Evolved Packet Core
LTE system core voice and data network.
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Product
Processor Intel Core I7, PCI Gen 3, AMC
AMC726
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The AMC726 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® 4th generation Core i7 Processor (Haswell) with QM87 PCH. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
Cooled Infrared Camera Cores and Detectors
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Cooled Infrared Camera Cores and Detectors by Lynred USA: HD Format, XGA Format, VGA Format, QVGA Format
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Product
PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
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The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Product
Detector of Earth Faults on Multi/Single-Core Terminations
CableTroll 2310
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CableTroll 2310 is an indicator for detection of earth faults (PtG) on multi-core and single core cable terminations. The unit uses NorTroll type current sensor (CT)
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Product
Single and Dual Core Digital Signal Processor
SI-C665xDSP
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The SI-C665xDSP from Sheldon Instruments is a C programmable Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286EF
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetOne 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports PCIe x 16 (Gen 3), 1 M.2 B key, 1 M.2 E key, 2 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows10 LTSC, Ubuntu 20.04 LTS, SUSI API, and WISE-DeviceOn
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
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Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0103
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The AWS-0103 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Iron Core Earth Tester
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Weshine Electric Manufacturing Co., Ltd
Transformer iron core grounding current tester is a high-precision clamp meter specially designed for measuring AC leakage current, current and voltage. Large diameter (80×80mm) can clamp φ80mm cable, or 96mm×4mm flat steel ground wire, suitable for cables Leakage detection and transformer grounding flat steel leakage measurement.
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Product
CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
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The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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Product
Compact Size Tower IPC With 12th / 13th Gen Intel® Core
IPC-320
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Compact Size Tower IPC with 12th / 13th Gen Intel® Core™ i CPU Socket (LGA 1700) and 250W PSU. Intel® 12th / 13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H610E chipset. Design for operator IPC and application with space limit, Dual USB 3.2 and dual USB 2.0 port on both front and rear side. Dual Independent Display (HDMI/ DP) 2 low profile Expansion slots (PCIe x16 and PCIe x4).
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Product
12.1" Fanless Panel PC With Intel® Core™ I5-7300U Processor
PPC-412
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12.1" XGA TFT LCD with resistive touchscreenIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system design1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3 x Independent displays1 x M.2 bay (2242) for storage only and support SATA RAID 0/1No RED CertificationSupports VESA 75 mounting interface
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Product
2U Intel Core Series
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2U Rackmount Network Appliances with Intel® Core™ Series Family for Gateway and NGFW.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 1280 OEM Series
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The Dione 1280 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35 x 35 x 23.5 mm3 and weight is 27 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. The ultra-compact Dione 1280 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3066
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Intel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)3 x GigaLAN and upto 8 x USB3.02 x RS-232/422/485 and 4 x RS232 serial ports, 16 bit GPIO4 x SATA (max), 1 x M.2 E key, 1 x M.2 B/M key, 2 x F/S mSATAVGA+HDMI or 2 x HDMI output (Optional)12~24V DC input power rangeSupport Advantech I Door moduleSupport SUSI, WISE-DeviceOn and Edge AI Suite
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785545-01
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PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-208
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12th/13th/14th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipsetUp to 64GB DDR4 3200MT/s with two SO-DIMMPCIe x16 Gen4Triple independent displays with 2 DP, 1 HDMI, 1 LVDSRich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COMWISE-DeviceOn and Embedded Software APIs
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Product
10" Rugged Tablet With Intel® Core™ I3/i5/i7/Celeron® Processor
PWS-872FL
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7th generation Intel® Core™ i3/i5/i7/Celeron® processor with integrated Intel® Turbo Boost technology10.1" high-brightness WXGA and WUXGA LED display with scratch-resistant Corning® Gorilla® Glass 3 panelMulti-touch PCAP touchscreen with support for gloved operationRugged design with MIL-STD-810G certification, IP65 rating, and 4-ft. drop toleranceWiFi 6, 4G LTE, Bluetooth 5.2, and GPS modules with BeiDou/GLONASS supportBuilt-in front and rear cameras, 1D/2D barcode scanner, and NFC RFID readerHot-swappable battery supports up to 11 hours operationMicrosoft® Windows 10 IoT LTSC OSOptional peripherals include vehicle docking station, desk docking station, and multiple extension modules
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Product
12th Gen. Intel® Core I7/ I5/ I3 P-Series 3.5" SBC
MIO-5377
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12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports iManager & Software APIs, WISE-DeviceOn
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Product
3U I7 Core 2.1 GHz CPCI Controller
GX7936
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The GX7936 is a single-slot embedded cPCI 3U controller for use with Marvin Test’s GX7300 PXI chassis. The GX7936 features a 2.1 GHz i7 Quad Core processor. When combined with the embedded storage peripherals of the GX7300 Series chassis, it is the ideal solution for an integrated, high performance PXI chassis / controller configuration.
