Common Core
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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4CH GigE Vision Compact Vision System with 6th Generation Intel® Core™ i7/i5/i3 Processors
EOS-1300
ADLINK’s EOS-1300 is a high performance compact vision system equipped with 6th Generation IntelR Core? i7/i5/i3 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s. EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Split Core Current Transformer
Beijing GFUVE Electronics Co.,Ltd.
Have a "split" in the core that allows the CTs to open and be placed around the conductor without having to disconnect the conductor or disrupt the wiring.
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LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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PICMG 1.3 Full-size CPU Card With LGA1151 7th/6th Gen Intel® Core™ Processor, Intel® Q170/H110, SATA3, USB 3.0, Dual LAN And DVI-I
SHB140
The SHB140 PICMG 1.3 single board computer is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 processors in the LGA1151 package with Intel® Q170 Express chipset (codename: Skylake). The high performance SHB-based CPU card comes with two DDR4 2133/2400 MHz up to 32GB and six SATA-600 ports with RAID 0/1/10/5. Combined high-bandwidth PCI Express for frame grabbing and conventional PCI expansion for motion capture, the SHB140 is an optimum solution for machine vision and automation applications. This high performance PICMG 1.3 slot CPU card also features an integrated Intel® AMT 11 and TPM 1.2 for higher security and easier maintenance.
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PICMG 1.3 Full-size CPU Card With LGA1151 8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150
The SHB150 is based on the latest LGA1151 socket 8th generation Intel® Core™ processors (code name: Coffee Lake) and Intel® C246, Q370 or H310 chipset. The SHB150 features multiple I/O options and high-speed transfer interfaces as well as superior graphics capability (Intel® HD Graphics), making it an ideal solution for smart factory automation. The Intel® Core™-based full-size SBC, SHB150, comes with two 288-pin DDR4-2666/2400 Long-DIMM sockets with up to 32GB of system memory. The PICMG 1.3 single board computer has a maximum of six SATA-600 ports supporting software RAID 0/1/5/10 for data redundancy. It also has one M.2 Key M 2280 SSD slot with a PCIe x4 interface. The SHB150 with the Intel® HD Graphics brings a true high definition visual experience with triple display configurations (Intel® C246 or Q370) via DVI-I and DisplayPort (header) ports. Moreover, the Intel® Coffee Lake-based SHB150 supports optional Trusted Platform Module (TPM) 2.0 for optimum security, Intel® Active Management Technology (Intel® AMT) 12 for remote management, as well as Intel® vPro™ technology. The industrial single board computer provides significant advantages to customers in the fields of machine vision and industrial automation operations
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Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, Dual DisplayPort++, HDMI, LVDS, USB 3.0, MSATA, M.2 And Dual GbE LAN
MANO520
The MANO520 is powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake), Intel® Pentium® Gold or Intel® Celeron® processor with the Intel® Q310 chipset (Intel® Q370 optional). The Intel® Coffee Lake-based MANO520 is specifically designed for performance-demanding applications with its excellent reliability as well as communication and real-time computing capabilities. The MANO520 supports two 260-pin DDR4-2666/2400 SO-DIMM sockets for up to 32GB of memory. Also, the mini-ITX motherboard features three SATA-600 connectors and one mSATA for additional storage. It is equipped with one full-size PCI Express Mini Card, one PCIe x16 and one M.2 Key E slots for wireless devices such as Wi-Fi, Bluetooth, and 3G/LTE. Moreover, the mini-ITX form factor single board computer features an ATX connector with AT mode auto power function.
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, HDMI/LVDS And LAN
PICO512
The PICO512 is designed to support the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U. Coming with one 260-pin DDR4-2133 SO-DIMM socket supporting system memory up to 16 GB, the Pico-ITX motherboard also features a PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors for an additional I/O board/signals. It supports a 4K visual experience with dual display outputs through HDMI and LVDS. Pico-ITX SBC can withstand a wide operating temperature range from -20°C to +70°C.
