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Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Thermal Image Analysis Software
Thermalyze
Thermalyze software provides a stable platform from which to perform sophisticated temperature analysis and failure analysis testing. Tools such as Emissivity Tables allow you to perform true temperature mapping on the surface with varying emissivity. Lock-in thermography tests enable you to detect heating below 0.001°C.
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Leeb Hardness Tester
HT6561
Product synopsis1.1 Typical Applications* Die cavity of molds* Inspection of bearing and other mass produced parts on aproduction line* Failure analysis of pressure vessel, steam generator andother equipment* Inspection of installed machinery, permanent parts ofassembled systems and heavy work pieces.* Testing surface of a small hollow space* Material identification in the warehouse of metallic materials* Rapid testing in large range and multi-measuring areas forlarge-scale work piece1.2 Testing Features* Palm size for narrow space.* Test at any angle, even upside down.* Direct display of hardness scales HRB, HRC, HV, HB, HS,HL.* Large memory could store 250 groups including singlemeasured value, impact direction, material and hardnessscale etc.* User recalibration function allowed.* Can communicate with PC computer for statistics andprinting by the optional cable.* Manual or automatic shut down.* Low battery indication.1.3 Technical SpecificationsDisplay: 12.5mm LCD with back lightAccuracy: Display error ±0.8% at LD=900Measuring range: 200-900LConversion: HL-HRC-HRB-HB-HV-HSDMaterials: 9 different common materialsWith RS232C interfaceMemory: 250 data can be stored and re-readableImpact device: D Will handle the majority of hardness testingapplications. Weight: 75gPower supply: 2x1.5V AAA size batteryDimension: 146×65×36mmWeight: 130g (not including batteries)Working temperature： - 10℃～＋50℃Storage temperature：- 30℃～＋
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Scanning Electron Microscope (SEM)
Prisma E
Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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IC Product Testing & Analysis Services
Integrated Service Technology
Integrated Service Technology Inc.
iST (Integrated Service Technology Inc.) is a leading lab-service company, specializing in the development of IC product testing & analysis, failure analysis, debugging, reliability test, material analysis. Apart from developing testing technologies for the upstream IC design and semiconductor industries, iST also expanded to provide a full-spectrum of services for the mid and downstream companies in the electronics industry.
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Resistive AC Load Bank
AC load bank testing offers you whole solutions of predictive failure analysis for UPS(uninterrupted power supply), generator, transformers, PV system, inverter etc, to validate the condition and output of such power systems comprehensively. Integrated AC & DC load bank could be made in one unit or separately with different load voltages as per your need for different applications.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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IC/BGA Tester
Focus-2005
As a screening checker to detect defective devices(mainly electrostatic destruction)which are returned from fields before failure analysis process of IC/LC in the quality assurance division of semiconductor manufacture.As a screening checker to detect defective devices before acceptance inspection by IC/LSI expensive tester at semiconductor company(trading, manufacture)Short/Open checker for semiconductor sensor device.It is possible to measure two kinds of measurements which are constant voltage biased current measurement and constant current biased voltage measurement. User can set the threshold of 10 ranks. （auto measurement）Only device can be measured. It is also possible to fabricate the test fixture.Various devices can be measured by replacing the socket board.It is no need to generate complex test programs as reference values are calculated from good device.It can be expanded by adding multiplexer boards which are 128pins per one board.(MAX 2048pins)
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Digital Microscope
VHX-6000 Series
Next-generation optical microscope with a large depth-of-field and advanced measurement capabilities for inspection and failure analysis.
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Analytical Probe Station with Laser Cutting System
LCS- 4000 Series
The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system which provides a high level of performance that is remarkably easy to use.
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Acoustic Microscope
AMI D9650
Specifically designed to serve as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection, the capabilities of the D9650 are truly unmatched. Representing the latest in C-SAM acoustic micro imaging, the D9650 delivers the unrivaled accuracy and robustness that you would expect from Nordson Test & Inspection instruments, plus improved electronics and software that raises the performance level for laboratory acoustic microscopes.
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Material Analysis Laboratory
Trialon’s world class Material Analysis Laboratory consists of state-of-the-art equipment and experienced staff. Our specialty is to determine failure analysis of design, material, process and root cause in both current and future products across multiple industries.
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Standard Electromagnetic Vibrator
KD-9363-EM
King Design Industrial Co., Ltd.
The purpose of vibration testing is to make a series of controllable vibration simulation in lab, no matter generated by natural or man-made vibration environment; such as waves, tidal flaps, wind, earthquake or rain and so on. It is to test if the product is capable of sustaining the vibration environment exerted from transporting or usage along its effective life cycle; and certify the standard of design & functional requirement of product. The value of vibration testing is to confirm the reliability of products and effectively screen out the bad products in factory; avoiding damages occurred at arrival; and to assess the failure analysis on the non-performing products; expecting to reach a high standard, high-reliability products. The vibration test stresses on the continuity and fatigue; and contributes to the understanding of product’s status under vibration circumstance in a normal environment; and avoids the product’s unpredictable damage caused under certain vibrating frequency for a long time.
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High-resolution, Portable AXI System
AXI X1# Series
The X1# is a high-resolution, low-footprint and portable AXI system. It is a dedicated platform for FATP and advanced failure analysis applications in connection with smart devices.
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Test System
Griffin III
The Griffin III system brings new price/performance efficiency to the Tester-in-a-Head tradition, a concept created and introduced by HILEVEL in 1987. This tester is a superior cost-effective solution for Engineering, Production, and Failure Analysis test applications.
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Surface Insulation Resistance Testing
AutoSIR2™
One AutoSIR chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2-point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), ensuring that dendrites are preserved for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.
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Scanning Electron Microscope w/ EDX Laboratory
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Cross-Section Analysis Laboratory
PCBs are constructed of a variety of materials such as glass, ceramic, copper, solder and Teflon. Trialon has the equipment and experienced staff to perform this difficult analysis. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Real-Time X-Ray Imaging and Variable Pressure Scanning Electron Microscope
Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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PWB Interconnect Stress Test
PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Acoustic Microscope
AMI D9650Z
The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Automated DC Parametric Curve Tracer
MultiTrace
MultiTrace curve tracer is a mid-sized benchtop model supporting pin counts from 216-625 pins and includes the PGA-625 fixture as a standard interface. MultiTrace supports a wide range of test applications: Failure analysis, Reliability testing, Counterfeit device analysis, Nondestructive electrical counterfeit test, Opens, shorts leakage testing (OSL), Post decap electrical inspection, Optical fault localization, ESD testing, Latch-up testing, Supply current measurements, and more!
