Product

CDNs

AF Series

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Com-Power Corporation

AF Series - Com-Power Corporation

The AF series CDNs are for unshielded cables with two, four and eight conductors carrying low current. AF series CDNs are supplied 2 mm shrouded banana sockets

Product

Spectroscopic Reflectometer

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Nano-View Co. Ltd.

Nano-View Co. Ltd.

– Antireflective coating (ARC) on textured (poly-) crystalline silicon solar cellMeasurement– Thickness, Reflectivity, n&kWavelength– 420 – 950 nm (1.3-3.0 eV) : expandableAccuracy (thickness measurement on specular sample)– 104.5 nm for 104.8 nm SiO₂on c-Si* Accuracy can be dependent on the quality of filmThickness range– 10 nm ~ 20 mm (depend on sample)Data acquisition time– < 1 sBeam spot size– ~ 50 mmFocusing of beam– Manual (optional auto-focus)Sample stage– Manual X-Y stage (specify sample size and travel distance)(optional automatic X-Y stage for mapping)

Product

NON CONDUCT INFRARED THERMOMETER

IBL-MT4

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International Biological Laboratories

IBL-MT4 - International Biological Laboratories

This Digital Non Contact type Infra Red Thermometer with laser sensor uses temperature sensor of Thermopile 6 - 14 mm and measures temperature from -50 to 280 Degree C and also in Fahrenheit scale.

Product

Digital Accelerometer

ZET 7152-N-VER.1

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ZETLAB Company

ZET 7152-N-VER.1 - ZETLAB Company

Digital accelerometer ZET 7152-N-VER.1 has a compact triaxial sensing element; it is purposed to measure linear acceleration and vibration acceleration variable component in three mutually perpendicular planes. Light weight of sensing element (only 1.5 g) considerably decreases  self-mass load effect, and compact dimensions (8.5×8.5×8.5 mm) allow using ZET 7152-N-VER.1 digital accelerometer to measure vibration in small work-area systems.

Product

MPI Automated Probe Systems

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MPI Advanced Semiconductor Test

MPI Advanced Semiconductor Test

MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.

Product

Thermal Warpage Metrology Tool

AXP 2.0

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Akrometrix, llc

AXP 2.0 - Akrometrix, llc

The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.

Product

Ultra High 1.77 (50.00) - 10.00 (283.00) High Performance Lead Free Probe

LFRE-25Z-10

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ECT

LFRE-25Z-10 - ECT

Current Rating (Amps): 8Average Probe Resistance (mOhm): 8Test Center (mil): 100Test Center (mm): 2.54Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02

Product

Integrated Potentiostat and Multiplexer

EmStatMUX8

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PalmSens BV

EmStatMUX8 - PalmSens BV

Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode. The MUX16 is suitable for sensor arrays or chips with sixteen working electrodes all sharing a RE and/or a CE. Both instruments are suitable for laminated layer corrosion analysis.The potentiostat is controlled and powered by USB and is used with PSTrace allowing for simultaneous sampling of each channel at a rate of 25 ms/channel. Standard packaging includes a shielded cable with connections for a working, a counter and a reference electrode by means of 2 mm banana connectors and mini-crocodile clips, a stripped end, Dsub-37 terminated flat cable and a USB cable. To make connections to chips simpler the Connection Terminal is an optional extra providing clearly marked screw terminals to the electrodes and can be directly joined to the ESMUX via their D-Sub connectors.

Product

Manual Test Solution

Titan

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PurePulse ESD

Titan - PurePulse ESD

Titan is an easy to use, low cost Human Body Model (HBM) or Machine Model (MM) manual test solution. It can be used for design, engineering, and characterization of your devices. Ranging from 50 V to 16,000 V the Titan will have the largest voltage range of any HBM tester.

Product

Coupled Multielectrode Array Sensor (CMAS) Probes

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Corr Instruments, llc

Corr Instruments, llc

CMAS probes are made from user-specified sensing materials, including carbon steels, stainless steels, and nickel-, aluminum-, and copper-based alloys. They can also be made from customer supplied materials that have the same microstructure/heat treatment as the system component materials to be monitored. The size of the sensing electrode varies from 0.1 to 3 mm (0.004" to 0.12") in diameter, depending on the application. Typical numbers of electrodes in a CMAS probe are 9, 16 or 25 for online corrosion monitoring and vary from 8 to 100 for laboratory corrosion and electrochemical studies.

Product

iD-Box 16 | 300 x 120 x 310 mm Enclosure

16-10003-03

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ELMA Electronic, Inc.

16-10003-03 - ELMA Electronic, Inc.

A versatile enclosure for high-quality electronic components. Since it is independent of standards, the iD-Box 16 can be designed according to the individual needs of the end customer and adapts in size to the application.

Product

COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor

CEM312

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Axiomtek Co., Ltd.

CEM312 - Axiomtek Co., Ltd.

The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.

Product

Valve Position Sensors

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ifm efector, inc.

ifm efector, inc.

*Dual inductive sensor for pneumatic actuators and valves*Designed for simple fit to common actuators based on VDI / VDE 3845*Quick and easy installation of the AS-i dual sensor*Position feedback for rising stem valves with up to 80 mm stroke*Reliable permanent valve monitoring

Product

2U Compact Rackmount Chassis

AX61222TB/AX61220TB

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Axiomtek Co., Ltd.

AX61222TB/AX61220TB - Axiomtek Co., Ltd.

*2U rackmount design in depth of 450 mm (AX61222TB)/475 mm (AX61220TB)*PICMG SBC structure with 5 free slots for expansion*Front-accessible one 5.25" HDD drive bay, one slim-line*CD-ROM, one 3.5" HDD drive bay and one internal HDD drive bay

Product

5TB -strong-motion

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Güralp Systems Ltd

Güralp Systems Ltd

The 5TB houses an accelerometer that is designed for strong-motion borehole studies. in cased holes with diameters of 99 to 203 mm.

Product

IR Sensor

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JonDeTech

JonDeTech

The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.