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Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Mass Interconnect
Mass interconnect is a way of connecting test instrumentation to a device under test (DUT). To put it simply, mass interconnect is a very large plug and socket which connects your device under test to your test instrumentation without the mess and hassle of having to connect each signal separately.
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CompactPCI Boards
*CompactPCI (cPCI) boards are 3U or 6U boards connected via a passive PCI (Peripheral Component Interconnect). Up to 8 boards can be connected together in a segment. Segments can be connected through bridges. *They are grouped into four categories: CPU, Communication, Input/Output, PMC carrier.
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Thermocouple Modules
VPC offers a wide array of modules with a variety of connection options that are configurable for virtually any interconnect requirement.
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Boundry Scan Testers
Qmax Test Technologies Pvt. Ltd.
Boundary Scan Trainer Kit was developed by Qmax to provide user a good understanding and hands on the testing principals of boundary scan namely the scan chain test, interconnect test, non-BS functional testing of logic IC and cluster like a combinational or sequential circuits.
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Vacuum Modules
VPC offers a wide array of modules with a variety of connection options that are configurable for virtually any interconnect requirement.
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VG-Receiver
uwe electronic offers a wide variety of VG-Receiver for 4, 12 or 24 VG-Interface-Blocks. From bench-top test applications to complete rack and stack solutions, we provide a reliable and economical test based mass interconnect.
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G6x - 9 Module Solution
This 9 Module Solution provides versatility in the same small footprint as the G6. This high-density Interconnect can simultaneously engage up to 1,920 signal contacts. The ability to add 3 iCon modules into the interface design provides up to 25% more I/O. The ITA has a unique, removable EMI shielded cover which allows easy access to modules and contacts.
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PCI Express
PCIe
PCI Express (PCIe) has become the leading interconnect technology to succeed the Peripheral Connect Interface (PCI) architecture. The PCI Express(PCIe) architecture retains the PCI usage model and software interfaces for investment protection and smooth development migration. The technology is aimed at multiple market segments in the computing and communication industries, and supports chip-to-chip, board-to-board and adapter solutions. PCI Express 5.0 currently runs at 16GT/s or 32Gbps per lane in each direction, providing a total bandwidth of 128GBps in a 16-lane configuration which is the largest size in use.
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Transitions And Iso-adapters
Smiths Interconnect offers a wide variety of transitions and Iso-adapters to suit the customer's requirements, up to Ka band.
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Tool, Extraction, 90 Series Modules, Interconnect Adapters
910109111
Tool, Extraction, 90 Series Modules, Interconnect Adapters
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PCB Connectors
HPH Series
Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option
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Time Domain Reflectometers and S-Parameter Analyzers
The Teledyne LeCroy WavePulser 40iX and the Teledyne Test Tools T3SP15D are a perfect combination of complimentary products to serve the requirements on testing, validating and troubleshooting cables, backplanes, connectors, transmission lines on boards and interconnect.
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AGC Coaxial Connectors
Teledyne Marine AG Geophysical Products
Coaxial Inline and Bulkhead Cables and ConnectorsWaterproof electrical coaxial interconnect for high shock, extreme applications
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Quickly & Accurately Validate Any Pluggable Transceiver from 10M to 100G
iOptics
iOptics offers a complete, powerful and easy-to-use tool for CFP and QSFP qualification and can validate the full range of low- to high-rate transceivers including SFP, SFP+, XFP, CFP, CFP2, CFP4, QSFP+ and QSFP28. iOptics offers a faster, streamlined and automated test sequence aimed at quickly and simply validating any type of 10M to 100G interface. It is the ideal solution for multirate field commissioning with a simple one-button pass/fail. It offers automated stress testing for lab qualification and is also ideally suited for data center and data center interconnect (DCI) testing.
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4.3-10 Connectors
Pasternack 4.3-10 connector category includes mostly RoHS and REACH components. 4.3-10 connector products in this category are built to precise RF and microwave industry specifications.4.3-10 connectors, like the other over 40,000 RF, microwave and millimeter wave components at Pasternack are in-stock. Not only are these 4.3-10 connector interconnects in stock, they also ship the same day.
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Interface Pin
Smiths Interconnect offers interface probes for all major test equipment manufacturers. We also provide a variety of interface pins for use in test fixtures.
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12 Channels 1.0 ~ 17.0 Gb/s (200Gbps) Pulse Pattern Generator and Error Detector
CA9806-12
The UC INSTRUEMNTS CA9806-12 is a highp erformance, flexible 12 channels Pulse Pattern Generator and Error Detector that can operate from 1.0 to 17.0 Gb/s (200 G). It is combined with three sets CA9806 4 CH 1.0 to 17.0 Gbps Pulse Pattern Generator and Error Detector that incorporates an external one by 4 rate clock synthesizer. Its small size allows it to be placed close to the device under test, it can also be placed further away using the TX driver pre and post emphasis controls features to compensate for cable and interconnect losses. It also has a non destructive, integrated eye outline capture feature along with a quick eye height and width measurement capability. Build-in 8.5 ~ 15 Gb/s eye diagram testing function.
