SoC
A complete computer "System on a Chip".
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM2-BT2
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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SMARC Module
LEC-MTK-I1200
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Test And Product Engineering Services
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
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6U CompactPCI Intel® Atom™ Processor Blade
MIC-3398
The MIC-3398 is a Low-Power 6U CompactPCI® CPU blade with best in class price/performance ratio tailored for applications that require a state of the art processor platform based on Intel® Architecture with full IO capability at an attractive cost point. The MIC-3398 supports Intel® Atom™ E3845 and Celeron N2930, J1900 SoC (system on a chip) family previously codenamed Bay trail with a maximum of quad-core 2.00 GHz processing performance. Intel® Atom™ technology provides significant increases in performance and energy efficiency by using the 22nm Intel® manufacturing process making it an ideal choice for control and workstation applications that require passive cooling with a power dissipation as low as 10W. Up to 8GB, dual channel 1333 MHz DDR3L memory with ECC support provide a high performance and robust memory interface for demanding applications. With built-in graphics based on Intel® HD Graphics Technology this blade offers a significant improvement in graphics performance compared to previous generation platforms. Support for an onboard 2.5” SATA-II drive as well as CFast SSDs adds comprehensive mass storage support. On the system side, the MIC-3398 supports 32-bit, 33MHz and 64-bit, 66MHz PCI bus interfaces to a CompactPCI backplane. A rich set of I/O interfaces such as DVI-D, USB3.0/2.0, Gigabit Ethernet and RS-232/422/485 ports round off the feature set. In addition to the single slot wide (4HP) board offering, a dual slot wide (8HP) version of the blade offers additional network connectivity by increasing Gigabit Ethernet port count from two to four.
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Verification IP's
SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
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PCIe/104 OneBank SBC w. Dual 1GHz ARM9 & 1Gbyte DDR3
EMC²-Z7015
Sundance Multiprocessor Technology Ltd.
The EMC²-Z7015 is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC, Artix-7 FPGA fabric and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-Z7015 is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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COM Express Type 7
ROM-8720
Advantech ROM-8720 COM Express Type 7 Compact Computer-on-Module is powered by NXP LS1046A SoC which includes four Arm Cortex-A72 cores for Edge networking and Edge firewall, two 10Gbsp-KR and up to four Gbps for the networking communications. Three PCIe, three USB 3.2 Gen1 and three USB2.0 for the embedded interface expansions. two UART, one SPI and 8 GPIO for embedded device controls.
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FPGA Boards
For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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Low speed Serial Interfaces
12C/ 12S/ SPI/ UART
Arasan has a diverse portfolio of connectivity IP products including SPI, I2C, I2S and UART. These protocols are vital for the integration of SoCs with peripheral chipsets in order to form a complete hardware platform. They are frequently used by the SoC to configure, control and gather diagnostic information at the platform level to ensure correct operation of the hardware.Arasan's proven Connectivity IP Solutions provides a risk free path to integrating these interfaces in SoC designs:High quality IP cores ensure inter-operability between SoCs and peripheralsIn-house domain expertise ensures a high quality support throughout the SoC development cycleTotal IP solution includes RTL source code, synthesis scripts, test environment and documentation
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IC-INT-VPX6e, 6U VPX
IC-INT-VPX6e
The IC-INT-VPX6e, powered by an Intel® Xeon® D Series Broadwell DE SOC, offers unparalleled capabilities to applications requiring high-performance computing in critical and rugged environments.
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Hybrid Verification Platform
HES-DVM
HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Custom Sensor Development
X4M03 | X4M06
Kickstart your sensor product development with the XeThru development platform, and quickly develop a prototype using certified radar sensors and your programming language of choice, be it MATLAB, Python or C++. All embedded functionality for your radar sensor project is included; access to parametric control of the XeThru X4 UWB radar SoC, the back-end data processing it demands, and communcation stacks that connects to the host software running on Windows, Mac, Linus and embedded targets.
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Core Alignment Splicer
Model：95S
OFS-95S fiber optic fusion splicer is designed as a highly flexible instrument with 6-motor precise micron levelcontrol and splice loss lower than 0.02dB for G.652 fiber. Equipped with removable universal fiber holders (250μm/900μm/patchcord/FTTx indoor fiber etc.), SOC holder and internal thermometer / barometer, OFS-95S can be deployed anywhere. Fast 5s startup, 9s splicing and automatic heating features enable the splicer an efficient tool for large volume splicing operation during fiber installation and maintenance.
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Signal Board Computers
PX1-C415
WINSYSTEMS’ PX1-C415 single board computer (SBC) is a PC104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel® Atom™ E3900 series SOC processors (formerly known as Apollo Lake-I). Its small size, rugged design and extended operational temperature make it a great fit for Industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Industrial Mini-ITX Motherboard With Intel® N97 Processor
AmITX-ALN
- Intel Alder Lake N SoC processors, N97- Single channel DDR4 3200 MHz memory up to 32 GB- Triple independent display: HDMI 2.0b, DP 1.4a (from Type C), VGA, LVDS or eDP- Dual GbE ports: 2x 2.5GbE- Expansion slots: 1x PCIe Gen3 x1, 1x USB 3.2 Gen2 Type C, 4x USB 3.2 Gen1, 6x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 1x M.2 M-key- 12 to 28V DC-in
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Foundation IP
TSMC
Our Foundation IPs embed power management features (multi-Vt/multi-channel libraries, multi-VDD characterization, integrated power-switches, source-biasing…) which allow designers to explore the SoC architecture. Optimal configurations can be generated to meet the application’s Performance, Power and Area constraints. We also complement our offering to reach best-in-class Energy Efficient SoC by serving Always-On power-domains with a dedicated offer, optimized to achieve the ultra-low-power requirements of battery-operated devices in sleep mode.
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, CANbus, 2 LANs And DIO (2-in/1-out)
IFB112
The IFB112.supports the low power consumption NXP (Freescale) i.MX6UL ARM® Cortex™-A7 528MHz SoC. The design concept of IFB112 is aiming to meet the demands of mission-critical applications. The gateway controller with IP30-rated aluminum and steel enclosure supports an extended operating temperature ranging from -40°C to 70°C, a wide voltage range of 9V - 48V DC power input with terminal block, and has been designed to withstand vibration up to 5G. For system integrators with wireless communication needs, the IFB112 has one PCI Express Mini Card slot, one SIM card slot, and two internal antennas. It supports one serial port, two LANs and one CANbus port to enable fast and efficient data acquisition and communication. Its digital I/O port provides users with a convenience of digital devices connection.
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PC/104 OneBank Carrier
EMC²-SoM
Sundance Multiprocessor Technology Ltd.
The EMC²-SoM is a PCIe/104 OneBank™ Carrier for a Trenz compatible FPGA and SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board. It also has I/O pins, using a 100-way Samtec RazorBeam connectors system, the “Sundance Expansion Interface Connector” (SEIC) can be customize for individual applications and bespoke connectors.
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Intel® Xeon™ D SoC (Skylake-D), PCIe Gen3 And Dual 40GbE, 6U VPX
VPX762
The VPX762 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel Xeon D-2183IT or D-2143IT processor, the efficient SoC design has low power consumption and integrated PCH technology.
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3U OpenVPX Module
VPX3-ZU1B
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
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COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
