Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Product
Thermal Controlled Chucks & Plates
TOP Cool
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Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Thermal Chuck Systems
L-Series
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Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Chamber/Pyroelectric Task
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Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Product
Vacuum Chuck Temperature Controlled Test Stations
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These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Product
Thermal Chuck Systems
A-Series
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Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Product
Semi-Automatic Probe Station
P300A
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The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Product
On-Wafer Measurements
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Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Product
Drill Chuck Grips
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Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Product
Thermal Stress
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Specialized environmental testing devices that rapidly cycle products between extreme hot and cold temperatures to simulate harsh real-world conditions.
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Product
Thermal Imaging
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Omega's thermal imaging products are designed for non-contact temperature measurement with the unique feature to see temperature gradients. Some can capture images and measure multiple spots.
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Product
Thermal Desorption
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Scientific Instrument Services, Inc.
The SIS Short Path Thermal Desorption units sit directly on top of a GC injection port to provide for the direct desorption of both volatile and semi-volatile samples into the GC injection port and column. Due to the "short path" of sample flow, these new systems overcome the shortcomings of previous desorption systems by eliminating transfer lines, which are easily contaminated by samples, and by providing for the optimum delivery of samples to the GC injector via the shortest path possible--the direct, syringe-like injection into the GC.
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Product
Thermal Transport
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The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Product
Thermal Printer
DP-581H
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It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)
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Product
Thermal Shroud
BC8-55/150C
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When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Fluids And Thermal
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Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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Thermal Cameras
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Excelitas designs and manufactures a range of medium and long range thermal cameras covering the MWIR and LWIR wavebands. All cameras utilize the latest sensor technologies and benefit from our proven pedigree in designing and manufacturing high performance optical modules and cameras for demanding surveillance, targeting, naval and C-UAS applications.
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Product
Thermal Security Camera
Elara™ FC-Series O
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The Elara™ FC-Series O thermal security camera is one of FLIR’s premium thermal security cameras for perimeter protection. The Elara FC-Series O integrates with external video analytics devices, such as FLIR’s TRK or third party solutions, to classify human or vehicular intrusions. The Elara FC-Series O also offers a wide range of high-performance lenses, with a choice of resolutions, offering greater flexibility for tailoring security systems to specific site conditions.
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Professional Thermal Camera
FLIR T530
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The FLIR T530 has the features professionals need to accurately troubleshoot hot spots and potential faults. With the 180° rotating lens platform and a bright 4" LCD, the FLIR T530 is engineered to help users diagnose hard-to-reach components in any environment. Advanced on-camera measurement tools, laser-assisted autofocus, and FLIR’s industry-leading image quality ensure you’ll find and diagnose problems quickly. With on-board Inspection Route mode, you can download and run survey plans to your camera from FLIR Thermal Studio Pro (with Route Creator plugin). Together these systems will help you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The purchase of a T530 camera includes a 3-month subscription to FLIR Thermal Studio Pro and FLIR Route Creator.
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Thermal Shock Chamber
ETS-Series
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air-to-air and liquid-to-liquid Thermal Shock Chambers from Envisys are available in different volumes to suit the varied testing needs. Horizontal or vertical models consisting of cold and hot zones with product carrier basket of sizes 50, 100, 150, 300, 600 and 900 litres which transfers the specimen under test between cold and hot zones using electro pneumatic / motorized basket movement.
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Thermal Cameras
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Megger's thermal cameras are professional and easy-to-use, and provide fast accurate readings.
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Thermal Desorption Systems
TD-30 Series
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The TD-30 was developed as the optimal solution for gas and materials analysis. Its outstanding processing ability and excellent expandability provide strong support for all types of analysis, from work in research departments to quality control.
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Thermal Imager
testo 865
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The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal Shock Chamber
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The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Product
Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Thermal Image Plates
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No longer are the firebricks and smoldering paper "tools of the trade" for researchers working with CO2 lasers. Now it''s possible to see IR laser beams in real time and with high resolution using a Thermal Image Plate from Macken Instruments. The characteristics of this instrument enable it to solve a wide range of problems. For example:
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Product
Thermal Control and Monitoring
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Harmonize and control your entire data center thermal management system to achieve up to 50% higher efficiency, improve protection and security and enhance staff productivity.
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Fixed-Mount Thermal Camera
FLIR A50/A70 Smart Sensor
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FLIR A50 and A70 smart sensor cameras are ideal for users who want built-in, on-camera analytics and alarm capabilities for condition monitoring and early fire detection applications. With options for Wi-Fi, an integrated visual camera, and ONVIF S compatibility, FLIR A50/A70 cameras are a flexible, configurable solution to meet the unique needs of automation customers across a broad range of industries. When used as a system component for cloud and Industrial Internet of Things (IIoT) solutions, A50/A70 cameras can help companies protect assets, improve safety, maximize uptime, and minimize maintenance costs.
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Product
Thermal Shock Chambers
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We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
