MEMS
Micro Electro-Mechanical Systems are a microstructure integration of electronics, sensors, actuators and mechanical components.
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Product
LXI 16:1 Optical MUX SC Multi Mode
60-851-213
Multiplexer Module
The 60-850 and 60-851 are LXI conformant fiber optic multiplexers that use MEMS switching technology to ensure fast and reliable switching of single-mode (60-850) or multi-mode (60-851) optical signals being carried on fiber connections. The 60-850/851 is available with a variety of connector options and in a variety of multiplexer arrangements. Loop-thru versions are also available for easy multiplexer expansion.
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Product
Fiber Optic Accelerometer
MR660
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The MR660 Series Accelerometer provides an innovative solution to measure vibration and movement in high voltage or ATEX environments. The MR660 Accelerometer system employs a highly sensitive MEMS membrane to provide a robust system capable of producing an output signal of 100mV/g pk-pk.
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Product
Pressure Sensors
ESCP-SAPT Transmitter
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ESCP-SAPT pressure transmitters consist of a MEMS capacitive pressure sensor die, which is underpinned by ES’ innovative microfabrication process that has been proven suitable for the mechanical, radiation and temperature environment of space applications. The full custom, radiation-hardened signal conditioning IC was designed entirely by ES, utilizing a standard deep submicron CMOS process of a European foundry.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Ion Beam System
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Veeco's unmatched Ion Beam know-how delivers proven etch and deposition performance enabling the data storage and MEMS markets for decades.
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Product
LXI Dual 8:1 Optical MUX LC Single Mode
60-850-412
Multiplexer Module
The 60-850 and 60-851 are LXI conformant fiber optic multiplexers that use MEMS switching technology to ensure fast and reliable switching of single-mode (60-850) or multi-mode (60-851) optical signals being carried on fiber connections. The 60-850/851 is available with a variety of connector options and in a variety of multiplexer arrangements. Loop-thru versions are also available for easy multiplexer expansion.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Bulk Acoustic Wave Technology
BAW
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Macom Technology Solutions Holdings Inc.
MACOM’s BAW product portfolio is ideal for high performance Industrial, Aerospace, Defense, and Communications applications that require critical frequency filtering. Our high-performance RF filters enable our customers manage signal integrity in the 1 to 6 GHz frequency range. Bulk Acoustic Wave Resonators consist of two metal electrodes above and below a layer of a piezoelectric material. The piezoelectric material converts an electrical signal to a mechanical signal and vice versa. The metal electrodes provide the connections to/from the piezo material. The frequency at which resonance occurs depends on the thickness of the combined metal-piezo-metal stack. Advances in thin-film piezoelectric fabrication have enabled BAW resonators to meet RF filtering challenges up to 6000 MHz using standard MEMS fabrication process. High-performance BAW resonators-based RF filters are made of piezoelectric material having high Q-factor (>3000) and high coupling coefficient. Currently, no competitive technology provides the same high performance for RF filter applications when compared to BAW resonator-based RF filter up to 6000 MHz for the same size and cost.
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Product
SAM Auto Line
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PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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Product
0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Product
Pressure Sensors
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A pressure sensor is a device that senses pressure and converts it into an electric signal where the amount depends upon the pressure applied. TE Connectivity (TE) designs and manufactures pressure sensors ranging from the sensing element to system packaging for harsh environments. We are an industry leader for our range of both standard and custom pressure sensors, from board level components to fully amplified and packaged transducers. Based on piezoresistive Micro-electromechanical systems (MEMS) and silicon strain gauge (Microfused, Krystal Bond) technology, our sensors measure everything from less than one inch of water column (<1.25 mbar) to 100K psi (7K bar).
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
PXI/PXIe MEMS Optical MUX, 4-Channel, Multi-Mode, 50/125 Fiber
40-850A-514-M50-HI
Multiplexer Module
The 40/42-850A-514-M50-HI is a PXI/PXIe 4-channel multiplexer with ST connectors, includes hardware interlock and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications.
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Product
4-conductor Cables For Sensors
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4-conductor cables are used with ICP® triaxial sensors and single axis MEMS sensors. This table provides the most relevant specifications for five cable types. Type 010 and 034 are the most commonly used, but three other types are also available.
