Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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High I/O Solutions
Mass Interconnect systems are available in multiple sizes and configurations to accommodate virtually any testing requirement. VPC Mass Interconnect systems are flexible, reconfigurable, and modular by design.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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XMC
LinkedHope Intelligent Technologies Co.,Ltd.
XMC is a PMC with high-speed serial fabric interconnect defined by the VITA 42 standard.
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Signal & Power PCB Connector
HPW Series
Smiths Interconnect's HPW series is a versatile interconnect with mixed signal and power contacts, up to 15A each
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4.3-10 Connectors
Pasternack 4.3-10 connector category includes mostly RoHS and REACH components. 4.3-10 connector products in this category are built to precise RF and microwave industry specifications.4.3-10 connectors, like the other over 40,000 RF, microwave and millimeter wave components at Pasternack are in-stock. Not only are these 4.3-10 connector interconnects in stock, they also ship the same day.
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Eurocard Plugbord
4616, 160-PIN VME64x
VECTOR Electronics and Technology, Inc.
6U x 160mm Eurocard size for 160-pin DIN connectors. 3-Hole Solder Pad Pattern on both sides. 3-Hole Solder Pads (0.28” x 0.080”) for interconnecting multiple component leads.Interleaved buses on both sides, back-to-back. Pad and bus surfaces solder-coated for user convenience. Row and column legends provided.
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Test FMC Mezzanine Module
TFMC900
The TFMC900 is an FMC (FPGA Mezzanine Card) Mezzanine Module designed to test ANSI/VITA 57.1 FMC Carriers during development or series production. Additionally, it offers the possibility to realise various I/O solutions for connected FMC Carriers. Interconnection of the High Pin Count FMC Connector signals can be verified by JTAG and by functional tests. A loop-back of the 10 multi-gigabit transceiver interfaces allows interconnection checks for the high-speed serial interfaces.
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Wire Systems Analyzer
Console Test Systems (CTS)
Wire Systems Analyzer Commercial Roll around detects and locates faults and detects degradation in electrical interconnect systems ranging from simple to complex. Used to verify the operation of relays, circuit breakers, indicators, switches, diodes, transformers, 1553 couplers, etc.
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Programmable Step Attenuator, DC to 4 GHz, 0 to 11 dB, 1 dB steps
8494G
The Keysight 8494G dc to 4 GHz programmable step attenuator offers exceptional repeatability and reliability. Attenuation is provided in 1 dB steps from 0 to 11 dB. Precision gold-plated leaf springs ensure long-life (over 5 million cycles) and very high attenuator repeatability (typically 0.01 dB). To improve measurement accuracy, NIST traceable data (SWR and attenuation) is available as Option UK6. A maximum switching time of 20 ms (including contact settling) speeds automatic testing. Custom step attenuator/switch combinations are possible. The Keysight 11716A/B/C interconnect kits provide quick connection of Keysight 8494/5/6/7 1 dB and 10 dB step attenuators in series for greater dynamic range with 1 dB steps.
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Analog I/O module with 16 differential analog output channels
IO107
This I/O module is a dedicated analog output module with a resolution of 16 bits. Each of the 16 output channel has its dedicated D/A converter with an update time of 2.2µs. The output coupling of the module can either be ordered as differential or single-ended. Furthermore, several of these modules can be interconnected by trigger lines to synchronously update analog output channels among the different modules.
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Interface Pin
Smiths Interconnect offers interface probes for all major test equipment manufacturers. We also provide a variety of interface pins for use in test fixtures.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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PCI Express
Welcome to PCI Express (PCIe) Learning Center. As PCIe interconnect is becoming increasingly popular as a common data bus standard, we has created this one-stop-page for you to know everything about PCIe. Get updates on the latest PCIe standard specifications, learn how to take jitter measurements and discover PCIe timing solutions and design tips. Become a PCIe expert yourself!
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Embedded Components
Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.
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PCIe Adapter for XMC
PCIe8LXMCX2
Embedded applications frequently require real time processing coupled with special purpose IO. With the PCIe8LXMCX2´s two positions a PrXMC can be matched with another XMC to make a high bandwidth processing node. The PrXMC can communicate with the host for set-up, and then use the switch to interconnect with the special purpose IO card.
