Discrete Semiconductor
semiconductor typically having one circuit.
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Semiconductor Switching Systems
Keithley 700 Series
The high speeds and low currents of semiconductor devices demand high quality, high performance switching of I-V and C-V signals. We offer switching solutions for both semiconductor R&D and production test applications with mainframes that can support up to 2,880 channels and a family of matrix cards designed specifically for semiconductor applications.
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Receiver, 9050, 50 Module, Dual Discrete Wiring Tiers
310104368
The 50 Module Receiver is a rugged system devised to accommodate high I/O. With high contact point availability, the 50 Module Receiver is suited for larger test and measurement systems. Both tiers are designed for discrete wiring, and can accommodate individual 9025 ITAs.
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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3U OpenVPX Multichannel Discrete I/O Board
68DT1
The 68DT1 is a 3U OpenVPX™ board featuring up to 96-Channels of Standard Functionality (SF) DT1 module-type or Enhanced Functionality (EF) DT4 module-type Discrete I/O functions [foptioned, factory configurable].48-Channels are dedicated as input (voltage or contact sensing with programmable, pull-up/pull-down current sources). An additional 24 or 48-Channels are programmable for either input or output (current source, sink, or push-pull) switching up to 500 mA per channel from an applied 3 – 60 V external VCC source (or sink to ISO-GND). The 68DT1 can sense broken input connections and whether an input is shorted to +VCC or to ground. Additional features of the DT4 EF are listed below. The 68DT1 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for pull-up resistors or mechanical jumpers.
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300 Mm Semiconductor Processes
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Semiconductor Test
Ismeca NY20
20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as Intelligent Features that enable extended autonomous operation and productivity.
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Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Semiconductor Electrical Test
We conduct electric property test (final test) of the completed (packaged) LSI products. We will support testing of analog devices, logic devices, other electronic parts, modules, application products and so on. We will test according to customer's specification regardless of evaluation, trial production, mass production, by know-how cultivated with long-time mass production results. Test initial examination ~ From consistent correspondence up to selection and evaluation, individual correspondence such as design only is accepted.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Semiconductor Device Parameter Analyzer and Measurement Modules
B1500A Series
Keysight B1500A Semiconductor Device Analyzer of Precision Current-Voltage Analyzer Series is an all in one analyzer supporting IV, CV, pulse/dynamic IV and more, which is designed for all-round characterization from basic to cutting-edge applications. It provides a wide range of measurement capabilities to cover the electrical characterization and evaluation of devices, materials, semiconductors, active/passive components, or virtually any other type of electronic device with uncompromised measurement reliability and efficiency. In addition, the B1500A’s modular architecture with ten available slots allows you to add or upgrade measurement modules if your measurement needs change over time.
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Discrete C-Size Switch Cards
Compatible for use on VXI platforms, these switch products were formerly sold under the Racal Instruments brand name.
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Receiver, 9050, 50 Module, Dual Discrete Wiring Tiers, EMI Gasket
310104429
The 9050, 50-module receiver is rugged and designed to accommodate high I/O and suited for larger test and measurement systems. Both tiers are designed for discrete wiring and can accommodate individual 9025 ITAs. This 9050 also offers a gasket for EMI applications.
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Slot 0 Module Retainer Block Set, For Discrete Wiring, 1 Position
510109150
These module retainer blocks are used to attach modules directly to the inner frame of a VXI receiver for discrete wiring. These modules then hinge down with the receiver to provide easy access to wiring.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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32-CH Discrete Input Modules
HSL-DI32-M-N/HSL-DI32-M-P
- Slave ID consumption: 2 consecutive from odd- "N" type for NPN sinking type sensor or dry contact; "P" type for PNP sourcing type sensor or wet contact- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ± 10 mA (Max), ± 12.5 mA (Peak)- Input voltage: ± 40 V (Max)- LED indicator: Power, Link and Input status- Power supply: +10 V to +30 VDC
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Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
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24 Ch , Discrete I/O (0 to 60 VDC, 500 mA/Ch.)
DT1
The DT1 module features 24 programmable channels for either input (voltage or contact sensing with programmable, on-module pull-up/pull down current sources), or output (current source, sink, or push-pull) up to 500 mA per channel from an applied, external 3 – 60 VCC source. These modules can sense broken input connections and whether an input is shorted to +VCC or to ground.
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Signal, Module, Receiver, CASS, 210 Position, Discrete Wiring
510113125
Module, Receiver, Cass, Signal, 210 Position, Discrete Wiring
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DISCRETE TMTC INTERFACE BOX
The Discrete TM/TC Box is a 6U custom 19’’ rack equipment that could be filled with 6U, 4HP plug-ins covering the main ECSS compliant discrete I /Fs. The I/O signals of this box are all arranged in the rear side of the box, keeping clear the front side: in this way no accidental operation could be performed on the box.
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Protective Cover, 9050, VXI and Discrete Wiring, ITA
410112582
When storing the ITA, the cover snaps on to protect the modules and contacts. The body of the cover is clear chromated aluminum and the mounting blocks are made of Delrin.
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Semiconductor ATE Systems
Our testers allow for the high-volume production of electronics that touch people’s lives in communication, safety, entertainment, and much more.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Semiconductor
The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Semiconductor Testing
Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Compound Semiconductor
Scientific Computing International
Semiconductors that are made from two or more elements.
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Smartchem Discrete Analyzers
Fully automated, multi-parameter, direct read discrete analyzers, available in bench-top or floor-stand models, for simple and automated chemistries. Up to 200 samples and up to 600 tests/hour.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Semi-automatic Semiconductor Probe Assembly Equipment
The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.





























