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3D
three dimensions.
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3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Measuring Laser Microscope
LEXT OLS5000
The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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Universal 3D Measurement Software
Metrolog
Get a real performance accelerator for your 3D measuring devices and more.Not only does Metrolog X4 architecture benefit from current computer and OS technologies significantly increasing the performances and metrology software throughput, but it also simplifies your day-to-day measurement workflow.
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Industrial CT Scanning Services
Computed tomography (CT) is also referred to as industrial x ray and industrial imaging. It is an x-ray methodology yielding 3-dimensional (3D) results by placing an object on a rotational stage between an x-ray tube and x ray detector, rotating the object 360 degrees and capturing images at specific intervals—such as every degree or every half degree.
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Multibeam Profiler Sonar
MB1350-N
At 1.35 MHz, the MB1350 delivers 3D profile data at levels more akin to a laser line scanner than today' low frequency bathymentry systems. Mountable on Boats, ROVs, UUVs, and Tripods, BlueView's MB1350 is the right tool to take your operation into the next generation of 3D bottom and structure mapping.
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Ultra High Performance 3D CT System
UltraTom
3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Designer 2.0 Vision Software
Cognex Designer is an integrated development environment for 2D multi-camera and 3D vision applications. Creating machine vision applications has become increasingly complex over the years, and Cognex Designer provides the tools for breaking down the complexity into manageable tasks in order to complete vision projects successfully in a shorter period of time.
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Series of Software
ME’scope
Multi-channel time or frequency data can be imported from disk files, or directly from a machine or structure. The industry-leading photo-realistic interactive 3D shape animation allows you to observe order-related operating deflection shapes from running machinery, resonant vibration and mode shapes from real structures, vibro-acoustic shapes, and engineering data of any kind derived directly from experimental data. ME’scope contains state of the art tools for performing:
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Coordinate Measuring Machines
Novacam's 3D Non-Contact Coordinate Measuring Machines are designed with versatility and superior performance in mind: Precision (better than 1um) Speed (1-30 thousand measurements per second) Simultaneous dimensional and surface inspection Smallest probes measuring 0.9mm in diameter Automation by teaching with joystick Portability
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Gear Metrology System
The Gear Metrology System is a non-contact gear inspection system that generates a 3D point cloud, providing manufacturers with real-time metrology and inspection data to optimize production processes, and improve ROI.
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Multibeam Profiling Software
MB-DataLogger
Teledyne BlueView's MB-DataLogger software provides a powerful tool for multibeam profiling applications. From mission setup to data playback, review, and export, MB-DataLogger gives users full end-to-end mission support. Set up data collection parameters (sonar head range, ping rate, filename identifiers, etc.) for a SmartCore-enabled system prior to deployment, then review bathymetric profiles in a 2D or 3D waterfall display with or without navigation correction post mission. When regions of interest are identified, export batches of data files to georeferenced point clouds to be imported by third-party applications. MB-DataLogger is the software Swiss army knife for your BlueView multibeam profiling system.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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PANELMAP
PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Ultra HD 4K Video Generator / Analyzer
DGA-6000
128 Preset Patterns - plus variable sizes, surrounds & user-defined colors 70 additional Motion Patterns plus color selections (Pro option) 33 3-D Formats - all patterns plus interactive 3-D Crosstalk pattern HDR / Rec2020 / User-defined 10-bit RGB triplets / Audio signal verification
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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SUNTEST
XXL+ FD
Atlas Material Testing Solutions
The Atlas SUNTEST XXL+FD is an extra-large light stability test chamber especially tailored towards the needs of consumer goods, food and beverage testing. Its 3000 cm2 flatbed exposure area and tall chamber height is best-in-class for 3-D specimens testing and can accommodate all types of bottles and packaging.
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PDS Motionscan Software
Allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platformTeledyne PDS MotionScan system allows a 3D Scanning sonar user to collect motion compensated 3D point clouds from a moving platform. The MotionScan system is comprised of: an RTK capable dual antenna GPS with precision heading output, a heave, pitch and roll sensor, a topside control console. In combination with a BlueView 3D Multibeam Scanning Sonar this creates a full survey package.
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3D Multibeam Scanning Sonar
ProScan™
Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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AATCC Wrinkle Recovery Tester
M272
To determine a fabric's ability to recover after wrinkling under a predetermined load for a set period of time. Set of 3-D plastic replicas are available to grade fabrics.
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Coaxlink Quad 3D-LLE
Laser line extraction with zero host CPU usageSingle and Dual Laser Line Extraction into a depth mapReal-time generation of 16-bit 3D height mapsChoice of algorithms: Maximum, Peak, Center of Gravity (COG)Precision: up to 1/256 pixel (with Peak and COG algorithms)Performance: 19,000 profiles/s from 1024 x 128 images. 38,000 profiles/s from 1024 x 64 imagesMemento Event Logging Tool
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ATR 3D Layout Machine
ATR Model is standrad layout machine for marking work and 3D measruing.
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ADV Acoustic Doppler Velocimeter
10-MHz
The SonTek/YSI 10-MHz ADV (Acoustic Doppler Velocimeter) is a proven, accurate solution for high-precision, 3-axis (3D), velocity measurements in a wide variety of settings from the laboratory to the ocean.
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PDS Excavator Monitoring System
It shows a real time overview of the excavator in navigation, profile, and 3D views; displaying the dredge tool, pontoon/vessel, design depths, and color-coded digital terrain model (DTM). The navigation view highlights the high and low spots and is updated in real time, recording the progress of the dredging work. The recording follows the shape of the dredge tool and is visible immediately in all views. Up/down indicators show the operator the exact distance to the seafloor and design depth continuously. 3D design models allow the use of complex designs. The monitoring system can also be used for a remote presentation on the bridge of the vessel and it is possible to draw the vessel in the views of the excavator as well.
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3D Micro Coordinate Measurement Machine and Surface Roughness Measurement Device
InfiniteFocusSL
With the InfiniteFocusSL you are able to measure form and roughness of your components with only one system. In addition, color images with high contrast and depth of focus are achieved. The robust frame and the intelligent illumination technology provide fast and high-resolution measurement in the laboratory and a production near environment. The measurement system is particularly attractive due to its cost effectiveness, measurement speed and usability. The long working distance in combination with the above average measurement field allows a wide range of applications. Measurements are achieved within seconds, and features, such as a coaxial laser for quick and easy focusing, enhance its usability.
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Surface Profiler Measurement System
SP series
SP series, high accuracy 3D surface profiler measurement system with white light interferometry.
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UV Meters
OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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PDS Cable Lay Monitoring Software
- Accurate and reliable- Maximum use of engineering preparation- Visualise the cable lay process in 3D, top, and profile views- Different routes for vessel and pipe- Automatic dog legs guidance at the end of the cable- Computed cutting points are shown- Optimum control of your project
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3/4D Image Visualization and Analysis Software
Imaris
Our latest release, Imaris 8.4, introduces a new and innovative approach to tracing neuron structures in 3D images. Torch™, a patent-pending tool which intuitively highlights structures in close proximity to the cursor while darkening the rest of the image, enables users to efficiently and accurately trace individual neurons within dense and thick samples. Improved depth visibility makes tracing in thick samples easier than ever before, allowing for the selection of a dynamic region of interest for tracing. All of this possible with terabyte-sized datasets.
