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System Level Test and Burn-in Solutions
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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System Level Test
SLT
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Asynchronous System Level Test Platform
Titan
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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ECM PCB Tester
MS 1105
*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Motion Simulator For Test Systems
Metis
METIS is a motion simulator for sensor and end system level testing. Configurable design allows you to create system you need! - 1-axis rate table for gyro testing - 2-axis unit for 6DOF accelerometer and gyroscope testing - 3-axis Gimbal system for simultaneus Yaw, Pitch and Roll stimulus.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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SLT Socket
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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Device Testing
S-TEST Lab
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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Compact Antenna Test Range
700.00 MHZ – 110000.00 MHZ
A Compact Antenna Test Range (CATR) allows electrically large antennas to be measured at a significantly shorter distance than would be necessary in a traditional far-field test range. Compact ranges use a source antenna (feed) to radiate a spherical wave in the direction of a parabolic reflector, collimating it into a planar wave for aperture illumination of a Device under Test (DUT). It's lowest operational frequency is determined by the size of the reflector, its edge treatment and the absorbers. The two edge treatments available are serrated edge for general purpose applications, and rolled edge to achieve higher accuracy for special applications. Multiple-feed systems may be used to improve the far-field characteristics. A compact range test system also allows system level testing of a complete device architecture.
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DRAM Module Test
We provide our customers with Automated SLT (System Level Test) Solutions for DRAM Module HVM test. Our solution gives our customers the best possible combination of technologies for the best performances and manufacturing effiencies - increasing yield, reducing cost of ownership and accelerating time-to-market.
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Distributed Test Manager
DTM
The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Test & Test Development for Circuit Card Assembly
Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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VLSI Test Systems
50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Communications Test System for Frontline Diagnostics
ATS3000P
The ATS3000P is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000P also includes the sophisticated IF and baseband I/Q DigitalSignal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easyto-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets are available for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Automatic Test System
Automatic Test system is the ultimate solution for power electronic testing. The system includes a wide range of hardware choice such as AC/DC Sources, Electronic Loads, DMM, Oscillate Scope, Noise Analyzer and Short /OVP Tester. This flexibility combined with its open architecture software platform-PowerPro III, gives users a flexible, powerful and cost effective test system for almost all types of power supply testing.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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VLSI Test System
3380P
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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BMS Manufacturing Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Test System
BMS HIL
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Configurable Functional Test System
ATS-5000
Maximize the uptime of your most critical electronics with the ATS-5000 Functional Test System from Astronics Test Systems. Deployed globally for more than 20 years, the newest version of this tester provides a configurable, affordable solution that delivers just enough test.
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SoC Test Systems
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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VXI Digital Multiplier
4152A
The 4152A’s advanced features like limit testing, averaging, speed/resolution trade-offs, and fast function changes provide the high “test system” throughput required in today’s production test environments.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Regenerative Battery Pack Test System
17020
Chroma's 17020 is a high precision system specifically designed for secondary battery modules and pack tests. Accurate sources and measurements ensure the test quality that is suitable to perform repetitive and reliable tests that are crucial for battery modules / packs, for both incoming or outgoing inspections as well as capacity, performance, production and qualification testing. Chroma's 17020 system architecture offers regenerative discharge designed to recycle the electric energy sourced by the battery module ei ther back to the channel s in the sys tem performing a charging function or to the utility mains in the most energy efficient manner. This feature saves electricity, reduces the facilities thermal foot print and provides a green solution by reducing the environmental impact on our planet. Chroma's 17020 system is equipped with multiple independent channels to support dedicated charge / discharge tests, on multiple battery modules / packs, each with discrete test characteristics. The channels can easily be paralleled to support higher current requirements. This feature provides the ultimate flexibility between high channel count and high current testing.
