Thermal Expansion
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Product
Coupler Workstations
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Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
Horizontal Dilatometers
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TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Product
Thermal Analysis
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The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Product
Thermal imagers
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Thermal imagers sensitive in MWIR and LWIR spectral bands are one of crucial surveillance technologies for defense/security sector. These imagers have also found mass applications outside defense sector. Testing thermal imagers is needed for both manufacturers, maintenance workshops and final users for a set of different and important reasons. Hi-tech test equipment can help significantly in manufacturing, maintenance, training, purchase optimization, and optimal use of these expensive imagers.
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Product
Thermal Imager
testo 865
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The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Product
Thermal Profiler
KIC K2
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The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Product
Thermal FETs
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Pin-compatible with standard Power MOSFET packages and built-in over temperature protection function for body, lighting and heater applications, as well as powertrain applications and 24V battery system applications.
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Product
Expansion I/O Module.
SI-MOD66xx
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The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.
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Product
Frequency Expansion Modules
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bsw TestSystems & Consulting AG
Up To 1.5THz For Network Analyzers Modern communication standards, like for instance 5G, place high demands on components (mixers, amplifiers, antennas, etc.), which have to be examined in high frequency bands (millimeter waves); the requirements include: broad frequency coverage, sufficient output power to operate the components under compression, high dynamic range and stability as well as a reduced dynamic content within the spectrum.
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Product
CAN/LIN Communications Expansion Kit
OP-SB7GX
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OP-SB7GX is the expansion kit which makes it possible to monitor, and simulate CAN and LIN communications. It enables monitoring of CAN and LIN data in any combination up to 2 channels at a time. Suitable for evaluation of mixed in-vehicle networks of CAN and LIN.
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Product
CAN/LIN Communications Expansion Kit
OP-SB87
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OP-SB87 is an expansion board for CAN/LIN communications, inserting into a slot of communication analyzer LE-8200A/LE-8200. It has 2 CAN connectors and 2 LIN connectors, and measures 2 channels of CAN or LIN, or 1 CAN/1 LIN. It is useful to measure network where there are CAN and LIN communications at the same time.
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Product
Thermal Vacuum Chamber
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Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Product
Simultaneous Thermal Analyzer
SDT 650
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TA Instruments invites you to experience the world’s finest Simultaneous DSC/TGA, the Discovery SDT 650. Discover the advanced engineering and attention to detail that provides enhancements in every aspect of performance and a new level of user experience. Available with or without an Autosampler, the Discovery SDT is sure to meet your needs and exceed your expectations.
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Product
Thermal Security Camera
Elara™ FC-Series O
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The Elara™ FC-Series O thermal security camera is one of FLIR’s premium thermal security cameras for perimeter protection. The Elara FC-Series O integrates with external video analytics devices, such as FLIR’s TRK or third party solutions, to classify human or vehicular intrusions. The Elara FC-Series O also offers a wide range of high-performance lenses, with a choice of resolutions, offering greater flexibility for tailoring security systems to specific site conditions.
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Product
Thermal properties sensor
TP01
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Hukseflux Thermal Sensors B.V.
TP01 is designed for long term (permanent) installation in soils. It covers the thermal conductivity (λ) range of 0.3 to 4 W/m.K, which is sufficient for most inorganic soil types. The core of TP01 is a differential temperature sensor (2 thermopiles) (1) measuring the radial differential temperature with record breaking sensitivity. The sensor performs a temperature measurement around a heating wire (2).
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Product
Thermal Testing
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A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)
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Product
Thermal Insulation Demonstrator
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Shenzhen Linshang Technology Co., Ltd.
Linshang Technology offers three sales kits to demonstrate the thermal insulation performance and UV blocking performance of glass and window films, two solar film temperature meters LS300 and LS301 to demonstrate thermal insulation performance through temperature test, two power meter: infrared power meter and UV power meter.
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Product
Thermal Enclosures
LDP
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Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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Product
Thermal Camera
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The thermal camera allows real-time thermography with 100Hz frame rate via USB 2.0 interface. The camera is lightweight, compact and rugged (IP65). Measurement ranges of -20C to 100C, 0C to 250C, or 150C to 900C are selectable in software. Interchangeable lenses are available with 6x5, 23x17, 48x31 and 72x52 field of view.
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Product
Thermal Cameras
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Megger's thermal cameras are professional and easy-to-use, and provide fast accurate readings.
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Product
Thermal Cabinets
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AMETEK Sensors, Test & Calibration
We provide two models of high precision heating and cooling thermal cabinets; the TC540 heating cabinets (40°C to 300°C) and the TC550 heating and cooling thermal cabinets (-70°C to 300°C) used with liquid nitrogen for cooling.
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Product
Expansion Adapter Chassis
TB3-TO-CMC-LP
Chassis
The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
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Product
Current Loop Expansion Kit
OP-SB85C
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This expansion kit supports current loop communications.The kit incorporates a communications circuit with photo-coupler isolation and constant-current power supply of insulated type, thus realizing not only monitoring but also easy communications testing with passive or active current loop devices.
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Product
Field thermal needle system for thermal resistivity / conductivity measurement
FTN01
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Hukseflux Thermal Sensors B.V.
The FTN01 Field Thermal Needle System allows performing fast, on-site measurements of the thermal resistivity or conductivity of soils, in particular around the typical depth of burial of high voltage cables. FTN01 is designed with a focus on robustness and saving time, while still offering sufficient accuracy for typical field measurements. The sensor is a Non-Steady-State Probe (NSSP), TP09, which is mounted at the tip of the Lance LN01. The system is operated using a hand-held Control and Readout Unit CRU01.
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Product
PCIE Module For PCIe Bus Expansion
PCI113
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PCI113 is VadaTech second generation PCIe expansion module. The PCI113 is a high-speed 20Gbps bridge from the host PCIe bus to VadaTech’s carrier and Rear Transition Module (RTM) products such as the ATC104/114/118/117/119, ART114, μTCA chassis, etc. The different carriers host different I/O modules such as PMC/PrPMC, AMC, PCI-X and PCIe edge modules. This concept allows any of the available I/O modules in these standard form factors to be integrated quickly and easily into an AdvancedTCA or μTCA subsystem. The PCI113 allows expansion among multiple μTCA chassis or expansion into other chassis that are not ATCA or μTCA based.The PCI113 is a single module PCIE based on the PCISIG specification. The PCI113 provides a PCIe x4 link infiber/copper via front panel QSFP. The dual front I/O allows expansion into two separate systems independently. The upstream port must not have spread spectrum PCIe clock enabled.
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Product
PMCspan PMC Expansion Board
PMCspan
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SMART Embedded Computing’s PMCspan allows users to customize and expand I/O options when coupled with a Smart SBC.
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Product
IR thermal imaging
JOHO260
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Wuhan JOHO Technology Co., Ltd
JOHO260 is an outstanding light-weight IR thermal imaging surveillance system for helicopter, UAV, vessel, vehicle and any carriers. It is equipped with a mid-wave IR thermal camera, laser range finder for 24 hours continuous detecting and tracking air, sea and ground target via manual or auto model, it provides detection images and target relative position to control terminal.
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Product
Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
