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Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Sematech Analysis and SEMI Standards Analysis
Rocky Mountain Laboratories, Inc.
Rocky Mountain Laboratories, Inc. provides SEMI Standards analyses that conform to the following SEMATECH and SEMI Standards for testing of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system:SEMASPEC #90120401B-STD (SEM Analysis)SEMASPEC #90120402B-STD (EDS Analysis)SEMASPEC #90120403B-STD (XPS Analysis)SEMASPEC #91060573B-STD (Auger (AES) Analysis)SEMI F60-0306 (based on F60-0301) (XPS Analysis)SEMI F72-1102 (Auger (AES) Analysis)
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Surface Analysis
InSight-450 3DAFM
Based on the production-proven InSight® 3DAFM platform for 300mm, the InSight-450 3DAFM is ideally suited for a broad range of roughness, depth and CD applications.
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Gas Analysis
HPR-40 DSA
Hiden Analytical offers class-leading gas monitoring solutions designed to obtain and quantify complex species in liquid samples. Our ultra-precision HPR-40 DSA is a compact membrane inlet mass spectrometer (MIMS) and a versatile instrument suited to dissolved and evolved species analysis. Direct probes, flow through probes and large circular membrane cells are available to address a broad application range in sediment, sea water, sludge and groundwater studies.
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Signal Analysis
Harmonic Distortion Analysis
The software is used for automatic measurement of the harmonic distortion factor and voltage r.m.s. of signals coming to the input channels of FFT spectrum analyzers. Adjustment to the frequency of the main component is performed automatically. The program is based on the measurement of the voltage r.m.s. of higher components by an external or internal reference signal.
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Gas Analysis
HPR-20 TMS
The Hiden HPR-20 TMS Transient MS is configured for fast event gas analysis of gases and vapours at pressures near atmosphere. Ideal for fast gas switching experiments the MS features the Hiden QIC quartz-lined 0.9 m sampling interface.
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Liquid Analysis
Comprehensive product range for all analytical parameters. Environmental protection, consistent product quality, process optimization and safety – just a few reasons why liquid analysis is becoming increasingly essential. Liquids such as water, beverages, dairy products, chemicals and pharmaceuticals have to be analyzed day in and day out.
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Testability Analysis
TurboCheck
TurboScan is an advanced full-scan and partial-scan test suite. It includes a Scan Synthesizer and an Automatic Test Pattern Generator (ATPG). TurboScan automatically repairs testability violations to make your design highly testable.
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Gas Analysis
HPR-40 DEMS
The Hiden HPR-40 DEMS is a bench top or mobile cart mounted module for analysis of dissolved species in electrochemistry. The system is modular and adaptable. The system includes two differential electrochemical mass spectrometry ‘DEMS’ cell inlets, designed for material/ catalysis studies, cell type A, and electrochemical reaction studies, cell type B.
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Reservoir Analysis
Reservoir Analysis Instruments determine the flow-related properties of the reservoir fluids and formation so that producers can optimize their production and recovery techniques.
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Analysis Tool
CANalarm
The CANalarm is a low priced analysis tool that can be installed in the bus permanently. It makes it possible to build up a separate and redundant monitor without change of configuration and program of the master controller. It works passive and is therefore non reactive
