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SoC
A complete computer "System on a Chip".
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SPARCv8 Software Development Environment
SPARCv8-SDE
The SPARCv8 Software Development Environment (SPARCv8-SDE) from STAR-Dundee is designed to support the development of software for the SPARC V8 series of processors, SoC devices and FPGA cores targeted for on-board spacecraft. SPARCv8-SDE consists of an all-in-one software development environment that provides great flexibility allowing generic application software development and, through a library of plugins, processor specific software.
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Intel® Xeon™ SoC, PCIe Gen3 And 10GbE (XAUI), 6U VPX
VPX752
The VPX752 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel 5th generation Xeon-D processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Functional Verification Platform
Riviera-PRO
Riviera-PRO™ addresses verification needs of engineers crafting tomorrow’s cutting-edge FPGA and SoC devices. Riviera-PRO enables the ultimate testbench productivity, reusability, and automation by combining the high-performance simulation engine, advanced debugging capabilities at different levels of abstraction, and support for the latest Language and Verification Library Standards.
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Low speed Serial Interfaces
12C/ 12S/ SPI/ UART
Arasan has a diverse portfolio of connectivity IP products including SPI, I2C, I2S and UART. These protocols are vital for the integration of SoCs with peripheral chipsets in order to form a complete hardware platform. They are frequently used by the SoC to configure, control and gather diagnostic information at the platform level to ensure correct operation of the hardware.Arasan's proven Connectivity IP Solutions provides a risk free path to integrating these interfaces in SoC designs:High quality IP cores ensure inter-operability between SoCs and peripheralsIn-house domain expertise ensures a high quality support throughout the SoC development cycleTotal IP solution includes RTL source code, synthesis scripts, test environment and documentation
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Test And Product Engineering Services
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
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3U OpenVPX Module
VPX3-ZU1B
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
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Intel Atom® Processor-Based Ultra Compact Embedded Platform
MXE-200
ADLINK's new Matrix MXE-200 series Ultra Compact Embedded Platform, based on the Intel Atom® SoC processor E3845/E3826, With superior-class construction meeting a wide variety of specific industrial needs, the MXE-200 series offers the most reliable Ultra Compact Embedded Platform for use in harsh environments, compliant with industrial grade EMI/EMS (EN61000-6-4,61000-6-2), protecting customer assets and reducing TCO. Opposing conventional correlations between size and computing power, the MXE-200 series features large-scale performance in an ultra-compact package.
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FPGA Boards
For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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AMD Zynq™ UltraScale+™ MPSoC XMC Board
IC-MPS-XMCa
The IC-MPS-XMCa is a XMC FPGA card based on the AMD Zynq™ Ultrascale+™ ZU4CG MultiProcessor SoC.
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FRAMOS SLVS-EC RX IP CORE
Sony’s SLVS-EC interface standard has emerged as the best high speed interface to Sony’s best image sensors, enabling higher throughput, greater signal integrity, and simpler designs. Engineers developing solutions using Xilinx FPGAs and SoCs can take advantage of FRAMOS’s SLVS-EC RX IP Core, Evaluation Board and tested source code examples. Device builders and camera vendors can de-risk the design while reaping the benefits of Sony’s latest high-speed interface.
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ScanWorks IJTAG Test
ScanWorks IJTAG Test
The ScanWorks Internal JTAG (IJTAG) tools allow system-on-a-chip (SoC) designers, DFT engineers and validation engineers a new and simpler way to access, control and run any embedded instrument designed into chips. When the IEEE ratifies the IEEE 1687 IJTAG standard in 2013, it will enable easy access to run any functional type of IJTAG instrument. ASSET is the first tool supplier with development tools available today for the early adopters of this important new technology.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Test System
UltraFLEX
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
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High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Qseven V2.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC, 1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M120-120-EVK
*Ultra low power consumption Cortex™-A9*High flexibility Qseven v2.0 compliant design*2 CAN 2.0B*18/24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android4.3*Audio
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Xilinx Zynq ARM + FPGA SoM
TE0720
Sundance Multiprocessor Technology Ltd.
TE0720s are industrial-grade SoC modules integrating a Xilinx Zynq Z020 SoC, a gigabit Ethernet transceiver (physical layer), 8 Gbit (1 Gbyte) DDR3 SDRAM with 32-bit width, 32 Mbyte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 5 x 4 cm form factor are fully mechanically and largely electrically compatible among them. All this on a tiny footprint, smaller than a credit card, at the most competitive price. A free and open embedded development suite with reference designs is included.
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Automotive Infotainment SoCs
ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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Emulation Platform
Veloce
The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Processor IP
System IP
Perfect for high-efficiency IoT endpoint or a high performance server SoC.
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Sealed Panel PC
PPC12-427
WINSYSTEMS’ PPC12-427 is a fanless, 12.1-inch panel PC featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, extended operational temperature, and IP65 rating make it a great fit for harsh environments in the industrial control, transportation, energy, and industrial IoT markets.
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CMOS SoC for mmWave 3D Imaging Sensor
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Vayyar chip covers imaging and radar bands from 3GHz-81GHz with 72 transmitters and 72 receivers in one chip. Enhanced by an integrated, high-performance DSP with large internal memory, Vayyar’s sensor does not need any external CPU to execute complex imaging algorithms.
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Microcontrollers
Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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TySOM Embedded Prototyping Boards
TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
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Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