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Product
UV Meters
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OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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Product
LXI 8:1 Optical MUX SC/PC Loop-Thru
60-850-221
Multiplexer Module
The 60-850 and 60-851 are LXI conformant fiber optic multiplexers that use MEMS switching technology to ensure fast and reliable switching of single-mode (60-850) or multi-mode (60-851) optical signals being carried on fiber connections. The 60-850/851 is available with a variety of connector options and in a variety of multiplexer arrangements. Loop-thru versions are also available for easy multiplexer expansion.
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Product
PXI/PXIe MEMS Optical MUX, 4-Channel, Multi-Mode
40-850A-014-M62.5
Multiplexer Module
The 40/42-850A-014-M62.5 is a PXI/PXIe 4-channel multiplexer with FC/APC connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications. They are also available with an optional hardware interlock which, when activated, will return all optical switches to their default unpowered state.
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Product
MEMS Module
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The design and modeling of microelectromechanical systems (MEMS) is a unique engineering discipline. At small length scales, the design of resonators, gyroscopes, accelerometers, and actuators must consider the effects of several physical phenomena in their operation. Consequently, COMSOL Multiphysics is ideally suited for MEMS applications.
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Product
PXI/PXIe MEMS Optical MUX, 4-Channel, Multi-Mode, 50/125 Fiber, SC/PC Connectors
42-850A-214-M50
Multiplexer Module
The 40/42-850A-214-M50 is a PXI/PXIe 4-channel multiplexer with SC/PC connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules.
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Product
MEMS Optical Switch
FTBx-9160
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With its MEMS-based design, EXFO’s FTBx-9160 delivers durable performance in a compact package. Fast switching time and a 1-billion-cycle lifetime expectancy make it the perfect optical switch for demanding manufacturing applications. The FTBx-9160 MEMS Optical Switch is available for singlemode fibers with a choice of 1x2, 1x4,1x8, 1x12, 1x16, 1x24 and 1x32 modules.
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Product
Pressure Sensors
ESCP-MIS1 Sensor
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ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES’s innovative microfabrication process for silicon capacitive sensors.
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Product
PXI/PXIe MEMS Optical Switch, Dual Insert/Bypass, Single-Mode, 9/125 Fiber, MU Connectors, With Interlock
42-860A-322-HI
Switch Module
The 40/42-860A-322-HI is a PXI/PXIe dual insert/bypass switch with MU connectors,, includes hardware interlock and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
PXI/PXIe MEMS Optical MUX, 8-Channel, Multi-Mode, 50/125 Fiber, SC/PC Connectors
42-852A-218-M50
Multiplexer Module
The 40/42-852A-218-M50 is a PXI/PXIe 8-channel multiplexer with SC/PC connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications.
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Product
Low Noise High Precision High Voltage Amplifier
WMA-280
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The WMA-280 is a high voltage, low noise precision amplifier. Its specifications have been designed to serve the needs of a wide variety of high-tech experiments. The WMA-280 can be used for MEMS actuation, EO-modulators, as high voltage driver for PZT (piezo) positioners, ultrasonics, and many other applications. Its output noise is only 300 microVolt rms.
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Product
MEMS Gyroscopes
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Safran designs and manufactures high-precision tactical grade MEMSMicroElectroMechanical System. See also gyro sensors for demanding applications. We serve a global customer base in the Defense, Industrial, Aerospace and Commercial markets with ITAR-free solutions utilized in a wide range of applications. Our miniature MEMS gyro modules offer our customers compact and cost effective solutions while maintaining high performance and accuracy requirements.
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Product
PXI Dual 2 x 2 Fibre Optic (M Mode) ST M50
40-860-522-M50
Switch Module
Pickering PXI Fiber Optic MEMS Switching cards are available in many high density formats with a choice of 5 different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications. Fiber optic multiplexers create a signal path by redirecting the optical signal into a selected output fiber. This is achieved using Micro-Mechanical Mirrors driven by a highly precise mechanism and activated via an electrical control signal.
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Product
LXI Single 32 Channel Fiber Multiplexer SC, Multi-Mode With Loop-Thru
60-851-224
Multiplexer Module
The 60-850 and 60-851 are LXI conformant fiber optic multiplexers that use MEMS switching technology to ensure fast and reliable switching of single-mode (60-850) or multi-mode (60-851) optical signals being carried on fiber connections. The 60-850/851 is available with a variety of connector options and in a variety of multiplexer arrangements. Loop-thru versions are also available for easy multiplexer expansion.
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
