Burn-In
The application of current, typically at high temperatures, over periods of time to detect infant mortality.
See Also: Burn-In Boards, High Power Burn-in, Burn-In Sockets, PCB Inspection
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Burn-in Systems
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Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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Burn-In Tester
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Universal test bench system. Provides basic electrical measurements at a low cost. Designed for a wide range of electronic products with a dedicated wiring harness. Allows you to expand the scope of functionality. Work in automatic or manual mode. Tailored to the needs of low- and high-volume production
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Burn-in Environmental Test Chamber
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Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's High Temperature Aging Chamber is widely applied for automotive parts ,electronic and electric products ,components and materials by constant high temperature reliability test.
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High Power Burn-In Test
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Easily test the reliability of your high power laser devices with the Y2000H burn-in and life-test system. It will quickly identify defective laser devices so you can prevent them reaching your customers. Y2000H's full automation and expandable capacity helps you work through your tests more productively. And its user-friendly software makes testing your devices easier than ever.
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Burn-In Test
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Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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RF Bias Burn-In System
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These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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Product
Photodiode Burn-in Reliability Test System
58606
Test System
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Burn-In Boards
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Manufacture of burn-in boards since 1976. Established for more than 40 years in the market, Trio-Tech is recognized and is an approved global supplier to all major semiconductor companies. Trio-Tech has the capability to design and manufacture boards for all system types, with solutions available for many test conditions, Including HTOL, PTC, HAST and 85/85.
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Burn-in or Rapid Temperature Cycling Chamber
KDL Series
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The Bemco KDL series is designed for production testing of electronic circuit boards and completed electronic systems. They accept Bemco KDLC Carts that have a working area of 42 wide by 60 high by 48 deep suspended on insulated runners and casters 11 inches above the test area floor.
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Memory Burn-In Test
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The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Low Voltage Burn-in and Test System
Max 450
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For burning-in and testing DUTs such as microprocessors, DSPs and logic devices, which require low voltage. Output monitoring gives functional test results for every device during burn-in
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Product
Power Tube Burn-in Station
Maxi-Burn
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The MaxiBurn Tube Preheater is a 2U rack mountable or bench top unit for heating 30 Octal Base Tubes. Designed for continuous use heating standard power pentodes to normalize their characteristics before testing or matching the MaxiBurn powers the tube filaments and drives a nominal plate current through each tube. Normal function of each tube is indicated by a glowing LED associated with the tube.
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Burn-In System
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The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Product
Laser Diode Burn-in Reliability Test System
58604
Test System
The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Advanced Burn-in and Test System for packaged parts
ABTS-Li
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High power logic individual temperature control
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Laser Diode Reliability Burn-In / Life-Test System
58602
Test System
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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Electric Burn-in Board Carts
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Conforms to SEMI ergonomic standards Holds and transports card cages for semi-automatic loading/unloading. Holds up to 10 burn-in boards. Raises and lowers the burn-in boards for easy loading/unloading of boards into ovens or onto test benches. Cart can be adapted to dock with any Micro Control oven.
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Laser Diode Burn-In Testing
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Laser reliability testing consists of a series of tests that laser diodes can be put under in order to ensure their reliability for post-production use. There are different types of tests that can be carried out and there are multiple measurements that can be taken in order to evaluate the reliability of the device. One of these tests is laser diode burn-in.
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Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Polarity & Burn in Test Systems
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Our polarity and burn-in test systems are available for components such as multilayer, disc type or hollow ceramics.
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System Level Test and Burn-in Solutions
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System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Multi-Wafer Test & Burn-in System
FOX-XP
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The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
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300mm Single Touchdown Burn-in and Test System
FOX-15
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Up to 15 wafers at a time Known Good Die solution Lowers production cost
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Memory Burn-in Tester
B6700 Series
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B6700 can test as many as 48 burn-in boards in parallel at speeds up to 10 MHz, which helps memory suppliers get their newest products to market faster while also reducing testing costs. An original high performance chamber improves yield by assuring high temperature accuracy while generating high temperature. It also shortens the temperature rise and fall time which leads to shortening the test time.
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Accelerated Life Test Systems
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Test systems for accelerated life testing and product burn-in utilize Intepro’s electronic loads that are ideal where high power bulk loading is required. Characterization applications within Telecommunication and Aerospace sectors benefit from Intepro’s environmental stress screening (ESS)/Burn-in solutions
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Power-Switching Test System
High Voltage Switching Test System
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The Accel-RF Power-Switching Test System is capable of measuring reliability under a variety of conditions for switching power applications up to 1kV (off) and 25A (on) at rates up to 1MHz switching frequency, dependent on voltage. By leveraging technology developed for the RF burn-in tray platform with new fast switching measurement techniques, this system can support testing of multiple devices under elevated temperature stimulus in a small physical area, and offers the flexibility to test both soft- and hard-switching applications. The Accel-RF Power-Switching System is the most flexible and accurate power switching platform available.