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Manual Step Attenuator, DC to 18 GHz; 0 to 70 dB; 10 dB steps
8495B
The Keysight 8495B dc to 18 GHz manual step attenuator offers exceptional repeatability and reliability. Attenuation is provided in 10 dB steps from 0 to 70 dB. Precision gold-plated leaf springs ensure long life (over 5 million cycles) and very high attenuator repeatability (typically 0.01 dB). To improve measurement accuracy, NIST traceable data (SWR and attenuation) is available as Option UK6. Custom step attenuator/switch combinations are possible. The Keysight 11716A/B/C interconnect kits provide quick connection of Keysight 8494/5/6/7 1 dB and 10 dB step attenuators in series for greater dynamic range with 1 dB steps.
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High-Speed Digital Switch Matrix & Optical Power Management System
VERTA
Avionics Interface Technologies
Switching & Optical Power Management system supporting Fibre Channel & Ethernet interconnect and power management applications.
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1149.1 Boundary Scan Feature, GTE 10.00p
K8212A
Boundary scan is a method for testing interconnections on printed circuit boards. Keysight’s Interconnect Plus Boundary Scan feature enables all the tools required to develop and execute this foundational test method on the board under test.
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Keysight 32-Channel FormC/Form A General Purpose Switch for 34980A
34937A
The Keysight 34937A is a general-purpose switch module for the 34980A Multifunction Switch/Measure Unit. It has 28 independent single-pole, double-throw (SPDT) 1A relays and 4 single-pole, single-throw (Form A) 5A relays. This module is used to cycle power to products under test, control indicator and status lights, and to actuate external power relays and solenoids. The Form C channels are 300V, 1A contacts and can handle up to 60W, and the Form A channels are 30VDC/250VAC, 5A contacts and can handle up to 150W. Standard 50-pin Dsub connectors allow for use with standard cables, terminal blocks, or mass interconnect solutions.
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IO-Link
The IO-Link® interface simplifies communication to smart sensors and actuators, combining signaling with power-over-cable technology. It has become one of the key devices as industrial automation systems are growing more interconnected and intelligent to accommodate demands for centralized control and optimized production. Analog Devices implements both device PHY and master PHY interfaces (COM1/COM2/COM3). Designing with harsh industrial environments in mind, the master 4-port IO-Link power and communications interface, as well as the IO-Link transceivers featuring Integrated Step-Down Regulators and LDO with ±60V cable interface protection provide the required ruggedness. Optimum EMC performance is achieved with adjustable current limit and slew rate transmitters. Automatic wake-up request (WURQ) generation and an output supply current boosting capability for device startup are also available. Additional components integrate a 300 mA step-down (buck) regulator and a 150 mA LDO to supply all the power required for internal electronics in an connected sensor or actuator.
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WLCSP Probe Heads
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Digital and Analog Test Sets
Our analog and digital automated test system experience covers a wide variety of applicationsfrom multiple path resistance, capacitance, and inductance testing using various Interface Test Adapters (ITA)to inter-connect multiple customer units under test (UUT). Other systems have included: equipment to monitor and record telemetry, digital data streams, and systems that evaluate packet data using a variety of VME, VXI, PXI, and LXI equipment.
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High Power Rack And Panel Connectors
LSH Series
The LSH rack and panel connectors include leading-edge Hypertac® hyperboloid technology. The Polyphenylene sulfide (PPS) insulators interconnect technology ensures LSH connectors are easy mating. The LSH Series delivers customers a high life cycle.
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8-Port PCI Express
PEX 8734
The ExpressLane™ PEX8734 is a 32-lane, 8-port, PCIe Gen3 switch device developed on 40nm technology. PEX8734 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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CAN/LIN Instrument
Each 5-channel CAN and 5-channel LIN can be independently controlled for simultaneous operation. It is an intelligent instrument which uses its own on-board processor to send/receive/compare Controller Area Network (CAN) and Local Interconnect Network (LIN) messages.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Optical Connectors
Radiall's full range of optical interconnect solutions includes standard interfaces, optical termini, optical connectors and custom optical assemblies and subsystems. Suitable for harsh environments and designed for demanding applications where reliability and high performance are required, our cost-effective optical connectors are adapted to the specific requirements for the telecom, industrial, aerospace and defense markets.
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Contacts
VPC offers a wide array of contacts with a variety of connection options that are configurable for virtually any interconnect requirement.
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PMC to PCI Adapters
The PMC to PCI, PMC to CPCI and PMC to PC/104+ adapters enable the use of the PMC650 or PMC850 bus analyzers in PCI, CompactPCI and PC/104+ systems. The PMC analyzer plugs onto the adapter and then the mated adapter and analyzer plug into a PCI, CompactPCI or PC/104+ system. These passive adapters route the bus signals from the analyzer to the bus with minimal trace length and impedance matching. The adapters provide the full 64 bit interconnect between the analyzer and the bus.
