Aligners
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Laser Alignment
Laser beams are tracing a perfect straight propagating line. A special unique instrument was developed to monitor the direction and position of this laser beam, creating a cornerstone device for alignment. Typical applicationns are mechanical straightness and alignment, calibration articulated arms, accurate positioning, and many more. To facilitate unrestricted movement of the AlignMeter family a built-in wireless system was developed.
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½ ATR For Deployable Applications Aligned To SOSA™
ATR-3600S
ATR-3600S is an off-the-shelf half-ATR specifically designed for deployable applications requiring alignment with the SOSA Technical Standard. This six-slot chassis is mission-ready to accept SOSA aligned plug-in cards (PICs) and VITA 62 power supplies and is an ideal way to rapidly integrate a deployable platform leveraging the power of SOSA.
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Rugged Deployable CMFF Chassis Aligned To SOSA™ With SAVE Tray
ATRSAV07BRN1HVQE4
CMOSS Modular Form Factor (CMFF) field-deployable chassis, with a tray compliant with the Standard A-Kit Envelope (SAVE). Includes a 7 slot 3U VPX backplane, chassis manager, and VITA 62 plug-in power supply. it is aligned with the SOSA™ Technical Standard and designed for C5ISR, EW and EO/IR applications. Meets MIL-STDs for shock, vibration, and other environmental standards.
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Gross Alignment Funnel / Enhanced Latch Indicator (GAF/ELI)
A wet-mate connector system designed to optimize ROV mating efficiency, the Gross Alignment Funnel (GAF) can be used in conjunction with the Enhanced Latching Indicator (ELI) to overcome severe approach angles of ROV connectors during mating. In conditions with low visibility and heavy current, the system aids in aligning the mating halves and providing a clear visual indicator when a successful mate occurs. Easily installed on an existing Nautilus or Rolling Seal bulkhead mounted connector, the system reduces ROV operator variability, resulting in faster mating and demating operations.
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3U 5-slots 25Gb Backplane Aligned To SOSA. AFT And VITA 48.8 Ready
1SVX306APP-1X31
Designed in alignment SOSA, this 3U backplane offers 5 PIC (Plug in Card) slots supporting high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Core Alignment Fiber Fusion Splicer
SH-FS170H
Shenzhen Sharingtek Communication Co., LTD
●It adopts German technology with core alignment system and independent property rights.●The equipment takes advanced PAS technology not only can be used to FTTX also meet the requirements of trunk line with good properties of mini size four motor drive light weight fast speed.Features●Hardness - The body is made from titanium alloy and it has rubber protection function quakeproof waterproof dustproof .●Fast - 7s fast splicing 15s fast heating support continuous heating average efficiency improve 2-3times.●Long lifetime - 200 fiber splicing no memory effect lithium batteries the fiber cleaver has 24 blade longer lifetime.
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8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX
Model 5550
- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Bi-Directional Alignment Laser
LA-01MB-AK
These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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Laser Pulley Allignment System & Belt Pulley Alignment Tools
PRÜFTECHNIK Condition Monitoring GmbH
Correcting belt pulley alignment significantly extends machinery service life and lowers power consumption by decreasing wear and improving efficiency. While you can identify misalignment visually or with a straight edge, using a pulley alignment laser tool makes finding angular, vertical, and horizontal misalignment much faster and easier. Our laser belt alignment tools and pulley alignment tools are easy to use and can pay for themselves within only a couple of months.
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3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
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High-Speed System Sync and Distribution Amplifier - SOSA Aligned 3U VPX
Model 5503
- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- Synchronizes up to 32 channels across four Quartz boards- Synchronizes sampling and data acquisition for multichannel systems- Provides single sample accurate synchronization between multiple channels and multiple boards- Synchronizes gating and triggering functions- Optional VITA 67.3D optical interface for backplane gigabit serial communication
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RF Ports Alignment Software
With the R&S®RF Ports Alignment software together with the option R&S®SMW-K545, Rohde & Schwarz provides a standard and tailored solution for calibrating amplitude, time and phase of multi-channel SMW setups. The RF Port Alignment automatically collects the gathered correction data for the multi-channel setup using a connected vector network analyzer such as the R&S®ZNA or R&S®ZNB. Thanks to an intuitive graphical user interface the test engineer is guided through the calibration procedure step-by-step in a convenient way. With a calibrated multi-channel setup, tests of advanced systems in wireless communication or of radar receivers can be performed straightforward.
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3U VPX Rugged Processor Card, VPX3-TL Series, SOSA Aligned
20040262
The VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11865MRE Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
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Compact Alignment Scope
ALSCO
F. W. Breithaupt & Sohn GmbH & Co.KG
*Magnification 6x*Measuring range 0,3m to infinity*Optional: with adjustable reticule*Either for integration in spindle or revolver*Different reticule designs available*Customer specific modifications possible*Made in Germany
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8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SOSA Aligned 3U VPX
Model 5553
- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6003 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Type 39 CompacFrame Development Platform, 2 And 4 Slot 3U OpenVPX Aligned To SOSA
39S0xBWX9ZY2VCC0
Elma’s CompacFrame is the next generation portable test platform designed to accelerate development and test of plug-in cards (PICs) aligned to the Open Group® SOSA™ Technical Standard. Accommodates up to 4-slot OpenVPX backplane.
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SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
