BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Product
VLSI Test Systems
Test System
50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Product
Test Socket Lids
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For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
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Product
EV Power Components End of Line Test Platform
Test Platform
Test and Validate all EV Power Electronics with One Flexible and Scalable Solution
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Product
ARINC-429 Module
M4K429RTx
Test Module
The M4K429RTx is an ARINC-429 multi-channel test and simulation module to be used on the Excalibur 4000 family of carrier boards. The module supports up to ten ARINC-429 channels in any combination of transmitters and receivers. Each of these channels feature error injection and detection capabilities. The receive channels allow for the storage of all selected Labels with status and time tag information appended to each word.
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Functional Test
xUTS
Functional Test
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Product
Asynchronous System Level Test Platform
Titan
Test Platform
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Product
BGA Socket Adapter Systems
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Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Interactive Benchtop Test
test
Strict time-to-market deadlines make it vital to efficiently debug and validate product designs. Virtual instrumentation provides a unified interface that gives engineers an advantage over traditional box instruments.
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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At-Speed Non-Intrusive Functional Testing
ScanExpress JET
Functional Test
Functional circuit board testing presents many challenges that are often costly and time consuming. Most functional tests need to be customized for each design, limiting reusability. This results in software engineers vying for time between development code and test code. Even when functional tests become available, the diagnostic details are often inadequate to give clear visibility on a given problem.ScanExpress JET is a tool designed to overcome these challenges by automating the functional test generation process on CPU–based IEEE-1149.1 compliant circuit boards. Coined JTAG Embedded Test, JET is the preferred method for at-speed, non-intrusive functional testing.
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Product
Fixturing Kit
10744A
Test Fixture
The Keysight 10744A fixturing kit includes mounting hardware for a variety of Keysight measurement optics devices. A large base, multiple posts, and other accessories let you build structures -- such as tall, rigid towers -- that place optics in the center of a machine's work zone or wherever needed. The fixturing kit helps meet the physical requirements of a range of measurement applications.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
Flying Prober Test System
QTOUCH1404C
Test System
Qmax Test Technologies Pvt. Ltd.
The Prober Test System is capable of movement in XYZ directions with fixed angle (θ) and dual probe heads (further expandable up to 4 ) . The system has in-built high resolution Vision Camera for easy monitoring of probe needle contact. The prober supports automatic fiduciary recognition. The system has built –in linear encoders to achieve higher precision.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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NI Real-Time Test Cell Reference System
778820-35
test
DIAdem Advanced with DAC Bundle, Perpetual License, Include 1 Year SSP
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Product
CATR Benchtop Antenna Test System
ATS800B
Test System
Very compact far-field over-the-air (OTA) test system based on compact antenna test range (CATR) technologyUnrivaled quiet zone size within 0.8 m2 footprintState-of-the-art reflector ensuring a high quiet zone accuracyUnique benchtop CATR system supporting over 50 GHzIndirect far-field method (approved by 3GPP for 5G OTA testing)
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Product
VLSI Test System
3380P
Test System
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Design for Testability (DFT Test)
test
Corelis can provide you with design consultation and an analysis of your design for boundary-scan testability. We will review your design and make specific recommendations that if implemented will improve the testability. We can also suggest improvements that will increase test coverage and allow boundary-scan to be implemented in a more cost-effective manner.This service also includes a DFT test coverage analysis that we recommend to do after schematic capture and before PCB layout. At this stage of product development, Corelis provides you with a comprehensive test coverage reports that identifies all of the boundary-scan nets and pins and classifies them as completely tested, partially tested, or not tested. The report also recommends where to add test points (pads) for physical “nails” access if additional test coverage is required.
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BGA Rework Station
PDR IR-E3 Evolution
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The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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Optimize Throughput And Cost For MmWave 5G Device Functional Test
Functional Test
Test engineers always have faced tough new test-coverage challenges. Those introduced by 5G measurements at mmWave are no exception, as they require over-the-air (OTA) radiated test solutions. But never have these pressures seen today’s intense time-to-market, manufacturing volume, and operational expectations! A solution that meets these demands must:
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BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
Open Test Platform for High Performance Automotive Applications
TSVP
Test Platform
The R&S®TSVP family of products is an open test platform from Rohde & Schwarz ideal for high performance automated test equipment (ATE) applications. The chassis contains a mechanical frame, digital backplane, analog backplane, mains switching and filtering, power supply and diagnostic extensions. A highlight is the analog bus for routing measurement signals between different slots without additional external wiring.
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OTP-Based Test System
Test System
Power electronics assemblies often cannot be tested using conventional technology for their electrical performance. Due to the adaptability of the instrumentation, the OTP concept offers an ideal platform even beyond the space requirements of several control cabinets. In order to achieve high test flexibility with different assemblies, the system was equipped with three-phase AC sources and AC loads as well as a precise three-phase power meter. DC sources and loads with different current and voltage ranges cover the test of frequent DUT operating parameters. Time-dependent voltage or current signals can be stimulated by an arbitrary generator with power amplifier. General measurements such as current, voltage, frequency, resistance can be carried out flexibly at various test points using the matrix concept. An oscilloscope with RF multiplexer is available for high-frequency measurements such as residual ripple, switching processes, etc.
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Product
2-Module ICT System, I317x Series 6
E9902G
In-Circuit Test System
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Regenerative Battery Pack Test System
17040
Test System
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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Product
GSM/EDGE Analysis Using NI PXI RF Test Instruments
NI-RFmx GSM/EDGE
Test Instrument
The NI-RFmx GSM/EDGE personality is a highly optimized API for performing physical layer measurements on GSM/EDGE cellular standard signals. NI-RFmx GSM/EDGE is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development effort.
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Semiconductors Testing
test
Our Testers support the production lines of variety of products such as 40/100 GBps Mux/DeMux, LNA, WiMAX RF Transceivers, Microwave & Millimeter Wave components. This high reliability products are being used in (a) Networking & Communications (b) Consumer Electronics (c) Military & Space