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Product
Fanless DIN-Rail IPC With Intel® Core™ Processors (13th Gen)
UNO-148 V2
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Intel® Core™ processors (13th Gen) with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COMSupports 2 x M.2 M key 2280 NVMe SSD storage (support RAID)Supports 1 x M.2 E Key 2230 wi-fi module and 1 x miniPCIe with Nano SIM card slotDual 2500 BASE-T Ethernet supports Time-Sensitive Network (TSN) technologyModular design for optional iDoor extensionSupport Windows 11 IoT Enterprise LTSC
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Product
cPSB 2.16 Compact Packet Switch 16 Slot, 14 node, 2F
107PS22616-4157R
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CompactPCI CPSB 2.16 6U 16 slot,14 node, 2 fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
Packet Sniffer
EtherDetect
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EtherDetect Packet Sniffer is an easy for use and award-winning packet sniffer and network protocol analyzer, which provides a connection-oriented view for analyzing packets more effectively. With the handy tool, all you need to do is to set up the filter, start capturing, and view connections, packets as well as data on the fly.
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Product
LV Iron Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
PCIe End Point IP Core
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The Arasan PCI Express End Point is a high-speed, high-performance, and low-power IP core that is fully compliant to the PCI Express Specification 1.1 and 2.0. The IP core is designed for applications in computing, networking, storage, servers, wireless, and consumer electronics. The feature-rich IP core is highly configurable that allows a target design to be implemented with the least number of gates and highest performance.
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Product
CT Core Tester
VCCT
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Veer make CT Core Tester VCCT is portable & easy to use Instrument. It is very useful to measure Voltage & Current of Electrical Steel like Toroidal Cores of different grade and size. VCCT is designed to test a lamination stack Toroidal Core. A Quality is judged by comparing the value of voltage applied & consumption of current.
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3086
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ntel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)12~24V DC input power rangeSupport Advantech I Door module
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Product
11th Gen. Intel® Core U-Series I7/i5/i3/Celeron Pico-ITX SBC
MIO-2375
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Intel® Tiger Lake-UP3 (10nm++) Series, On-board LPDDR4x-4266 up to 32G with IBECCDual independent display: eDP/MIPI-DSI, DP up to 8KRich I/O interface with GbE x 2, USB 3.2, COM Port, DIO SMBus, TPM2.0Flexible expansion to IoT connectivity: M.2 E-Key, M.2 B-Key/M-Key NVMe x2Supports Advantech iManager3.0, Embedded Software APIs, WISE-DeviceOn, and Edge AI Suite
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Product
ARINC 664 P7 IP Core
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iWave’s ARINC 664 P7 IP is an Ethernet Technology that provides a deterministic network to build an ARINC 664 P7 end system with guaranteed service to each subscriber with free access to the network. This protocol offers dedicated bandwidth for each node with guaranteed quality of service. iWave offers high integrity and redundancy management, as well as UDP/IP, profiled communication layer implemented in hardware.