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Cable Assemblies
Teledyne Storm Microwave, an industry leader in providing advanced cable assemblies and interconnect products around the globe, has a long and proud heritage serving domestic and overseas defense and telecom markets since 1978.At Teledyne Storm, we manufacture our flexible and semi-rigid coax cable in-house leveraging the highest quality, state-of-the-art equipment and processes. Flexible cable assemblies through 50 GHz are engineered and stringently tested to meet the most demanding requirements for Low Loss, Phase Stability, Durability, and Miniaturization.
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USB-8506 , LIN Interface Device
784664-01
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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Manual Step Attenuator, DC to 18 GHz; 0 to 70 dB; 10 dB steps
8495B
The Keysight 8495B dc to 18 GHz manual step attenuator offers exceptional repeatability and reliability. Attenuation is provided in 10 dB steps from 0 to 70 dB. Precision gold-plated leaf springs ensure long life (over 5 million cycles) and very high attenuator repeatability (typically 0.01 dB). To improve measurement accuracy, NIST traceable data (SWR and attenuation) is available as Option UK6. Custom step attenuator/switch combinations are possible. The Keysight 11716A/B/C interconnect kits provide quick connection of Keysight 8494/5/6/7 1 dB and 10 dB step attenuators in series for greater dynamic range with 1 dB steps.
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Gold Probes
4900 Series
The "GOLD PROBE" has been designed specifically for use with Tektronix, Hewlett Packard and other high performance oscilloscopes. This new slim design along with a host of versatile accessories, allows you to reach the most difficult test point in today's highly complex circuitry. The gold plated Probe Tips, Sprung Hook, Ground Lead, Alligator Tip and other critical interconnect points within the Gold Probe, provide excellent contacts for probing low level analog signals and high speed digital data. Unlike most "off shore" commodity probes, Probe Master guarantees quality and continuing domestic support for our "Made in America" Gold Probe.
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9050 - 50 Module, 2-Tier Solution
The rack mountable 9050 50 Module Receiver is designed to accept 9025 and 9050 ITAs and is ideal for systems with advanced mass interconnect requirements. The 9050 can be adapted to accommodate vacuum or mechanical fixturing. Connector modules can be intermixed for creating custom interfaces ideal for functional and system testing applications.
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Digital and Analog Test Sets
Our analog and digital automated test system experience covers a wide variety of applicationsfrom multiple path resistance, capacitance, and inductance testing using various Interface Test Adapters (ITA)to inter-connect multiple customer units under test (UUT). Other systems have included: equipment to monitor and record telemetry, digital data streams, and systems that evaluate packet data using a variety of VME, VXI, PXI, and LXI equipment.
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Time Domain Reflectometers
HL1100 Series
HYPERLABS HL1100 Series TDR instruments provide high-performance test and measurement capabilities for use in the field or in the lab. These instruments are used for applications such as fault detection in cables and interconnects, impedance characterization, time of flight analysis, water level measurement, and more.
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SCB-12, Nano-Pitch Connector Block, 8 SE DIO, 1 QSFP+
787419-01
8-Pin 3.5 mm Pitch Connector to Nano-Pitch I/O, QSFP28 Terminal Block - The SCB-12 converts the Nano-Pitch connector to the industry-standard QSFP28 connector for interfacing I/O signals to plug-in data acquisition. This Terminal Block features the QSFP28 variant of the quad small form-factor pluggable (QSFP) transceiver for high-capacity data communication. The SCB-12 combines with shield cables to provide low-noise signal termination. Additionally, the SCB-12 supports the Nano-Pitch I/O Interconnect System that provides data transfer at 24 Gbps per lane and compatibility with PCI Express, Serial Attached SCSI (SAS), and SATA protocols. The SCB-12 breaks out the NanoPitch connector to a QSFP28 connector as well as an 8-pin connector for general-purpose DIO signals.
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WavePulser 40iX High-speed Interconnect Analyzer
WavePulser 40iX Series
WavePulser 40iX is the ideal single measurement tool for high-speed hardware designers and test engineers. The combination of S-parameters (frequency domain) and Impedance Profiles (time domain) in a single acquisition with a deep toolbox provides unmatched characterization insight of high-speed interconnects.
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Backplane Connectors
Offering a broad portfolio of backplane connectors that include SOSA aligned optical, COTS plus hard metric, VITA standard and high speed twinax interconnects. Our interconnect solutions address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.
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Application Tooling
Using the proper interconnect manufacturer’s tooling is essential to meet many of the industry standards and to maintain the connector manufacturer’s product warranty.
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Coaxial Probes
Smiths Interconnect offers the industry's most extensive line of high reliability coaxial probes. Our coaxial probes provide a low noise, controlled impedance signal path with reliable and easy connect/disconnect options.
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Open Flanges Test Rig
Flexible cell dimensions: cells of Ø 8 to Ø 80 mm (or square till 70x70 mm) can be successively installed Quick start of experiment: less than 20 minutes to remount a new cell with different dimension, thanks to the simple design without sealing Other SOFC components: the open flanges test rig is also useful for conductivity measurements (electrolyte, electrode material, interconnect etc.) and sealing tests End of broken cells and secure testing: the cell is squeezed by a soft alumina felt that prevents any damages, the excess fuel burns continuously in the alumina felt at the cell edges
