DIMM
Dual In-line Memory Module.
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Product
Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
Registered DIMM
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a type of RAM module featuring a hardware register (RCD) between the DRAM chips and the system's memory controller.
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Product
Registered DIMM DDR4 3200/2933/2666
SQR-RD4N
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100% Screening Test, Compatible with server platform, Original IC chip adopted, 30u” golden finger.
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Product
DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
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Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Product
S.O. DIMM Converter
DDR 200-pin
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The RAMCHECK DDR 200-Pin Converter is a perfect low-cost solution for testing modern laptop DDR memory. The converter plugs directly into the 184-pin RAMCHECK DDR main adapter, providing you with fast, convenient testing capabilities
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Product
DDR4 RUGGED DIMM
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A Rugged DIMM (Dual In-line Memory Module) is a specialized type of computer memory module designed to operate reliably in harsh, demanding environments that would cause standard commercial RAM to fail.
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Product
DDC (Dual DIMM Carrier) DIOS Adaptor
JT 2702/DDC
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The JT2702 Digital 256 channel JTAG I/O module. JT2702/DDC (Dual DIMM Carrier) is a DIMM DIOS accessory product. It is typically used in custom test adapters or fixtures where a large number of digital I/O channels are required with a minimum space overhead.
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Product
DIMM Interposer Probe
FS2361
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The FS2361 is a logic analyzer probe used to test DDR3 DIMM memory. When used with the triggering and analysis capabilities of Keysight’s U4154/64 Logic Analyzer modules, it gives the user an extremely effective tool for debugging, testing and verifying DDR3 DIMMs.
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Product
Registered DIMM
SQR-RD5N
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Registered DIMM DDR5 4800/5600/6400, Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB, 100% Screening Test. Compatible with server platform, Original IC chip adopted.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
DDR3 MSO Probes
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The DDR3 DIMM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR3 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR3signals for convenient analog probing.
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Product
Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Product
260pin SODIMM ECC DIMM
SQR-SD4(ECC)
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ECC SODIMM DDR4 2133/2400/2666, Data transfer rate: 2133/2400/2666 MT/sCapacity: 2GB~16GB. Original IC chip (Samsung/Hynix) ECC function support, Wide temperature range support -40oC~85oC.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
Motherboard
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
DRAM Memory Module DDR3 Memory
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Deliver stable memory technology with Advantech! We offers DDR3 1866/1600/1333 memory with 30μ" gold plating connector (240 pin) featuring 1.35v/1.5v low operating voltage and better bandwidth. With rigorous reliability, vibration tests, and 0 ~ 95℃ (32 ~ 203℉) wide operating temperature range, our certified DIMM is suitable for edge computing, enterprise, embedded, automotive, data centers, and networking applications.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Micro-ATX Motherboard 6th/7th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-585SV
Motherboard
Supports SUSI, WISE-DeviceOn and Edge AI SuiteSupports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports PCIE Gen3, 10 x USB 3.0, 2 USB 2.0, 8 x SATAIII, 1 miniPCIe(mSATA) and dual GbE LANSupports Intel AMT 11.0 and Intel vPro competentSupports DVI-D,HDMI2.0 ,DP++,eDP,VGAdisplayFour DIMM sockets support up to 64GB DDR4 2133/2400 MHz SDRAMSupports Intel® Xeon®/ 6th & 7th Gen Core™ i7/i5/i3 processor with C236 chipset
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
Motherboard
IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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Product
4U AI GPU Edge Server
AXE-7400SR
MEC Server
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
