SoC
A complete computer "System on a Chip".
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Product
SoC Integration At RTL
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Before logic synthesis, STAR enables full implementation capabilities towards IP and connectivity insertion with a real-time monitoring of the integration progress. This enables SoC creation in minutes and maximize design reuse from existing projects.
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Product
SOC Battery Tester
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This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
Computer on Module
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
Test System
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
Software Development Kit
The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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Product
Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Product
Intel® Xeon™ D SoC (Skylake-D), PCIe Gen3 And Dual 40GbE, 6U VPX
VPX762
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The VPX762 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel Xeon D-2183IT or D-2143IT processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
Software Development Kit
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
SoC Test Systems
Test System
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
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*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
Computer on Module
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
Qseven V2.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio And CAN
Q7M120
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*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
Intel® Celeron N3160/N3060 SoC, Intel® Atom E8000 SoC, 3.5" SBC, DDR3L, VGA, HDMI, 48-Bit LVDS, 2GbE, Mini PCIe, MSATA, SUSI API
PCM-9310
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Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GBDirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
Computer on Module
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
Air-Cooled Universal Test Platform
Diamondx
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Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0
SCM180
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The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
Software Development Kit
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
Processor Blade
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
Rugged PC Compatible
SYS-427
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WINSYSTEMS’ SYS-427 is a rugged, embedded computer featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and industrial IoT markets.
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Product
1U Rackmount Network Appliance Platform With Intel® Atom® Processor C2558/C2758 Up To 2.40 GHz And 6 GbE LANs
NA361R
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The NA361R is 1U rackmount network appliance platform for VPN, Firewall, UTM and other network applications. It supports low power Intel® Rangeley Atom™ Soc up to 2.4 GHz processor. The NA361R empowers its performance on Rangeley with 8 cores and supports Intel® AES New Instructions (AES-NI) and VT-x virtualization while the new Crypto Engine enables Intel® 4 x DDR3 UDIMM socket up to 32GB, unbuffered non ECC/ECC memory (dual channel) and QuckAssist Technology that supports 128, 192 and 256-bit AES, 3DES, DES. To prevent problems from sudden shutdown, the NA361R supports LAN bypass function through software program, and supports two 2.5" SATA HDD or one CompactFlash™ for storing event log data. It also supports one expansion slot for 1G or 10G NIC card for optional.
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Product
3.5" Embedded SBC With Intel® Celeron® J1900 Processor, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO
CAPA843
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The CAPA843, a fanless 3.5-inch embedded board, features quad-core Intel® Celeron® processor J1900 SoC (codename: Bay Trail). A pair of SO-DIMM sockets supports up to 8GB of DDR3L 1066/1333MHz RAM. The compact size embedded board CAPA843 was designed with emphasis on expandability, offering two full-size PCI Express Mini Card slots, as well as an exclusive Axiomtek ZIO connector. With excellent thermal design, the 146 x 102mm embedded SBC can handle operating temperatures from -20°C to 70°C, and runs on +10V to +24V DC input. The 3.5” fanless embedded board provides three display interfaces with dual-display operation: HDMI, LVDS and VGA. The Axiomtek CAPA843 is an excellent choice for applications in IoT/M2M-related, industrial control, self-serve terminal, gaming, digital signage, POS, and kiosk.
