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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Functional Test
UTS
The UTS functional test system is perfect for electronics manufacturing operations that have a mix of products where operators load and unload devices under test (DUT) and routinely change out fixtures for each type of DUT.
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End of Line Test System for Automotive Seats
AS519
AS519 is specifically designed to perform ECU’s EOL tests in the automotive industry. It integrates a programmable power supply up to 20V 20A with high reading resolution. Interaction with the DUT is established through CAN bus by an interphase adapter in a USB port of the test managing computer.
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ESS Performance Test System
The Energy Storage System (ESS) Performance Test System is used to evaluate, test, and certify the performance of energy storage systems up to 2MW. The system is a configurable platform with over 200 channels of simultaneously measured AC and DC voltages and currents, environmental temperatures, airflow, and communications. Intuitive software provides real-time monitoring and analysis of power, energy and efficiency to adhere with industry standards. The test system interfaces hardware such as load banks, and controls the ESS to simulate utility applications such as peak shaving and frequency regulation.
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6TL24 Combinational Base Test Platform
H71002400
The 6TL24 is the Base platform ideal for Combinational test (ICT+FCT) in low to mid volume, high-mix electronics productions. A dual-stage pushing mechanism will allow performing both, the FCT and the ICT test, without the need of changing the test platform and with a low cost fixturing technology. To do so, the exchangeable cassette fixture must be designed with two-level probes. IN the 6TL24, the second level is reached thanks to a pneumatic actuator.
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High Speed Test Bench
AT444
AC motor with mechanical multiplying gearbox test benches allow precise programming of all drive parameters required for accurate rotating devices test.The use of special high-speed bearings, mechanical components and parts wear resistant leads to a large life. The supply includes the electronic drive and control as well as the entire oil cooling unit.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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PXI Integration Platform
ATS-3100
The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
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Digital Test Instruments
Conduct pattern-based digital tests incorporating the latest parallel, digital, serial, and bus protocols with the PXIe-6943 digital test instrument.
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Lens Module Test Platform
The Lens Module Test Platform is a flexible solution to deliver the quality that is expected from your brand for all types of lenses and cameras. The system can be configured to measure objective, eyepiece or camera lenses. As the platform can efficiently measure lenses as small as 2 mm3, it is perfect for the critically precise applications of life sciences, consumer electronics, automotive and other industries. With 25+ years of quality experience, the Lens Module Test Platform ensures that all products shipped to market work as intended.
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Environmental Control System Test Platform
The Airframe Environmental Control System Test Platform provides a hardware-in-the-loop (HIL) closed-loop test environment for dynamic and maintenance testing of cockpit and cabin environmental control systems for airframes. The system simulates a military or commercial airframe cabin, including sensors and actuators from the control system and the passengers. The system delivers repeatable, cost-effective testing in a fraction of the time needed with typical in-house simulation systems.
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RF Testing Platform for ATx05
AT118
The functional test of modern devices with wireless connectivity always requires RF isolated cameras, as the only way to have the parameters controlled and to guarantee operation under the specified conditions.
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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6TL23 Off-Line seat operation Base Test Platform w/o Table
H71002301
- 18U height 19inch rack space (580mm depth)- VPC G12 or G12X interface- Man Machine interface H73000301 (not included)- stand-up operation
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6TL10 Table Top Test Base
H71001000
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettes.The platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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6TL08 Benchtop Test Platform
H710008
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettesThe platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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Active Alignment Assembly & Test Platform
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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Fixture Kit In-Line 6TL35 455x600mm
AH500
Fixture Kit for Platforms featuring receiver Virginia Panel 9025 and external pusher system. Its heavy duty design supports more than 3000N.nnThe fixture kit includes the Base fixture (probe plate) as well as the Puhsers plate.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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2-Module ICT System, I317x Series 6
E9902G
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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FADEC/EEC Test Platform
The FADEC/EEC Test Platform provides a hardware in-the-loop (HIL) closed-loop test environment for dynamic and maintenance testing of full-authority digital engine control (FADEC) and electronic engine control (EEC) units of both rotary- and fixed-wing airframes. The system simulates one or more turbofan engines, including its sensors and actuators for use with the most sophisticated FADECs and EECs on the market. The system delivers repeatable, cost-effective testing in a fraction of the time needed with typical in-house simulation test systems.
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Electronics Functional Test
Functional test for productive manufacturing. Manufacturers of products enabled by electronics must assure proper operation prior to shipment. Bloomy’s line of universal test systems are ideal for functional test of your PCBAs and subassemblies, from the simplest to the most complex. The UTS family of products combines high-performance test instruments, switching, power control and mass-interconnect hardware with our robust UTS software suite into a low-risk, cost-effective and powerful test solution for your device under test (DUT).
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VXI Digital Multiplier
4152A
The 4152A’s advanced features like limit testing, averaging, speed/resolution trade-offs, and fast function changes provide the high “test system” throughput required in today’s production test environments.
