Common Core
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Product
Bench-top 12 Cores Or 24 Chanels MPO/MTP Insertion Loss & Return Loss Tester
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Anfkom International Co.,Limited
This test station do the auto-testing on 12 core(24 core) for insertion loss and return loss, highly efficient multi-core fiber insertion and return loss measurement and make high precision on the measurement result with OTDR mandrel free technical adopting.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
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The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Product
11th Gen. Intel® Core™ Processor-Based Fanless Open Frame Touch Panel PC
SP2-TGL Series
Panel PC
- 11th Gen. Intel® Core™ Processor- 10.1"/15.6"/21.5" PCAP touch screen- Wide input voltage range 9-36V DC- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Enhanced protection in case of sudden power outage with back-up battery (Optional)- Pre-compliance EMC testing and high ESD tolerance
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Product
802.1 Core Test Software
IOL vIOLett®
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The same tool used for testing everyday in the UNH-IOL Ethernet Switching Protocols (ESP) Testing Services is now available to use in your own labs. See the below list of available testing packages. Each test package contains a complete set of tests for use with IOL vIOLett® Software, which is included with any test package license.
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™ I7/i5/i3 Processors, Up To 4NMC Slots
FWA-4030
Network Appliance
Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™ i7/ i5/ i3 Processors4 x DDR4 2133/2400MHz ECC (Xeon CPU only) UDIMMs, up to 64GB6x 1GbE RJ-45 w/ 2 pairs of LAN bypass, 4x 1GbE LAN of RJ-45 or SFP (optional)4 x Advantech network module expansions1 x PCIe x4 slot on rear, supports FH/HL add-on cards4 x 3.5" HDD bays (internal or external), 1 x CF slot, 1 x mSATA
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
Motherboard
IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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Product
Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
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*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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Product
Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81 And TPM 1.2
OPS883-H
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The OPS883-H OPS-compliant digital signage player is powered by the 4th generation Intel® Core™ i7/i5/i3 processor (codename: Haswell) with the Intel® H81 chipset. It has one 204-pin DDR3 SO-DIMM socket with maximum up to 8 GB. It offers stunning 4K Ultra High Definition (UHD) content via a HDMI port. The Intel® Core-based OPS883-H is ideal for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center and many more. This smart pluggable signage module is connected to OPS-compliant display via a standardized JAE TX-25 plug connector, and includes DisplayPort, UART, audio, USB 3.0 and USB 2.0 signals. To fill different application needs, the signage unit reserves a wide choice of I/O ports on front panel, including one USB 3.0 ports, two USB 2.0 ports, one COM port, audio (in/out) and a Gigabit Ethernet port. This slim-type OPS system has one internal PCI Express Mini Card slot to connect Wi-Fi or 3G/ LTE modules to satisfied users wireless needs. It features one easy-to-access 2.5” SATA HDD as storage device. Also, it supports TPM 1.2 feature which is designed to secure system.
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Product
Toroid Core Coil Turns Testers
SS107A
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The magnetic torrid ring core winding coil turns tester (SS107A) adopts the high speed center microprocessing unit circuits and precise measurement A/D circuits. This coil turns tester is used to count the coil turns of various torrid core winding coils. Like as: torrid core inductors, torrid core transformers, torrid core sensors, wate meter sensors, torrid current transformers, torrid core choke coils, etc. The tone tester is named magnetic ring core coil turn tester also.
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Product
Fanless Embedded System With Intel® Core™ I5-7300U/i3-7100U & Celeron® 3965U, 2 HDMI, 2 GbE LAN, 4 USB 3.0 And PCI Express Mini Card Slot
eBOX560-512-FL
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The eBOX560-512-FL is powered by the Intel® Core™ i5-7300U/i3-7100U or Celeron® 3965U processor. To enhance system efficiency, the embedded box PC supports one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. Two HDMI ports with up to 4K resolution are supported for dual independent display applications. The palm-sized fanless embedded system is dedicated to smart factory automation, thin clients, industrial controller system, digital signage and retail equipment. Axiomtek's eBOX560-512-FL was designed to operate reliably in industrial and embedded application environments. It is enclosed in IP40-rated heavy-duty aluminum extrusion and steel enclosure and offers a wide operating temperature range from -10°C ~ +50°C (+14°F ~ +122°F) and up to 3G vibration endurance.
