BGA
Surface mount chip package, which uses solder balls for its connectors.
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BGA Socket And BGA Adapter Systems
Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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X-Ray Inspection System
MX1
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Low Power FPGA Featuring Hardened MIPI D-PHY, LVDS, SLVS, SubLVDS, & Open LDI Bridging
CrossLink
*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
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Write!BEFORE Socket Programmer
Socket Adapters are printed circuit boards that connect the programming sites to the base unit. The Socket Adapter (SA) includes the appropriate socket (DIP, SDIP, SOIC, QFP, BGA) and the appropriate electrical connections for programming a specific device.
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Low-power, High-performance FPGA
iCE40 LP/HX
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
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X-ray Inspection System
RTX-113HV
Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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DDR3 X16 Non-Stacked DRAM BGA Interposer For Logic Analyzers
W3636A
The W3636A DDR4 x16 BGA interposer allows you to gain signal access to the DDR3 signals critical to your debug and validation effort through a logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DDR3 x16 non-stacked DRAM or with an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR3 signals without impacting the performance of your design.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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Signal Integrity Evaluation up to 26.5 GHz
N5222BT
The N5222BT provides the N5222B 26.5 GHz PNA, application software including PLTS and enhanced TDR, and accessories for signal integrity evaluation of cables, backplanes and BGA packages.
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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BGA Rework Station
PDR IR-D3 Discovery
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
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Signal Integrity Evaluation up to 50 GHz
N5225BT
The N5225BT provides the N5225B 50 GHz PNA, application software including PLTS and Enhanced TDR and accessories for signal integrity evaluation of cables, backplanes, and BGA packages.
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Ultra High Speed Pick & Place
MC889
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Automatic Test System
Star-Rec
Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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In-Circuit Tester Integration
The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
