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SparkFun Solder-able Breadboard
Large
This is the Large SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our full-size breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Hot Air Rework Station
21-10125
The 21-10125 is a hot air Rework Station provides a wide range of temperature and temperature settings for flexibility in soldering and desoldering work of sensitive components. A closed-loop heat sensor provides accurate and consistent working temperature. It features an intelligent cooling system cools the hand-piece with continued air movement after power has been switched OFF.
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High Voltage Dry Reed Relays
Series 60 & 65
High voltage relays - chassis mounted, up to 15kV. Tungsten switches with power rating of 50 Watts maximum. Series 60 has solder terminals and nylon chassis mounting studs
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25-Pin D-Type Female Solder Bucket
92-960-025-F
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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PCIe 4.0 Protocol Analyzer
Summit T48
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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75 Ohm SMB Connectors
Pasternack 75 Ohm SMB connector category includes dozens of part numbers, most are RoHS and REACH compliant. 75 Ohm SMB connector series in this category will terminate to coax, PCB (printed circuit board) or terminal. Our SMB 75 Ohm connectors are built to precise microwave and RF industry specifications. Pasternack 75 Ohm SMB connector products are built in jack or plug gender with 75 Ohm impedance. SMB connectors in 75 Ohm impedance are available in straight or right angle versions, as well as, bulkhead or mountless options. These 75 Ohm SMB connector designs include clamp/solder, crimp/solder or solder attachment methods. As with the other over 40,000 RF, microwave and millimeter wave products from Pasternack, this 75 Ohm SMB connector series is in-stock. Not only are these connectors with 75 Ohm SMB in stock, they will ship the same day as they are ordered.
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Male/Female DIP Jumpers
Series 200 thru 216
Male/Femaie DIP Jumpers. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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Circular Connectors
Complete range of circular connectors with metal and plastic shells, and crimp and solder terminations for multichannel hybrid electrical/ optical insert arrangements, supporting a wide range of allowable contact voltages and currents, easy environmental sealing and rugged mechanical performance.
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20-Pin GMCT Male Connector, 10A, Without Backshell
92-960-020-10A-M
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. It is supplied with removable solder bucket contacts suitable for wires up to 16 AWG. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical safety precautions are observed.
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Probe Card PCB's
DTS offers both generic and custom PCBs blanks for probe cards. Probe card PCBs are available for all tester platforms and can be configured for any vertical technology, epoxy cantilever and legacy blade cards. DTS probe card blanks are made to precise specifications required for all probing technologies and are available in high speed and high temperature materials. All probe card PCBs employ a balanced layering construction to maintain tight flatness specifications and minimize warping, allowing good probe planarity. Gold plating on all surface metals facilitates easy soldering and minimizes probe resistance. DTS is continually adding new probe card blanks to its library!
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Plugbord
3677-2
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers.3-Hole solder pads (0.28” x 0.080”) and buses forinterconnecting multiple component leads. No pattern on reverse side, edge contact only. Row and column legends provided.
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Xhorse EWS-3
For writing through K line in ews-3. All you need to do is to connect adapter to the EWS 3 connector and solder one cable in the marked place according to the instructions.
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Emulation & Test Interface
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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Machine Solutions
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts. The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
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QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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SparkFun USB-C Breakout
With this USB breakout you will finally be able to incorporate a USB-C connector into your projects without needing to solder each tiny SMD pad. The SparkFun USB-C Breakout supplies up to three times the power as previous USB iterations and also solves the universally frustrating dilemma of plugging a USB cable in correctly because it's reversible!
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Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178
610103140
Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178.Mechanical SpecificationsDurability 20,000 cyclesContact Material Shield – BrassCenter Conductor – BeCuContact Plating Shield – 50µ" Au over 100µ" NiCenter Conductor – 60µ" Au over 100µ" NiContact Termination Solder SleeveInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50 ΩFrequency Range DC to 2 GHzVSWR ≤ 1.2 @ 2 GhzInsertion Loss ≤ 0.05 dB @ 500 Mhz≥ -0.3 dB @ 2 GhzDWV 1500 VDC Min.Contact Resistance < 5 mΩ @ 0.5 Amp & always < 10 mΩCable Specifications RG316 & RG178Environmental SpecificationsOperating Temperature -50°C to +105°CInsulation Resistance 1000 MΩ min.
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Smart Optimization
A reflow oven or wave solder machine is capable of literally billions of alternative setups. Each combination of zone temperatures and conveyor speed will produce a unique profile for a processed product. KIC's software makes an exhaustive analysis of all the setups and it recommends the very best oven/machine recipe within seconds.
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Mechanical Testing
Our Capabilities*Flammability*Solderability and Solder Heat*Package and Drop Testing*Resistance to Chemicals and Solvents*Conformal Coat Compatibility*Compression and Tension Testing*Up to 10,000 pounds
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Hard Metric Eurocard Plugbord
8020
VECTOR Electronics and Technology, Inc.
3U x 160mm Eurocard size for 2mm Hard Metric connector. Pad-Per-Hole and peripheral bus both sides. Pad and bus surfaces not solder coated. Accepts cPCI 2mm J1 (25 row) & J2 (22 row) connectors on edge.
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160-Position QFP-to-PGA Adapter
96-160M65
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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3-Pin Power D-Type Connector, 40A, Female Without Backshell
92-960-003-F
This connector is suitable for Pickering Interface's modules that use the 3-Pin Power D-Type connector. It is designed to allow users to make a direct termination with soldered connections.
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Plugbord
3677-3
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers. 3-Hole solder pads (0.28” x 0.080”) and buses forinterconnecting multiple component leads.No pattern on reverse side, edge contacts only Row and column legends provided.
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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Connector, 104-Pin D-Type Female, Solder Bucket, 5A
C104DFX-2SB-1A
This 104-pin female D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied without backshell. This connector is suitable for use with Pickering modules that use the 104-pin D-type connector.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
