Evolved Packet Core
LTE system core voice and data network.
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Product
ARINC 664 P7 IP Core
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iWave’s ARINC 664 P7 IP is an Ethernet Technology that provides a deterministic network to build an ARINC 664 P7 end system with guaranteed service to each subscriber with free access to the network. This protocol offers dedicated bandwidth for each node with guaranteed quality of service. iWave offers high integrity and redundancy management, as well as UDP/IP, profiled communication layer implemented in hardware.
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Product
LV Iron Core Shunt Reactors
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Iron core Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system. Shunt Reactors are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. Shunt Reactors can be directly connected to the power line or to a tertiary winding of a three-winding power or distribution transformer.
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Product
Pulser / Sampler Core
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Furaxa has researched, developed, and characterized a novel monolithic arrayable pulse and sample aperture generation technology. Recent results include demonstration of sub-10ps pulse/aperture generation at repetition rates up to 3 Billion Pulses/Samples Per Second (BPPS) with jitter that is estimated at sub-10fs. Further, simulations in a number of InP DHBT processes exhibit sub-3ps 20BPPS performance. The IP is process-independent, and has been achieved in CMOS SOI, InP HBT, SiGe and GaAs so far. Please contact us regarding your specific foundry and technical requirements: The company currently licenses the sampler/pulser technology for use by application and market, and is interested in discussing how the technology can enable our partners' applications. A short list of characterized Pulser/Sampler Cores is given below.
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Product
ARINC 818-2 IP Core
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iWave’s ARINC IP core is ARINC 818–2 compliant offering point-to-point, high-speed, low latency video transmission. This IP core can be implemented on any transceiver-based FPGA device. It can be used for both transmit and receive applications. This core supports configurable ADVB video formats and uses a simple streaming interface to interface with video & image processing IP cores supported by FPGA vendors.
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Product
400/5A CHEAP SPLIT CORE CAST RESIN CURRENT TRANSFORMER
LZCK310-10
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Beijing GFUVE Electronics Co.,Ltd.
LZCK series outdoor waterproof current transformers are applicable for AC power system 35kV and measurement of current of power supply equipment below 10KV also can be used for microcomputer protection. This type of current transformer employs imported silicon steel which with high permeability as magnetic material, has the characteristics of Small magnetic circuit loss and can be split, its semicircular core and secondary windings employ high quality epoxy resin vacuum, casting in plastic-case(ABS or PC) which is flame retardance anti-moisture, stable performance, no maintenance.
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Product
ARINC 818-3 IP Core
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The ARINC 818-3 IP core offers higher data rates and encoding for high-resolution real-time avionics video. ARINC818-3 standard provides 64B/66B schemes to support high-speed ARINC applications having data rates up to 28Gbps. Display emulation for testing, low latency guidelines, and fixing typographic errors to previous versions was new in this specification.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Fixed Point FFT/IFFT IP Core
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Abaco Systems' fixed point FFT cores are the most efficient and fastest available in the FPGA world. With a revolutionary architecture for efficient memory usage and balanced use of arithmetic and logic resources, we offer complete FFT solutions with any input resolution up to 2Gsps. Whether you require a forward FFT, Inverse FFT, a 2D FFT, correlation or any algorithm efficiently performed with a Fourier transform, our technology will offer you the best solution for a cost-effective implementation.
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Product
15" Fanless Panel PC With Intel® Celeron Quad Core J1900 Processor
PPC-3150-RJ9
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15" TFT XGA LED Panel with resistive touchscreenEmbedded Intel Celeron processor, quad core J1900 2.0GHz onboardSystem memory up to 8GB DDR3L 1333 SDRAMSupports one internal SATA 2.5" HDDSupports one Mini PCIe socket, two Gigabit EthernetFanless and compact size with low power consumputionSupports five RS-232 and one RS-232/422/485, besides six RS-232 and two RS-422/485 are optional by requestSupports one mSATA socket
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Product
Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
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The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Modular TPC - Computing Box Module With Intel® Core™ Processors (13th Gen)
TPC-B520
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Modular Computing Box powered by Intel® Core™ processors (13th gen) i5-1335UE deca-core/ i7-1365URE deca-core processorSingle DDR5 Memory slot supports up to 32GBSupport expansion via three M.2 slots (NVMe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)
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Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
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Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
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Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
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The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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Product
Pre-Configured Core Test Sets
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An In-Phase Core Test Sets provide you with a solid foundation and hardware framework to build your test set. Our pre-engineered Core Test Sets provide a completely integrated test set
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Product
Intel® Core™ I3-N305 Processor And Intel® Processor N-Series 3.5" SBC
MIO-5154
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Intel® Core™ i3-N305, N-series N97 and N50Single Channel DDR5-4800 up to 16GB3 independent display: LVDS + HDMI + DPDual GbE, 6 USB, 6 COM, SMBus/I2CExpansion: M.2 E-Key 2230, M.2 B-Key 2280 & 3052Supports iManager & Software APIs, WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
6U VME 3rd Gen Intel Core 17 Computer
VM6052
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The VM6052 6U VME 2eSST Single Board Computer is built around Intel®’s state-of-the-art 3rd Generation Core™ i7 dual-core processor.
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAMSupports PCIe x 4 (Gen 3), 1 M.2 B key, 1 M.2 E key, 6 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-
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Complete TAP Signal Isolation for Corelis Boundary-Scan Controllers
ScanTAP IsoPod
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The Corelis ScanTAP IsoPod™ is an add-on accessory that provides a galvanic isolation barrier between the target system and the boundary-scan (JTAG) controller hardware. While the Corelis boundary-scan controllers are highly robust and reliable, the complete electrical isolation helps prevent damage to the controller from harsh electrical environments where over-voltage and over-current can damage components.This Corelis ScanTAP IsoPod was designed to add an additional layer of protection with minimal cost and effort. Open the box and plug it in; everything just works.
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Product
3U CompactPCI Serial Processor Blade with 6 COres/12 Thread Core i7 and Xeon Processor
MIC-330 Series
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MIC-330 is a 3U CompactPCI® serial processor blade with 6 cores/12 thread Core™ i7 and Xeon® processor and configured with Intel® CM246 PCH to support dual-channel 32GB DDR4-2666, up to 16GB on board memory for rugged applications, and another 16GB are available via the SO-DIMM socket for expansion.
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Product
Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
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Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Purpose Built Network Packet Brokers
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Garland Technology’s Purpose Built Network Packet Brokers (NPBs) are devices that provide access to network traffic from multiple links, helping to centralize and improve efficiencies by sharing packets between the monitoring and security appliances. Additional NPB features include filtering, aggregating, regenerating, and load balancing.
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Camera Cores
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Photonis camera cores provide day-through-night imaging to detect and capture images in any lighting conditions, from daylight through quarter-moon darkness. Our camera core portfolio covers a broad range of detection from visible, near infrared (NIR), short-wavelength infrared (SWIR) to long-wavelength infrared (LWIR) spectrum.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0101
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The AWS-0101 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Core Fusion Splicer with Dual Observation
STC-OFS701H
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Shanghai Stone Communication tech Co., Ltd
The smallest Core to core fusion splicer with dual observation Weight 1.2kg only 3.5 inch TFT color LCD monitor with X & Y view simultaneously Fiber core can be displayed clearly with large magnification Alignment mode: Core, cladding and manual alignment 9 seconds splice time and 30 seconds heat time Friendly operation interface and smart menu Operation with Max wind velocity of 15m/s Operation with max 5000m above sea level Typical 120 cycles with battery
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14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
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The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
