3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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3D AOI
Zenith2
Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D Scanner
Artec Eva
This structured light 3D scanner is the ideal choice for making a quick, textured and accurate 3D model of medium sized objects such as a human bust, an alloy wheel, or a motorcycle exhaust system. It scans quickly, capturing precise measurements in high resolution, which allows for almost unlimited applications, without the use of additional equipment.
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3D Sensors
Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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FieldMaster 3D
Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Measurement Arm
FaroArm
The FARO Focus3D is a high-speed 3D laser scanner used for generating point clouds and capturing detailed 3D images for documentation purposes.
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3D Audio Servers
GoldSeries
AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Direct 3D RightMark
D3D RM
D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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3D Software
Geomagic Control X
Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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3D Digital Inspection
Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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3D Helmet Coil
With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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3D Profile Sensor
Z-Trak2
Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Breakout - General Purpose USB to GPIO+SPI+I2C
FT232H
This chip from FTDI is similar to their USB to serial converter chips but adds a ''multi-protocol synchronous serial engine'' which allows it to speak many common protocols like SPI, I2C, serial UART, JTAG, and more! There''s even a handful of digital GPIO pins that you can read and write to do things like flash LEDs, read switches or buttons, and more. The FT232H breakout is like adding a little swiss army knife for serial protocols to your computer!
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High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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3D Antennas
A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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SPI Flammability Tester (Vinyl Material)
TF318
TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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Metra Scan 3D
The most accurate scanning and probing solutions, whether in lab or on the shop floor.Highly accurate measurementDynamic referencingComplete metrology solution
