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Fuel Cells
continuously variable contact pressure ensures complete reproducibility of the test conditions ● independent of the thickness of the fuel cell components due to the self-adjusting piston and special sealing concept ● no connection and disconnection of hose- or cable connections for the exchange of cellFixture necessary ● fast &Easy clamping of the cellFixture without tools and precise exchange of the internal cell components ● maximum power density by determining the optimal contact pressure on the active cell surface ● developed for high stress in the field of quality assurance and laboratory environment
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Anti-Sulfurated Thick Film Type Resistors, Precision Type
ERJ-U2R/ERJ-U3R/ERJ-U6R Series
Panasonic Industrial Devices Sales Company of America
High Precision And High Resistance To Sulfurization In One Resistor!Panasonic's ERJ-U2R, ERJ-U3R, ERJ-U6R (ERJ-U*R Series) offers high precision and also provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection. High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-U*R Series Resistors. AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-U*R Series of High Precision, Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Terahertz Systems
Non-destructive and non-contact coating thickness measurement of organic single and multilayer systems as well as material analysis.
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Thickness and Flaw Inspection
OmniScan SX
Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Wet Film Wheels
3230
By rolling the gauge through a wet coating, the centre wheel eventually touches the film. This point on the scale indicates the thickness.
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XRF Instruments
FISCHERSCOPE® X-RAY XRF measuring instruments are exactly what you need. Precise, fast, reliable and durable: Measure coating thicknesses and analyze materials non-destructively, contact-free and conveniently. The instruments are easy to use and suitable for almost any application.
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Thick Film Bleeder
GBR-350
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Multi-Element Standards
These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Erichsen Cupping Testing Machine
GBW Series
Jinan Testing Equipment IE Corporation
GBW series Erichsen Cupping Testing Machine is designed on the basis of screw universal material testing machine. The Erichsen Cupping Tester is suitable for cupping test of metal sheet and strip steel rolled stock etc to evaluate the plastic deformation performance and ductility. The cupping test for metal sheet thickness range is 0.1mm to 5mm, Max. punching capacity is 300KN, and the pre-tightening device is optional either with hydraulic servo loading pump or manual loading pump.
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Customized Ellipsometers
~0.1 nm thickness difference can be seen by IE-1000.Thickness distribution of thin film can be imaged.Thickness and optical images of semiconductor device, display, and bio samples.IE-1000 can show the images which can not be seen by conventional microscope.Defect of semiconductor and display can be seen directly.Easy and fast operation.
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Compact Passive and Active Resistor Trimming for Thick and Thin Film
LRT 2000C
*Travel: 6" x 6"*Laser : Fiber Laser Ytterbium 1064 nm*Kerf: 30 to 80 micron Adjustable*Pulse width : 80 nano second*Rap Rate: 1 to 1 million Pulse Per Second*Average Power: 20 watts
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Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB
DSP300-318
The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.
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Thickness Gauge
Multigauge 5300 GRP
Designed to check the condition of Glass Reinforced Plastic (GRP) or Engineering Plastics. It can also be used on uncoated metal
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Flatness, Bow, Warp, Curvature, Glass Thickness + Optics Test Equipment
Mobile Wedge Angle Sensor WAS 160
Optik Elektronik Gerätetechnik GmbH
Portable sensor for measurement of radius and wedge angle. Application: windshields of cars, helicopters, airplanes.
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EMC Subracks
1101.10
VECTOR Electronics and Technology, Inc.
VectorPak™ EMC subracks for medium and light duty applications. Its features include 2.5mm thick side panels / rack flanges and conductive finish throughout.
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Scatterometers/ Thin Film Metrology Systems
LittleFoot Series
The n&k LittleFoot-CD, and LittleFoot-CD450 are DUV-Vis-NIR scatterometers/thin film metrology systems, based on polarized reflectance measurements (Rs and Rp) from 190nm to 1000nm, with microspot technology. The systems in the LittleFoot-CD Series determine thickness, n and k spectra from 190nm-1000nm of thin films, as well as depths, CDs, and profiles of trenches and contact holes.
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Digital Meters
CHY 113
It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