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Thermal Camera Cores
Tenum® 640
With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Core Alignment Fiber Fusion Splicer
SH-FS170H
Shenzhen Sharingtek Communication Co., LTD
●It adopts German technology with core alignment system and independent property rights.●The equipment takes advanced PAS technology not only can be used to FTTX also meet the requirements of trunk line with good properties of mini size four motor drive light weight fast speed.Features●Hardness - The body is made from titanium alloy and it has rubber protection function quakeproof waterproof dustproof .●Fast - 7s fast splicing 15s fast heating support continuous heating average efficiency improve 2-3times.●Long lifetime - 200 fiber splicing no memory effect lithium batteries the fiber cleaver has 24 blade longer lifetime.
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Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47H
The next level of industrial performance with the ADLINK IMB-C47H Value Series motherboards. These boards redefine what's possible in cost-effective industrial computing, combining dependable performance with an accessible price point.Ideal for a variety of industrial scenarios—from embedded automation to IoT integration—the IMB-C47H series stands out with its support for the latest high-performance processors, versatile I/O capabilities, and robust expansion potential. They provide a stable and scalable platform that accommodates the growing demands of industrial environments.
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Fanless Embedded System With LGA1150 Socket Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 2 HDMI/VGA/DisplayPort, 4 GbE LANs, 6 USB 3.0, Wide Range DC-in And PCIe Mini Card
eBOX670-883-FL
The eBOX670-883-FL supports the LGA1150 socket type for 4th generation Intel® Core™ i7/i5/i3 and Celeron® processors (formally codename: Haswell) with Intel® Q87 Express chipset. Under this rich support system, the eBOX670-883-FL allows wide operating temperature ranging from -40°C to +55°C for the most endurable operation. The outstanding embedded controller comes with four 10/100/1000 Ethernet ports, Jumbo Frame (9.5K), PXE Remote Boot, Teaming, and wake-on-LAN (WOL) function to highly enhance its network connection speed. Additionally, the eBOX670-883-FL supports up to three independent hi-resolution displays or a 4K display. Undoubtedly, this rugged fanless embedded computer is the best solution for any industrial field, including host computers, cloud computing servers, multimedia applications, and automation systems.
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Shortwave Infrared Camera Core
Tau® SWIR
FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Rugged IP67-rated Fanless Embedded System With Intel® Core™ I5-7300U & Celeron® 3965U, VGA, GbE LAN, 2 USB, 2 COM And 9 To 36 VDC
eBOX800-511-FL
The eBOX800-511-FL is a fanless embedded system with IP67-rated housing and M12 connectors for mission-critical environments. This rugged embedded system is powered by the onboard 7th generation Intel® CoreTM i5-7300U and Celeron® 3965U (formally codename: Kaby Lake) and comes with one 204-pin DDR4-2133 SO-DIMM slot with system memory up to 16GB. The eBOX800-511-FL is designed for enabling to function in harsh environments with power protection, a wide range operating temperature from -30°C to 60°C, operating shock tolerance up to 3G and 9-36V wide range DC input. Additionally, there are M12 lockable connectors and N-jack type waterproof antenna openings to meet the performance needs for outdoor critical applications such as facility condition monitoring. Furthermore, the fanless embedded box computer comes in great expansion possibilities, including flexible I/O connectors and two 2 PCI Express Mini Card slots. For enhanced platform security the eBOX800-511-FL provides Trusted Platform Module (TPM) 1.2 support.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Multifunctional Digital Design Core
PA72DIOS6016
The PA72DIOS6016 is a multifunctional digital design core. The FPGA allows for implementing many different custom applications. The connector has 64 Input/Output pins which can be assigned as TTL I/O or as differential inputs. 128 MByte of DDR2 memory is available to the FPGA, and an onboard EEPROM allows for storing values in non-volatile memory. The I/O bank voltage can be FPGA-selected between 2.5 and 3.3 Volt.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Single and Dual Core Digital Signal Processor
SI-C665xDSP
The SI-C665xDSP from Sheldon Instruments is a C programmable Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.
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TAP Adapter for Corelis JTAG Controllers
Low Voltage Adapter
High technology, energy efficient, and small form factor products push JTAG interfaces to the limits; low power and high performance means low voltage, high speed, and high drive requirements. Building specialized interface circuits on product Printed Circuit Boards (PCBs) is inconvenient and costly—an out-of-the-box, external solution is needed.The Corelis Low Voltage adapter is an add-on accessory that provides existing scan controllers with an active, plug-in interface to access low voltage scan chains, without sacrificing performance.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784966-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
