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Memory Device
directly accessible computer's internal or main memory.
See Also: Memory, Memory Test, DDR, NAND, DRAM, RAM, ROM, Memory Testers, DUT
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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ABex in System Programmer with Onboard SMH FlashRunner LAN 2.0 NXG
ABex AM-307 FR-NXG Flashrunner
The ABex AM-FR-NXG incorporates the FlashRunner LAN 2.0 Next Generation from SMH Technologies. The FlashRunner is used to program microcontrollers, flash and other logic and memory devices. All DIO’s, the programmable voltage lines and the corresponding ground lines can be switched by relays.The ABex AM-FR-NXG is equipped with an onboard Ethernet Controller which connects the FlashRunner directly to the PXIe Backplane of the ABex Chassis. Using a windows host, each AM-FR-NXG will provide its own network adapter.
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PLD ISP Feature, GTE 10.00p
K8220A
The PLD ISP feature allows the test developer engineer to specify a configuration bitstream file in VCL digital test file, much like programming a Flash memory device. The PLD ISP feature supports multiple PLD configuration data formats are supported including. Serial Vector Format (SVF), Standard Test And Programming Language (STAPL), Jam, Jam Byte Code (JBC) object files.
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Parallel Memory Test Solution
Magnum2
Teradyne’s Magnum 2 test system delivers high throughput and high parallel test efficiency for high performance non-volatile memories, static RAM memories and logic devices.
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COM/SOM Modules
PicoZed Family
Computer on Modules and System on Modules are complete embedded computers with a computer processor, chipset, memory, and peripherals designed into a single board with a small footprint. They integrate the complete functions of a computer in to a single module. Both COMs and SOMs are types of single board computers except the fact that both of these are required to be mounted on a carrier board/base board which breaks the bus out to standard peripheral connectors as COM/SOM lacks the standard connectors for any input/output peripherals to be attached directly to the board. Carrier boards can implement special I/O interfaces, additional memory devices, and connectors according to the application requirements. COM examples include COM-Express Basic, COM-Express Compact, COM-Express Mini, QSeven, ETX etc. SOM examples are NOVSOM, MitySOM, and SOM CM7120 etc.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Wind Meters
According to the type of application, wind meters are made as hot wire wind-meters or pocket weather wind-meters, all of these wind-meters can measure air velocity and air pressure. Wind meters for the measurement of air velocity and air pressure. The measurement results can be stored in memory of the device (depending on the model). There are a lot of different instruments available in our stores. These wind meters are ideal for taking quick or constant measurements. Wind meters for measuring air velocity and volume flow are available here. The pocket-sized wind meters are implemented as hot-wire wind meters, vane wind meters, cup wind meters or portable, waterproof wind meters depending on the particular application.
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Digital Accelerometer
ZET 7151
The characteristics of the primary transducer are set in the device memory and measurements are performed based on those parameters. Thus, the digital sensors releases the user from setting the measuring channels and data processing. The sensors are fixed on the measurement object while the information transmission units are mounted in electric cabinets. An advantage of the ZETSENSOR units is easy installation and uninstallation as well as indication of feed and signal transmission which, in its turn, facilitates diagnostics of the system at the facility.
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Surface & Volume Resistivity Meter for Nonconductive Materials
Hiresta UX
The new Hiresta-UX is a high performance meter for measuring the surface and volume resistivity of a wide variety of nonconductive materials. With an extended measurement range of 103 ~ 1014Ω, this meter is ideal for Production, Engineering, R&D and Quality Control. The new Hiresta-UX features powerful new algorithms that automatically choose the right voltage, which optimizes the surface and volume resistivity testing. This versatile, high performance resistivity meter includes a built-in switch box that can be mated with a J-Box (meets JIS K 6911 for surface & volume resistivity and is compatible with ASTM D 257) as an option. The Hiresta-UX can store up to 2,000 measurement results, which can be easily exported to a USB memory device.
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Flash Device Test System
MS7208
The MS7208 system can test a wide range of device families including – but not limited to – NAND flash, NOR flash, multi-level flash, multi-die flash, EEPROM, RAM, and mixed-technology memory devices.
