Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Signal Integrity Studio, Analysis & Simulation SW for WAVEPULSER High-Speed Interconnect Analyzer
WavePulser-Signal Integrity (SI) Studio
WavePulser Signal Integrity (SI) Studio is included as a single license in the WavePulser 40iX-BUNDLE or can be purchased as an additional license for offline access to additional users. WavePulser Signal Integrity (SI) Studio combines S-parameter, Impedance profiling and de-embedding measurements, channel and equalizer modeling, eye diagrams and jitter analysis in a single affordable software package for emulating the complete serial data channel.
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Turn-key ATE Interface Boards
We offer services for modeling and simulation and complement that work with measurement and validation of those models, at your desired frequency and your required fidelity specifications. Our design and programming expertise includes: Teradyne Catalyst through Integra FLEX; Advantest 3340 through T2000; Verigy 82000 through 93000. turn-key solution for ATE interface boards, we understand the limits of the interconnect technology (laminate, conductors and via’s, connectors and sockets) and use that understanding to guide our principles of design.
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1149.6 Boundary Scan Feature, GTE 10.00p
K8213A
Keysight’s Interconnect Plus Boundary Scan 1149.6 feature enables all the tools required to develop and execute this test method on the board under test. Compared to the 1149.1 standards, the 1149.6 standards define test methods for the boundary scan devices that are designed with AC coupled signals or differential nets needed for high-speed operations of the device.
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Waveguide Loads
Smiths Interconnect offeres high power Waveguide loads that can with stand up 200Watts at 18 GHz
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6-Port PCI Express
PEX 8724
The ExpressLane™ PEX 8724 is a 24-lane, 6-port, PCIe Gen 3 switch device developed on 40nm technology. PEX 8724 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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Resistive Components
Diamond is the best thermal conductor on earth. Combined with a low dielectric constant, it is an excellent RF dielectric material for high-frequency applications in which thermal performance is equally critical. By applying cutting-edge thin film process and extensive millimeter wave design experience, Smiths Interconnect has created a high-performance line of resistive components. The resulting products, our Diamond RF Resistives® resistors, terminations, and attenuators, are significantly reduced in size and unparalleled in average and peak power handling.
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PXI 24 x DPST Reed Relays
40-115-122
Available in normally open (DPST & SPST) configurations. Connections are made via a front panel micro-D 96-pin male connector. For applications requiring improved bandwidth and crosstalk performance please look at our 40-120 and 40-125 range of shielded reed relay cards. General purpose reed relays are suitable for the construction of small switching networks, slaving up to larger switches or operating external devices (e.g. lamps, solenoids etc.). To simplify inter-relay wiring, interconnection points are built onto the circuit board easing the construction of complicated wiring.
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ITA, S6, 6 Module, With Protective Cover
410122100
The S6 ITA Frame has a powder coated finish adding an extra layer protection against the elements. It is an integral part of this rugged Mass InterConnect system. The S6 ITA has module positions screened on top for ease of module placement. Protective Cover included.
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Solar Array Simulator
Among other things, solar array simulators are required for testing satellite power supplies. An SAS (Solar Array Simulator), consisting of an interconnection of several Solar Array Simulator modules, maps the solar panels and displays the individual strings connected in parallel. Optionally, the individual SAS modules are monitored by a Second Level Protection, so that the test object is not damaged in case of errors with the voltage sources. Additional circuitry is implemented via project-specific test modules. The signal path to the DUT can be separated, e.g. for dynamic current measurements.The Keysight Solar Array Simulators used were specially developed for satellite applications and cover the significantly higher requirements regarding the control speed of MPP tracking compared to terrestrial applications.
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16-Port PCI Express
PEX 8664
The ExpressLane™ PEX 8664 device offers 64 PCI Express Gen 2 (5.0 GT/s) lanes, capable of configuring up to 16 flexible ports. The switch conforms to the PCI Express Base Specification, rev 2.0. The 64-lane switch enables users to add scalable, high bandwidth, non-blocking interconnection to a wide variety of applications including servers, communications, storage, blade servers, and embedded systems.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Robust Modular Rectangular Connectors
B Series
Smiths Interconnect addresses the industry’s need for reliable, low cost interconnections with the rectangular modular connectors B Series. B Series incorporates the highly reliability Hypertac® hyperboloid contact which provides optimum performance in harsh conditions such as extreme mechanical shock and high mating cycles.
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Coaxial Adapter, 3.5 mm (m) to 3.5 mm (f), DC to 26.5 GHz
83059C
The Keysight 83059C instrument-grade 3.5-mm coaxial adapter offers outstanding performance to 26.5 GHz. With SWR typically better than 1.05, this adapter is ideal for most connector saver and interconnect needs.
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Linear Testfixture for VPC iCon i1 Mass Interconnected Cassette Interface (Cassette Not Included) 4 or 10 Positions Blocks, UTT 306 x 248 mm
MG-02-01
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 306 x 248 mm (wxd)• Outer dimensions: 470 x 490 x 100 x 170 mm (wxdxh1xh2)• Designed for Mass interconnect changeable cassette• Up to a maximum of 4 interface blocks of 160 signals• All interface blocks can be customized
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Digital Interconnect Test System, Reference Solution
When you need to measure advanced S-parameters with a fast, low-cost and easy-to-use test solution, the Digital Interconnect Test System gives you a significant edge. It provides a full 32-port vector network analyzer (VNA) configured within a single PXI chassis – ideal for high-speed cable testing. And lets you test any linear passive interconnect faster and easier, including backplanes, connectors and PCBs. Sharpen your edge with Keysight’s Digital Interconnect Test System that enables signal integrity characterization of multiport interconnect products.
