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Product
System Level Test and Burn-in Solutions
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System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Product
ECM PCB Tester
MS 1105
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*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Product
Test & Test Development for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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Product
Device Testing
S-TEST Lab
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SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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Product
DRAM Module Test
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We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
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Product
Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
Distributed Test Manager
DTM
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The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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Product
SLT Socket
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Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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Product
Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
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High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Product
Asynchronous System Level Test Platform
Titan
Test Platform
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Product
Motion Simulator For Test Systems
Metis
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METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
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Product
Test System
BMS HIL
Test System
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Product
SoC Test Systems
Test System
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Product
Semiconductor Test Software
Test System
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Product
Memory Test System
T5833/T5833ES
Test System
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Product
Scienlab Battery Test System - Cell Level
SL1007A
Test System
The SL1007A Scienlab Battery Test System – Cell Level enables you to accurately and productively test battery cells for automotive and industrial applications. The bidirectional power supply charges and discharges your cells under test with very high efficiency.
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Product
Memory Test System
T5851/T5851ES
Test System
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Product
Display Driver Test System
T6391
Test System
High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Product
EMS Test System
TS9982
Test System
The R&S®TS9982 is the base system for conducted and radiated EMS measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for complete motor vehicles with 200 V/m.
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Product
NI Vehicle Radar Test System
Test System
VRTS provides automated radar measurement and obstacle simulation capabilities for 76 to 81 GHz automotive radar systems. With VRTS, you can perform precision RF measurements and simulate a wide range of test scenarios for radar hardware and software subsystems, including sensors, advanced driver assistance systems (ADAS), and embedded software. Use VRTS for all phases, from design to manufacturing, of ADAS and radar system test.
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Product
Safety Compliance Test System
EN 60601
Test System
Test system for electrical safety compliance testing of medical products in accordance with EN 60601-1, 3rd edition.The system is equipped with three test fixtures which are connected in parallel order to reduce the number of setup tasks for different variants in the course of day-to-day manufacturing processes. Its purpose is to test medical products, e. g. patient monitors, which are employed at hospitals to monitor heartbeat and oxygen saturation.Based on the integrated electrical safety tester by Associated Research, in combination with an AC power source and a switching matrix, it is possible to fully automate tests like for instance AC/DC high-voltage tests, insulation resistance measurements, earth connection tests and leakage current measurements.The required occupational safety is provided by a high-voltage safety hood in accordance with EN 501191. The entire safety technology, as well as the control PC, is mounted in an aluminum-profile cart.
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Product
VLSI Test System
3380D
Test System
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Product
Memory Test System
T5511
Test System
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Product
RSE Wireless EMC Spurious Emission
TS8996
Test System
The R&S®TS8996 RSE test system is designed for EMI and radiated spurious emission testing on wireless devices in semi-anechoic or fully anechoic chambers. The modular design makes it easy to extend the system to include new communications technologies. Typical devices under test include mobile phones or radio sets along with radiated measurements of other short-range devices. Standards require a wide range of test setups and a wide and high frequency range (up to 40 GHz). ESW or FSW frequency ranges are extended up to 325 GHz with option B21 using receive units TC-RSE for 5G FR2. Dedicated RSE test routines are also covered for this frequency range.
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Product
Bluetooth RF Test System
FRVS
Test System
FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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Product
LitePoint RF Test System
J750
Test System
The option of adding LitePoint instrumentation to the J750 system delivers a cost-effective, complete production test solution covering global wireless connectivity standards.
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Product
Test System
UltraFLEX
Test System
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
