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Spring Probes
Spring loaded electrical conductor contacting elements. Also known as: Pogo Pin
See Also: Pogo Pin, Test Fixtures, Bed of Nails
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Kelvin Contact Spring Probes
We have spring probes for Kelvin contact, which best suits to use for sensitive and extremely precise test. It is used by contacting to one terminal of semiconductor by two probes. We have 0.3, 0.4 and 0.5mm pitch probe for Kelvin contact.
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Spring Probes
Spring probes are designed to optimize performance in high reliability, multicycle applications. Smiths Interconnect's spring probes, featuring IDI contact technology, are compliant which makes them ideal for blind mate applications as they self correct for x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency applications.
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Standard Type Spring Probes
From for bare board to for ICT, we have variety of spring probes for PCB. In addition to variety of tip type and total length, we also have receptacles that match the best to spring probes. We can also attach lead wire to the receptacles.
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Ingun Spring Probes
MicroContact AG offers the assortment of test probes and test adapters from Ingun as a Swiss representative.
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Fine Pitch Spring Probes
For MARATHON series, we have ultra-fine spring probes with high quality for small lot order and in short lead time. We have product range from probe outer diameter 0.11mm.
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Spring Probes & Hyperboloid Contacts
In-Circuit / Functional Probes, Socketless X Probes®, High Current Probes, Double Ended Probes, ATE Interface Probes, integraMate®
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High Frequency Spring Probes
We have spring probes for high frequency for 0.5 and 0.8mm pitch. We provide spring probe with low insertion loss by shorten the total length to 1.5mm (use length 1.1mm).
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Spring Probes
An essential component in the testing of electronic components. In Test & Measurement applications, they are used to make contact with test points, connecting the DUT (device under test) with the test equipment.
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Standard Pitch Spring Probes
Other than spring probes with gold plating, we have spring probe with anti-solder migration coating and plating that were developed by KITA. We also have anti-solder migration material for plunger tip. These are all included in “MARATHON” series. They have wide range of tip type for various use for every popular total length.
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Connectors
Through our Hypertac, IDI and Sabritec technology brands, we supply application-specific, high-reliability electrical interconnect solutions from highly integrated assemblies to microminiature connectors and spring probe contacts. The core of our advanced interconnect solutions is our contact technologies: Hyperboloid, Tortac, Spring Probe, High Speed, Edge Card, Fiber Optic, EMI/EMP, High Power and High Temperature.
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Socket Phone
Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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RF Coaxial Probes & Probe Positioner
Fairview Microwave’s line of coaxial RF probes and RF PCB probe positioner are ideal for use with chip evaluations, signal integrity measurements, coplanar waveguide, substrate characterization, gigabit SERDES and test fixture applications. The RF coaxial probes provide return loss better than 10 dB and a maximum operating frequency of 20 GHz. The probes have a 3.5mm female interface, a pitch of 800 or 1500 micron and they can be cable-mounted. They feature gold-plated contacts and can be used by hand, with or without a probe positioner. Compliant coaxial GSG (or GS) pogo pins allow for a broad range of probing angles. The RF PCB probe positioner can hold coaxial probes, has articulated joints and delivers multi-axis positioner control. This positioner also boasts a magnetic mounting plate with on-off positioner switch.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Switch Probes
A Switch Probe is a spring contact probe and receptacle combination that is normally open, and after a designated travel the switch probe closes. The most common use for switch probes is in the cable harness testing industry. The switch probe is used to verify the correct location of a terminal in a connector while checking the retention force as well. Switch probes also verify the presence of nonconductive components such as caps for connectors or devices on a circuit board. Smiths Interconnect offers three standard sizes of switch probes.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Electrical Tester Grid Field
TCI can furnish grid spring probes for most Bare Board Electrical Testers in production at most Printed Circuit Board Manufactures. Look for your model of Bare Board Tester in the following list and call TCI for current price quotation.
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Test Contactor/Probe HEad
cRacer
The cRacer™ test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 100 µm to 650 µm, covering the majority of 5G devices.cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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Test Probes and Pins
Spring Loaded Test Probes for Circuit Board Testing, "Pogo Pins" Test Electronics sources and stockes a large variety of Test Probes and Spring Loaded Test Pins. Let our applications engineers help you find the correct pin for your test fixture application.
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Diagnostic Cores
VersaCore™
The diagnostic cores are uniquely designed in the VC20 format. Using the customizable PCB, components can be added to create a "golden core" to quickly troubleshoot your system Test SMUs, Test Motherboard, Test Pogo pins, Test Relay matrix.
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Custom Pogo Pin Rings & Blocks
Reduce your cost-of-test with our pogo pin blocks and interfaces that transform complex DUT boards or breakout boards into universal motherboard-style interfaces. Eliminate the need to purchase or build a new board for every unique device, unit, or package.
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Linear Testfixture (Cassette Not Included), UTT 456 x 320 mm
MG-07
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 456 x 320 mm (wxd)• Outer dimensions: 620 x 590 x 100 x 184 mm (wxdxh1xh2)• Designed for changeable cassette
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Linear Testfixture (2 pcs. Cassette Included), UTT 105 x 170 mm (2pcs)
MG-05
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (1000N) 650 units for each cassette• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 105 x 170 mm (wxd) each cassette• Outer dimensions: 550 x 400 x 50 x 140 mm (wxdxh1xh2)• Designed for 2 pieces changeable cassette
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Linear Testfixture (Cassette Not Included), UTT 586 x 413 mm
MG-04
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 586 x 413 mm (wxd)• Outer dimensions: 800 x 635 x 100 x 190 mm (wxdxh1xh2)• Designed for changeable cassette
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MEMS Spring Probe
MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Diagnostic Cores
Diagnostic VersaCore™
The diagnostic cores are uniquely designed in the VC20™ with Advanced Cantilever™ technology format. Using the customizable PCB, components can be added to create a “golden core” to quickly troubleshoot your system*Test SMUs*Test Motherboard*Test Pogo pins*Test Relay matrix
