Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Sharp Edge Tester
UI-T03
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Sharp Edge Tester is used to test if toy or other test sample has hazardous sharp edge or not.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
AIR Edge AI HPC
AIR-520 (Generative AI Ready)
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AIR-520 Edge AI HPC integrates the SQ ai100 AI SSDs, NVIDIA RTX GPU cards, Edge AI SDK, and NVAIE to realize a off-the-shelf Gen AI solution. Affordable Budget - 1/10 traditional GenAI training server cost but same effectiveness.
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Product
Edge Gateway
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The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
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Product
Compact 2U Edge Server
SKY-821E3
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Compact 2U edge server with dual AMD® EPYC™ 9005/9004 processors, optimized for virtualization, HCI, and edge analytics.
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Product
VUltra-Short 1U Edge Server
SKY-8134S-11
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vUltra-short 1U edge server with 4th Gen Intel® Xeon® Scalable processor, optimized for Open RAN, MEC, and low-latency edge workloads.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
4U Edge AI HPC
AIR-510
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4U Edge AI HPC powered by Intel® Raptor Lake S CPU and NVIDIA Certified with RTX™ 6000 Ada Generation. Intel® Raptor Lake S Platform to support Intel® Core™ 14th Gen processors. NVIDIA Certified with RTX™ 6000 Ada Generation graphic card
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Product
Deep Observability For Critical Edge Software
DevAlert
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Get cloud-based observability on anomalies in edge devices and embedded software. Detect and analyse issues remotely, during testing and in deployed devices. Use your familiar desktop tools for secure remote debugging.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Edge AI Inference Systems
Edge AI Inference System
Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Edge AI Inference System
AIR-020
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Edge AI Inference system powered by NVIDIA® Jetson Nano/TX2 NX/ Xavier NX in a palm-sized design. Compact and performance AI box design. NVIDIA Jetson Nano/ TX2 NX/ Xavier NX embedded.
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Product
Sharp Edge Tester
SE400
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The Sharp Edge Tester is used for determining the sharpness of edges of electrical equipment and other consumer products. A special tape is mounted on a spring loaded arm and dragged over the sharp edge. The tape is then inspected for damages.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Industrial IoT Edge Gateway
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Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Product
2U Short-Depth Optimized Chassis For ASMB-62 Series Edge Server Board For Edge Computing.
HPC-6240
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Supports ASMB-62 edge series motherboardFour 2.5" hot-swappable SATA drive bays (2 NVMe drives in option)Four FH/10.5"L and four FH/HL expansion slots1200W 1+1 redundant power supply with 80 Plus platinum level certificateUltra Slim ODD support in option2U Front Bezel in option
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Product
Contour Check Round & Edge
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Laser measuring systems are of central importance for rolling mills to check the contours of steel profile for defects during the production process. A slight deformation on the surface of the profiles reduces the quality of the product, and in the worst case, a broken roll can even destroy the entire batch. With our systems Contour Check Round & Edge you identify and evaluate deviations at an early stage. Increase the process efficiency of your production - regardless of temperature and profile shape.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Automated Control System for Veneer Edge Gluing Line
Vikat
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The automated veneer splicing line control system is designed to identify defective veneer areas, control the scrap trimming, bonding of suitable areas and the formation of output sheets of a given size.
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Product
5G Edge Servers
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ADLINK is committed to developing industry-leading edge computing platforms to drive the transformation of communications network architectures, and enable customers to explore new services and business models across various market segments. Validated for NGC-Ready and AWS IoT Greengrass, ADLINK’s OTII-compliant Edge Server MECS series provides a versatile, cost effective and scalable white-box solution to facilitate deployment of 5G RAN and private networks, and enable a wide range of 5G use cases, including 5G DU/CU in open RAN and private networks in smart factory, mining, transportation and more.
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Product
Laser Type Edge Detection Sensor
LD
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Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
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Product
Dual-System Rugged Edge AI Platform
TREK-60N
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Dual-System Rugged Edge AI Platform for In-Vehicle & Harsh Environments. Intel® & NVIDIA® dual-system to provide excellent vehicle edge AI computing performance. 4ch PoE support video streams for AI capacity, In-vehicle specialized design: 12/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Fanless Network Appliance For Edge Deployment With 5G And Wi-Fi6. Ideal For Edge Computing And 5G Network Infrastructure.
FWA-1212VC
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Intel Atom® C3336/C3558 network SoC with Intel® QuickAssist Technology1 x DDR4 2133/2400MHz, SODIMM (ECC optional) up to 16GB2 x 1GbE SFP/RJ-45 combo ports (auto-negotiation) + 4 x 1GbE RJ-45 LAN portsReserve 1 x M.2 3052/3042 / 1 x M.2 2230 and 1 x Mini-PCIe for RF module selectionDefault 16GB eMMC onboard