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Time Domain Reflectometer / TDR
For testing cables and interconnects, we offer the ideal tool: A time domain reflectometer (TDR). Time domain reflectometry/transmission can be used to test network return loss (S11), propagation loss (S21), and crosstalk.Moreover, it can provide the impedance profile of an electrical channel. MultiLane supplies semi-automated solutions for the testing of direct-attach cables and TIAs.
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Signaling Gateway Solutions
Service Providers are making the transition to 4G, and 5G is coming, but legacy connectivity for voice, SMS and IN applications still remains an absolute requirement. SS7 TDM interfaces must be maintained to meet the demand to interconnect different networks and multi-protocol solutions are required to connect divergent circuit and packet switching architectures. SS7 isn’t retrograde – it’s traditional. It’s still the most robust, high performance, and reliable signaling solution out there and it’s needed today more than ever.
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Vigilant Aircraft Hygrometer
137
The Edgetech Instruments Model 137 Vigilant Aircraft Hygrometer is a rugged, shock mounted military qualified instrument used for the primary measurement of dew point in flight or in installations with existing flow, such as wind tunnels.It features a miniature remote dew point sensor employing a platinum resistance thermometer, and has 15 feet of interconnecting cable to the control unit. Precision calibration units for the linear analog outputs are included.
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Socket Accessories (Thru-Hole Options)
The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006″ to 0.018″ diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
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64-Channel Form A General Purpose Switch for 34980A
34939A
The Keysight 34939A is a high density general-purpose switch module for the 34980A Multifunction Switch/Measure Unit. It has 64 independent single-pole, single-throw (SPST) relays that can switch 1A and carry 2A. This module can be used to cycle power to products under test, control indicator and status lights, and to actuate external power relays and solenoids. The relays are 100V, 1A contacts and can handle up to 60W. Standard 78-pin Dsub connectors allow for use with standard cables, screw terminal blocks, or mass interconnect solutions.
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Low I/O Solutions
G Series
The G Series offers modular configurations leading to a countless number of I/O options and mass interconnect solutions.
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Plugbord
3795-1
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.100"(2.54mm) centers. 3-Hole Solder Pads One Side Only. 3-hole solder pads (0.28” x 0.080”) for interconnecting multiple component leads. All pad and bus surfaces solder coated for user convenience. No pattern on reverse side, edge contacts only. Convenient easy-to-read hole marking legend on wiring side.
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I/O Modules
Curtiss-Wright Defense Solutions
Finding I/O modules to integrate into your real-time, mission-critical systems can be difficult. You need fast and reliable movement of information between the various elements in your interconnected system. Your programs are long-term and need assured long-term availability.
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Passive Oscilloscope Probes
5900 SERIES
Probe Master's new 5900 series passive oscilloscope probes are available in 400 MHz & 500 MHz bandwidths. Probes are also available with readout actuators for oscilloscopes with the readout feature. The "GOLD PROBE" has been designed specifically for use with Tektronix, Hewlett Packard and other high performance oscilloscopes. This new slim design along with a host of versatile accessories, allows you to reach the most difficult test point in today's highly complex circuitry. The gold plated Probe Tips, Sprung Hook, Ground Lead, Alligator Tip and other critical interconnect points within the Gold Probe, provide excellent contacts for probing low level analog signals and high speed digital data. Unlike most "off shore" commodity probes, Probe Master guarantees quality and continuing domestic support for our "Made in America" Gold Probe.The probe body is made of high impact ABS. Soft molded strain reliefs at all stress points assure long cable life. In short it has been designed to offer you high performance coupled with high quality.
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6U VPX Intel Core i7 Broadwell SBC
VPX6-1959
Curtiss-Wright Defense Solutions
The VPX6-1959 rugged, high performance 6U OpenVPX Single Board Computer (SBC) combines Intel's powerful Core i7 processor with the power and flexibility of the VPX platform's high speed fabric interconnects.
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64x64 Matrix
TS202A
Universal Switching Corporation
Designed from scratch to improve on the legacy Precision Filters Model 4164, the TS202A uses the absolute latest in component technology. Many engineers still use manual patch cords & patch panels to interconnect sensors, recorders, scopes and other instrumentation in test & evaluation labs.
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Tool, Extraction, 90 Series Modules, Interconnect Adapters
910109111
Tool, Extraction, 90 Series Modules, Interconnect Adapters
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Mass Interconnect Solution
SCOUT
SCOUT is an innovative pull-through Mass Interconnect solution specifically designed to deliver the full performance potential of the PXI platform at the ATE interface. SCOUT, featuring DAK (Direct Access Kit) connectivity, enables system designers to limit or eliminate traditional instrument cables by replacing them with DAK connection modules that utilise PCB, flex-circuit or short wire connections.
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USB-8506, 1-Port, USB LIN Interface Device
784663-01
1- or 2-Port, USB LIN Interface Device—The USB‑8506 is a Local Interconnect Network (LIN) interface for developing applications with the NI‑XNET driver. The USB‑8506 is powered over the USB bus and does not require external power. The USB‑8506 excels in applications requiring logging or manipulation of hundreds of LIN frames and signals, such as in-vehicle data logging, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move LIN frames and signals between the interface and the user program without CPU interrupts, minimize message latency, and free host processor time. The USB‑8506 is available with a three‑pin COMBICON synchronization connector for triggering and synchronizing the internal hardware timebase with other devices.
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QuadraPaddle Signal
QuadraPaddle contacts are engineered for flexible interconnect options. Rated at 20,000 Cyles Rated at 5 amps continuous (1250 VAC) 2 oz. insertion force Provide 4 reliable points of contact per pin
