System-on Chip
A complete computer "System on a Chip".
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
4μm Transparent Quartz Interdigitated Electrode Chip
TIA1
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4μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
20μm Transparent Quartz Interdigitated Electrode Chip
TIG1
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20μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, electrochemical, and photoelectric applications.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L4GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
50μm Ceramic Interdigitated Electrode Chip
CIE1
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50μm ceramic interdigitated electrode chip for biosensing, gas sensing, humidity monitoring, and capacitive sensor research.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Product
Chip Scale TVS Arrays
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ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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Product
Metal Foil Low Resistance Chip Resistor
MFF
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*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
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Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
5μm Transparent Quartz Interdigitated Electrode Chip
TIM1
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5μm transparent quartz IDE chip designed for MEMS, gas sensing, bioelectrochemical, and photoelectric applications.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
100μm Flexible PI Interdigitated Electrode Chip
FIC1
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100μm flexible polyimide (PI) interdigitated electrode chip for gas sensing, biosensing, humidity monitoring, and electrochemical research.
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Product
32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
