BGA
Surface mount chip package, which uses solder balls for its connectors.
-
Product
Low Power MIPI Bridging Solution With Integrated Flash
CrossLinkPlus
-
*Instant-on (< 10 ms) configuration with integrated flash memory*Integrated flash enables flexible reprogramming in the field*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port*11 programmable, source synchronous I/O pairs for camera and display interfacing*Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch*Comprehensive library of IP and reference designs, compatible with CrossLink
-
Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
-
Product
SMT/BGA Rework Station
PDR IR-C3 Chipmate
-
The PDR IR-C3 Chipmate entry level SMT/BGA rework system is specifically designed to be lower cost but still cope with the challenges of repairing today's small, medium sized PCB assemblies.
-
Product
Signal Integrity Evaluation up to 26.5 GHz
N5222BT
Network Analyzer
The N5222BT provides the N5222B 26.5 GHz PNA, application software including PLTS and enhanced TDR, and accessories for signal integrity evaluation of cables, backplanes and BGA packages.
-
Product
X-Ray Inspection System
MX1
-
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
-
Product
X-ray Inspection System
RTX-113™
-
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
-
Product
Semiconductor Package Inspection System
-
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
-
Product
Grypper "Y"
-
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
Product
DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
Interposer
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
-
Product
Silver Ball Matrix Sockets
-
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
-
Product
Soldering Inspection Video Microscope
MS-1000
-
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
Product
BGA Rework Station
PDR IR-E6 Evolution
-
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
-
Product
Digital Demultiplexers
-
Advanced Science and Novel Technology, Co., Inc.
24:48 digital demultiplexer (DMUX) with SSTL1.5 input and output interfaces.Supports data rates from 1.0Mbps to 2.0Gbps.User-controllable independent internal delays for data and clock signals.1.5V I2C control interface with a user-defined 3-bit chip address.Preset function for synchronization of multiple parallel devices.Full-rate output copy of external high-speed clock input signal.Two pairs of clock divided-by-2 and synchronous clock enable outputs for supporting the tree-type demultiplexation structure.Additional synchronous clock divided-by-4 output.Dual power supply of +3.0V and +1.5V.Industrial temperature range.Low power consumption of 2.1W at 2.0Gbps.Available in custom 256-pin BGA package (13mm x 13mm x 2.5mm).
-
Product
X-ray Inspection System
NEO-690Z / NEO-890Z
-
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
-
Product
BGA Sockets
-
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
-
Product
Advanced Diagnostics for ScanExpress™ JET JTAG Embedded Test Solutions
ScanExpress JET Advanced Solutions
-
ScanExpress JET advanced diagnostics add additional diagnostic resolution with fully automated analysis translating functional test results to down to the net and pin level, even with BGA packages.The seamless integration with ScanExpress JET and ScanExpress Runner as well as the ability to output ScanExpress Viewer fault reports for PCB visualization make ScanExpress JET Advanced Diagnostics a must-have tool for any JTAG test system.
-
Product
Silver Button Sockets
-
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
-
Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
-
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
-
Product
BGA Rework Station
PDR IR-D3 Discovery
-
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
-
Product
PMC Module
PMC-CIV-COM-ISO
PMC Module
User Programmable AlteraCyclone IV FPGA 484 BGA:• Stand alone possibility• Single wide PMC Module• 20 LVDS,2 RS-422,1 RS-232• Optional User clock oscillator
-
Product
GHz Elastomer Sockets
-
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
-
Product
TDR System
TS9001
-
The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
-
Product
Low-power, High-performance FPGA
iCE40 LP/HX
-
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
-
Product
DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
Interposer
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
-
Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
-
Product
BGA SMT Adapters
Giga-snaP™
-
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
Product
Ultra High Speed Pick & Place
MC889
-
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
-
Product
High-speed In-Line 3D CT Inspection System
X-eye 6300
-
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
-
Product
Futureproof Your Control PLD And Bridging Designs
MachXO3
-
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
-
Product
Circuit Card Assembly
-
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