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Super Fast Gang ISP Programmer
448Pro2
The Dataman 448Pro2 is a super fast PC based gang programmer with four independent 48-pin ZIF sockets, ISP capabilities and USB 2.0 connectivity • Up to 75% faster programming of high-capacity memory devices • Over 105,000 devices supported with new devices added monthly • Independent modules supporting concurrent programming • Intelligent pin drivers operate down to 1.8V so you'll be ready to program the full range of advanced low-voltage devices • Full ISP capabilities including JTAG compatibility • Hi-speed USB 2.0 connectivity • Easy to use software compatible with the latest operating systems including Windows 10 • Comprehensive 3 years parts and labor warranty • Free life-time software updates
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Test And Product Engineering Services
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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Battery Testers
Memory & Read FunctionRight Device to know the TRUE -LIFE of Battery Capacity (Resistive / Voltage) Simultaneously MeasureOn - Line Testing without shutting down batteryBuilt - in Comparator FunctionRates Conditions as PASS, WARNING or FAILDatalogging Memory FunctionCompact and lightweightRS-232 Interface & SoftwareAuto Power Off
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PLD ISP Feature, GTE 10.00p
K8220B
The PLD ISP feature allows the test developer engineer to specify a configuration bitstream file in VCL digital test file, much like programming a Flash memory device. The PLD ISP feature supports multiple PLD configuration data formats are supported including. Serial Vector Format (SVF), Standard Test And Programming Language (STAPL), Jam, Jam Byte Code (JBC) object files.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Boundary-Scan DIMM Socket Tester
ScanDIMM
Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Compute Express Link (CXL)
Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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Memory
Renesas offers MIL-STD-883-compliant CMOS random access memory (RAM) and CMOS programmable read-only memory (PROM) devices that are that are qualified to QML Class Q military standards.
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High Speed Pick and Place Handler
Commander 2000
At throughput rates in excess of 2000 Units per Hour the HT Commander 2000 system provides unparalleled performance for the production handling and programming of flash memory devices or modules.
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8-Sites Flash Programmer w/Relay Barrier, True Parallel Channels
YAV90FR2
The YAV90FR2 or YAM90FR2 is a flash programmer housed in a compact 6TL YAV Module form factor, designed forseamless integration into automated test environments. It incorporates the advanced FlashRunner 2.0 technology fromSMH, enabling efficient programming of microcontrollers, flash memory, and other logic or memory devices. Themodule features flexible connectivity options, with all digital I/O (DIO), programmable voltage lines, and correspondingground lines switchable via integrated relays.
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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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High Speed & Precision Pressure Insensitive Mass Flow Module
D700MG
Critical semiconductor manufacturing processes continuously desire precision gas flow control devices that enable both future innovation, and lab to fab transition of leading edge memory and logic device. HORIBA's propose the new pressure based MFC D700MG, the upper compatible model of the D500MG to support customer’s challenges.
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QDRII/DDRII/ QDRII+/DDRII+ SRAM
DDR II / II+ (Double Data Rate) SRAMs and QDR^(TM) II / II+ (Quad Data Rate) SRAMs are the ideal memory devices for next generation networking and communications systems. These ultra-fast devices can support high bandwidth systems that require memories capable of very high operating frequencies combined with low latencies and full cycle utilization.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Debug probe for ARM Cortex processors
USB Multilink ACP
P&E’s USB Multilink ACP is a debug probe which allows a PC/laptop access to JTAG/SWD on ARM Cortex devices from several manufacturers (see complete list below). It connects between a USB port on a Windows machine and the standard debug connector on the target. The product photos to the left of this page show how the headers can be accessed by simply flipping open the plastic case. Ribbon cables suitable for a variety of architectures are included. By using the USB Multilink ACP, the user can take advantage of the debug mode to halt normal processor execution and use a PC to control the processor. The user can then directly control the target’s execution, read/write registers and memory values, debug code on the processor, and program internal or external FLASH memory devices.
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Application Level Tester
The application tester tests the memory devices such as graphic memory and HDD buffer memory in a specially designed condition made similar to actual PC and Server environments. In fact the graphic memory has releatively higher speed, test expense and quality standard compared to main memory, stressing the importance and the need of the application tester.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
