matrix using this expansion cable with the 34934C and 34934T terminal blocks
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PMC/XMC Expansion Card
EXP238
The EXP238 is a 6U VMEbus form factor expansion card offering three XMC/PMC expansion sites. When ordered as an option for the XVB603 VMEbus single board computer, the 3-slot solution greatly expands system flexibility.
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Special Function I/O Expansion
This add-in module is 40 times faster than USB 1.x implementations and supports signaling up to 480 Megabits per second (Mbps). It is based upon the NEC uPD720101 USB 2.0 host controller that is supported by a wide range of operating systems including Windows and Linux.
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Expansion Peripherals
Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.
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PCI/PCI Express Expansion Backplane
SKU-075-0X
PCI/PCI Express Expansion backplane was designed as a universal solution for Desktop or Laptop host computer expansion.It allows adding up to 4 PCI and up to 2 PCI Express boards to the host computer. Expansion backplane can be placed inside any general-purpose computer chassis and connects to the host computer via 5ft (or 10ft) CAT6 cable.
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FMC Expansion I/O Module.
SI-MOD32xx
The SI-MOD32xx is a family of high resolution, FMC form factor, high channel count multi function data acquisition and control modules that plug into any SI-DSP or FPGA carrier card.
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Thermal Enclosures
LDP
Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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Analog Expansion Board
MSXB 014
The MSXB 014 Analog Expansion Board provides 4 additional analog outputs. Up to 16 Analog Output Expansion Boards can be connected to a single DAP for a total of 64 additional output channels.
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Thermal Printer
DP-581H
It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)
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Thermal needle system thermal resistivity / conductivity measurement
MTN01
Hukseflux Thermal Sensors B.V.
The MTN01 Multi-purpose Thermal Needle System allows performing fast measurements of the thermal resistivity or conductivity of soils. It is specifically designed to be reasonably robust, as well as accurate. It is therefore suitable for laboratory as well as field- measurements of soil thermal properties. The sensor is a Non-Steady-State Probe (NSSP), TP07, which is mounted on the Insertion Tool, IT02. The system is operated using a hand-held Control and Readout Unit CRU01.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Thermal Profiler
KIC K2
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Thermal Shock Chamber
The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Thermal measuring instrument
High performance heat flow meter with data logger.Up to 16 sensors can be connected at one time.Connectable with all heat flow sensors.
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Thermal Imagers & Systems
Advanced Energy’s turn-key thermal imagers and systems accurately measure temperature and use reliable infrared technology. These high-tech instruments can precisely determine the temperature and temperature distribution of small and fast-moving objects.
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Thermal Vacuum Testing
When you want to test your product for extreme space conditions, that include temperatures from 155°C to -175°C at space vacuum altitudes, Environment Associates is your solution. Using this test to determine the unique failures of space mechanisms that orbit the earth is key in improving system reliability. Thermal vacuum testing is similar to thermal cycling but adds deep space vacuums for detecting corona/arcing and intermittence and increases a product’s out-gassing. The key failure modes found during this test are: 1) electrical iIntermittence, 2) thermal control issues, 3) arcing, 4) corona, 5) material out-gassing, and more, to determine a product’s flight-worthiness for workmanship and processing issues.
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Expansion I/O Module.
SI-MOD66xx
The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.
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Thermal Inducing System
Wewon Environmental Chambers Co, Ltd.
Design and development is the stage with the most type of thermal inducing system, It mainly includes oscilloscope, signal source, spectrum analyzer (signal analyzer), vector network analyzer and other general thermal management solutions, As well as channel simulator, terminal simulator, base station simulator and other dedicated thermal inducing system.https://www.wewontech.com/thermal-inducing-system/
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Thermal Imaging Camera
TI160 - P5
TI 160-P5 is a special thermal imaging camera for human body temperature measurement only. Its has Accurate temperature measurement, real-time imaging, ability to quickly lock the hot-spot. It is been widely used in airports, docks,railway stations, schools, shopping malls and other public places to check human body temperature abnormalities. Palmetto design, compact and lightweight, integrated visible light function. Reliable performance and accurate temperature measurement can effectively improve the efficiency of detection.
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Thermal Power Sensors
NRPxxT/TN/TWG
The R&S®NRP power meter sensors have long been recognized for delivering supreme precision and speed. The R&S®NRPxxT, R&S®NRPxxTN and R&S®NRPxxTWG thermal power sensors are especially used for complex measurement tasks where highest accuracy counts
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HD Thermal Camera
T1010
The T1010 uses the power of FLIR Vision Processing™ to deliver detailed, smooth pictures with very little image noise. FLIR Vision Processing combines HD resolution, MSX®, and UltraMax® image enhancement with FLIR's proprietary adaptive filtering algorithms to produce brilliant thermal images with up to 3.1 million pixels. Plus, the T1010 is sensitive enough to detect temperature differences down to <20 mK, for clear, low-noise results that keep you from missing any potential issues during inspections. 1024 × 768 true HD resolution images, with thermal measurements up to 650°C (1202°F).
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Thermal Shock
Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Thermal Monitoring System
The monitoring system for the thermal state of traction electric locomotive machines is designed for:control of the thermal state of traction electric motors (TED) as part of a high-speed traction-energy car-laboratory for testing rolling stock (TEL-C) in the acceptance and certification tests of electric locomotives;control of the thermal load of the TED and the temperature distribution by volume of the TED during the operational tests of electric locomotives;experimental determination of the most heated parts of the TED under different operating conditions;display of the current thermal state of the engine to the operator of the system;storing the thermal state data in the database for later playback.





























