Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Ultrasonic Thickness Gauges
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Capable of performing measurements on a wide range of material, including metals, plastic, ceramics, composites, epoxies, glass and other ultrasonic wave well-conductive materials.
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Product
Thickness Check Calix
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For the manufacturing of a perfect cold strip, many factors are crucial. Our measuring frames specifically check the thickness-related quality parameters of the strip steel or steel sheet. Free of radioactive radiation, laser sensors are used in the cold strip areas that do not require protection measures with laser class 2, or only low precautions when using laser class 3B sensors. The installation of our measurement systems is quick and uncomplicated for our customers. The CALIX is integrated into the line with its C-shaped frame across the material flow. Our solutions with and without traversing determine all important parameters for quality assurance, including strip thickness, edge thickness, wedge or cambering, and measure the complete thickness profile. Thus, you have full process control in the current production.
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Ultrasonic Thickness Gauge
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High-precision ultrasonic thickness gauge, suitable for various materials high-precision measurement needs, can be applied to steel, cast iron, aluminum, copper, zinc, etc.
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Concrete Coating Thickness Gauge
500
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The Elcometer 500 Coating Thickness Gauge accurately measures the thickness of coatings on concrete and other similar substrates* - non destructively.
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Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
ITA, G10, 10 Module, 0.5" Standard thickness
410104123
ITA
ITA, G10, 10 Module, 0.5" Standard ThicknessUses VPC 90 Series Modules.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Thick Film Passive Element
GBR-182
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GBR-182 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-182 series elements are used both for general, and professional applications.
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Product
Handheld Digital Thickness Gauges
HC-210
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Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc., both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Thickness Gauging
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There are two main types of thickness gauges; the Box Gauge for measuring on aluminium and clad aluminium strip, and the C-frame Gauge for measuring on any non-ferrous strip and foil.
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Product
Non-contact Film Thickness Measurement
ALTO-IRT-7000
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ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
Thick Film Inspection
785
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For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Product
Thickness Gauges
CMX DL
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The CMX DL has all the features of the CMX, plus a huge storage capacity, using multiple file structures. Select between to file formats: Sequential, with auto identifiers or, our standard alpha numeric grid format.
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Product
Ultrasonic Thickness Gauge
MX-5 DL
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The MX-5 DL is a simple to operate Ultrasonic Thickness Gauge with an internal data logger. It offers features that make your job easier. An Alarm mode, Differential mode, high speed scanning, and data send are the main features of the MX-5 DL. The MX-5 DL will automatically log your readings in numeric order ( 1 to 1000 readings ). The gauge comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Coating Thickness Gauge
Meter MEGA-CHECK -Basic
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The new generation of MEGA-CHECK devices first used probes in which an own microcontroller, the analog sensor signals are digitized to the device outputs. This new technique is extremely trouble-free and even allows accurate and repeatable readings. The probe cable is both sides (control unit and probe) and therefore particularly service-friendly, as if a cable breaks, the device must not be returned, but only the cable is replaced. The units are equipped with a large, clear and illuminated graphic display. A variety of Fe, ferrous and dual
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Material Thickness
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The Elcometer range of ultrasonic material thickness gauges has been designed specifically to be easy to use, calibrate, take readings and create inspection reports. With a wide range of measurement modes including: Pulsed Echo (PE), Echo Echo ThruPaint™ (EE) and Velocity Mode (VM), and a wide range of intelligent dual element transducers, the new ultrasonic non destructive thickness gauges can measure the material thickness of virtually any material such as metals, plastics, glass, epoxies and ceramics.
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Film Thickness Measurement
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Film thickness measurement can be measured using a number of different techniques depending on the thickness and number of layers. In its simplest form a simple measurement can be made of a single layer with a reflective lower surface using interference fringes. For more complex materials with multiple layers interference measurement is still made, but the mathematical deconvolution becomes increasingly important as does the refractive index of each layer.
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Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Ultrasonic Thickness Gauge
72DL PLUS
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The Olympus 72DL PLUS™ ultrasonic thickness gauge delivers precision thickness measurements at high speed in a portable, easy-to-use device. With fast scanning, advanced algorithms, and our lowest-ever minimum thickness capability, you can confidently measure the thickness of very thin layers in the most challenging applications.
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Hand Held Ultrasonic Thickness Meter
Multigauge 5600
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On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Coating Thickness Gauge
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Shenzhen Linshang Technology Co., Ltd.
Linshang coating thickness gauge, also named dry film thickness gauge, which can identify the substrate automatically. It can be used in various fields such as coating thickness measurement, plating thickness measurement, fireproof and anticorrosive coating thickness measurement, etc. The dual-use coating thickness gauge such as LS220H, LS221, LS223 are suitable for ferrous and non-ferrous substrates, LS225+F500 is special for ferrous substrates and LS225+N1500 is special for non-ferrous substrates.
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Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
