System-on Chip
A complete computer "System on a Chip".
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Product
Precision Shunt Chip Resistors
SMV
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*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Product
32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
25μm Circular Quartz Interdigitated Electrode Chip
CIQ1
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Circular quartz IDE chip with a 25μm gap for gas sensing, humidity monitoring, biosensing, and electrochemical research.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L8GE16-SG
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DDR3-1600 ECC, 240-Pin, 512MX8, Samsung Chip.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L8GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8,Samsung Chip,
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Product
Chip Inductors
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Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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Product
20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
10μm Quartz Interdigitated Electrode Chip
BAP1
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Transparent quartz IDE chip with a 10μm gap for gas sensing, biosensing, and photoelectric applications.
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Product
5μm Transparent Quartz Interdigitated Electrode Chip
TIF1
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5μm transparent quartz IDE chip designed for MEMS, biosensing, gas sensing, electrochemical, and photoelectric applications.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L4GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8, Samsung Chip.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V32GR48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
90μm Ceramic Interdigitated Electrode Chip
CIC1
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Ceramic IDE chip with a 90μm gap designed for gas sensing, humidity monitoring, biosensor development, and capacitive sensing.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
200μm Flexible PET Interdigitated Electrode Chip
FPL1
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200μm flexible PET IDE chip designed for biosensing, gas sensing, and humidity monitoring applications.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L8GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
50μm Transparent Quartz Interdigitated Electrode Chip
IEQ1
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50μm transparent quartz IDE chip designed for gas sensing, biosensing, MEMS, and photoelectric applications.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
Chip Test Adapter
RAMCHECK Sync
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The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Product
High Temperature Chip Resistors
ERJ-Hxx Series
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Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Product
16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
25G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
25G DFB Laser Diode Chips by GLSN