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
Processor Blade
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
Panel PC
Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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Product
PXI 5A Power Multiplexer, 8-Bank, 5-Channel, Isolated Common
40-651A-014
Multiplexer Module
The 40-651A-014 is part of our range of high density power multiplexer modules is suitable for switching inductive/capacitive loads up to 5A at 250VAC. It is available in the following 1-pole multiplexer formats.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Intel® 8th & 9th Gen. Core™ I Mini-ITX Motherboard
PPC-MB-610
Motherboard
Supports Intel® 8th & 9th Gen Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports triple display of DP/VGA/LVDSSupports PCIe x16 (Gen 3), 1 M.2 M key & 1 M.2 E key, 6 x USB 3.1Supports 2 x SATA 3.0 (Raid 0, 1)Supports TPM 2.0 (optional)Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
Highly Scalable Gaming Platform Based on 10th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD
ADi-SA3X-CL
Gaming Platform
ADLINK‘s ADi-SA3X-CL all-in-one gaming platform features powerful processing and graphics performance for gaming and retail. Equipped with 10th Generation Intel® Core™ processors, the ADi-SA3X-CL provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® UHD Graphics 630/610 supporting up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA3X-CL fully satisfies the needs of your gaming application. The ADi-SA3X-CL is a true application-ready gaming platform providing OEMs with a highly flexible and reliable all-in-one system that offers unparalleled portfolio of services that help developers save time and pass compliance. The platform is designed to meet the GLI- 11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements.
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Product
Thin Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, HDMI, LVDS, VGA, USB 3.0, M.2 And Dual GbE LAN
MANO521
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The MANO521 is a thin mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake) with Intel® H310 chipset or optional Intel® Q370 chipset. This Intel® Coffee Lake-based motherboard provides rapid video acceleration advantage, multiple expansion interfaces and triple-view capability. It is designed with rich functionality, solid performance in a small footprint, making it suitable for a broad range of performance-driven embedded applications such as industrial automation, transportation, self-service kiosks, medical, and digital signage. The MANO521 features two high bandwidth 260-pin DDR4-2400/2666 with a memory capacity up to 32GB. It offers two SATA-600 sockets and one M.2 Key M 2242/2260/2280 connector for storage. The thin mini-ITX motherboard also provides various expansion interfaces within its limited dimensions including one PCIe x4, one full-size PCIe Mini Card slot and one M.2 Key E 2230, which offers diversity and flexibility for application integration. Moreover, the mini-ITX embedded board has a built-in DC Power Jack or ATX connector supporting 12V and 19 to 24V DC input with AT mode auto power function.
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Product
Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Product
Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
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The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
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Product
ATE Core Configurations
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ATE Core Configurations streamline the design, procurement, and deployment of automated test systems with highly integrated mechanical, power, and safety system infrastructure. These off-the-shelf systems reduce lead times and simplify standardization and global deployment. Lower your total cost of ownership for your test systems with ATE Core Configurations.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™ Processor, Intel® Q370, USB 3.1 Gen2, SATA 3.0, Dual LAN, VGA, DisplayPort++, DVI-D, And HDMI
IMB520R
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The IMB520R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® Q370 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It supports three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Product
1U Rackmount Network Appliance Platform With LGA1151 Socket Intel® Core™/Xeon® E-2100 Series Processor, Intel® C246/H310 And Up To 26 LANs
NA590
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*LGA1151 socket 8th gen Intel® Core™/Xeon® E-2100 series processor (Coffee Lake)*Four DDR4-2666 U-DIMM for up to 64GB of memory*Max. up to twenty-six 10/100/1000 Mbps Ethernet ports*Two expandable LAN modules supporting 1GbE/10GbE/25GbE/40GbE/Fiber/Copper/Bypass*Supports 1U redundant power supply for optional*Supports IPMI/TPM for optional*Suitable for network security, cloud computing and data centers applications
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Product
Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
