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3D
three dimensions.
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High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Non Destructive Analysis
The submicron resolution of a submicron focus X-ray tube and digital image detection offers in 2D and Oblique View with High Magnification imaging mode high resolution X-ray images. A 3D image of the sample can be reconstructed from multiple image recordings during a 360° rotation of the sample. Virtual any cross section can be viewed at an offline workstation. This mode is a strong tool for multi-material components.
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Multi-Functional Optical Profiling system
7505-01
Chroma 7505-01 is the newest multi-function optical inspection system that equips with the capability of measuring 1D, 2D and 3D at the same time. Penetrating reflection measurement is used for 1D film thickness measurement to measure the non-destructive film thickness on transparent and translucent material.
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Ultra High Performance 3D CT System
UltraTom
3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Robot Guidance
Single Spot
Point applications, such as handling, welding, bolting, adhesive spots etc. often need precise positioning of the tool. Only this way the specified product quality can be achieved. The Single Spot Solution measures local part tolerances prior to the application and delivers the 3D data for correction of the application points.
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3D Audio Servers
GoldSeries
AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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IP Cores
logicBRICKS IP Cores by Xylon - for applications including compact multilayer video controller, versatile video input, multiview 3D transformation engine, image signal processing (isp) ulstraHD pipeline, high dynamic range pipeline, scalable 3d graphics accelerator, DDR3 SDRAM Memory Controller, slave hssl controller, HDR image signal processing framework, video design framework for multi-camera vision applications, and more
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High Performance UV Nanoimprint Resist
AMONIL®
UV Nanoimprint is a mechanical molding technique. A template made from quartz or a flexible elastomer with a 3D relief is brought into intimate contact with a UV-curable resist spin-coated on top of a substrate. Applying low imprint pressure at room temperature features are filled within seconds due to the low viscosity of the imprint resist. The resist is hardened via UV-light through the backside of the template. Finally substrate and template are separated. The replicated resist relief can further be transferred into the substrate via RIE-process or used as functional element.
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3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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H/E fieldmeter
ESM-100
The 3D H/E fieldmeter ESM-100 is a patented, unique hand held measuring instrument. It can easily measure electric and magnetic alternating fields simultaneously, independent of their direction, and at one point. With this piece of equipment it is possible for anybody, to carry out quick, professional and error-free measurements, right from the beginning
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High Powered External IP Transmitter
PowerSting
The PowerSting is a series of external high power transmitters (5kW, 10kW, and 15kW) for the SuperSting R8/IP/SP and SuperSting R1/IP/SP. The PowerSting system is a fully programmable constant voltage//constant current source. The PowerSting system comes with an SGS generator and a wireless repeater box, and operates in both wired and wireless modes. The applications of the PowerSting-SuperSting system include vertical electrical sounding, 2D electrical imaging, 3D electrical imaging, 3D offset electrical imaging of a 2D survey line in both manual and automatic modes.
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Vibrational Analysis
GEMINI-2
GEMINI-2 is the compact solution for HVSR, MASW and Vibrational Analysis: a single waterproof container with integrated high-performance 3D geophone and low resonance frequency (2Hz sensors, suitably coupled) and a powerful real 24-bit acquisition card with USB port for connection to an external PC.
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832x600 Pixel High Resolution Time-of-Flight (ToF) CMOS Image Sensor
Hydra3D+
Hydra3D+ is a 832 x 600 pixel resolution Time-of-Flight (ToF) CMOS image sensor, designed with Teledyne e2v’s proprietary CMOS technology, and is tailored for versatile 3D detection and measurement.
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Electrical Tomography Software
Res3dinv
In areas with complex geology, there is no substitute for a fully 3D surveys. The arrays supported include Pole-Pole, Pole-Dipole, inline Dipole-Dipole, equatorial Dipole-Dipole, Wenner-Schlumberger and also non-conventional arrays.RES3DINV uses the smoothness-constrained least squared inversion technique to produce a 3D model of the subsurface starting from the data of apparent resistivity.
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3D Optical Profiler
Nexview™ NX2
Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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PCI Express Graphic Card with NVIDIA® Quadro® P2200
Quadro-E PEG P2200
The Quadro-E PEG P2200 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1280 CUDA cores, 5GB GDDR5 onboard memory and support for up to four 5K (5120x2880 @ 60Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Water Current Profiler
ADP
The SonTek/YSI ADP (Acoustic Doppler Profiler) is a high-performance, 3-axis (3D) water current profiler that is accurate, reliable, and easy to use.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Vector 2D Electromagnetic Solver
QuickWave-V2D
QuickWave V2D is a unique on the market and ultra fast Vector 2D (QW-V2D) electromagnetic solver is applicable to the analysis of axisymmetrical devices (which are also called Bodies Of Revolution) as large as 2100 wavelengths, including antennas (horns, rods, biconical), circular waveguide discontinuities, and resonators. It is based on the Maxwell equations re-expressed in cylindrical coordinates. Definition of a 2D long-section of the structure allows for hundreds times faster simulation than brute force 3D analysis.
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SMARC
ROM-7421
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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COM Express Type 10 Mini Module With Intel® Pentium® & Celeron® N3000 Series Processors
CEM300
The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
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Fast Particle Sizer Spectrometers
To measure rapidly-evolving aerosols (such as engine or 3D printer emissions), you need a particle sizer that can keep up. TSI has several fast particle sizer spectrometers that are designed for such situations. Whether your application requires 1 Hz (or faster) size distributions, a soot-specific data inversion, or sample dilution, TSI has a fast sizing solution.
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Small Fanless 3D Control FAYb Laser Marker
LP-M Series
Panasonic Industrial Devices Sales Company of America
The LP-M series offers a small, fan-less head design with an IP64 protection to prevent dust and water entering from any direction. The 3D Control capability allows marking on various types of products and complicated shapes to meet a large number of application needs. - 20, 50 & 100 Watt Models- Compact IP64 Rated Head- Full 3D Features- Auto Focus capable- Redundant Safety Features
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Aurora®
The Aurora® electromagnetic tracking solution provides unobstructed real-time tracking of micro sensors that can be embedded into rigid and flexible OEM medical instruments such as ultrasound probes, endoscopes, catheters, guidewires – even at the tip of a needle. With the Aurora® electromagnetic tracking solution, no line-of-sight is needed for in-vivo tracking of instruments through twisting anatomical tracts. When integrated as a component into the workflow of OEM image-guided surgery or interventional systems, the Aurora acts as the link between patient image sets and 3D space, enabling the instruments’ positions and orientations to be instantly localized and visualized within the operative field. It does so with the exceptional speed, accuracy, and precision required by today’s most demanding minimally invasive approaches.
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Scanners
Triangulation laser scanner - a powerful tool for capturing high-precision 3D models of objects and environments. With its advanced laser triangulation technology, our scanner is able to capture millions of data points per second, resulting in highly accurate and detailed 3D models.
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Offline Programming, Advanced Simulation & Digital Twin
Silma
Improve your 3D measurement experience with a winning combination: Silma, for advanced simulation and digital twin of your 3D measurement process, and Metrolog for on-machine execution and analysis.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
