Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Compact Coating Thickness Gauges
MP0R-FP Series
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Compact pocket coating thickness gauges with connected cable probe and PC-interface for a convenient, fast and nondestructive coating thickness measurement on virtually all metals
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Product
Film Thickness Probe
FTPadv
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The SE 500adv combines ellipsometry and reflectometry to eliminate the ambiguity of measuring layer thickness of transparent films. It extends the measureable thickness to 25 µm. Therefore the SE 500adv extends the capability of the standard laser ellipsometer SE 400adv especially for analyzing thicker films of dielectrics, organic materials, photoresists, silicon, and polysilicon.
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Product
Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
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To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8822
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- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1000um- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm - Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA(UM-3)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Product
ECHO 9 Advanced Corrosion Thickness Gages
ECHO 9
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ECHO 9 offers a 3.5” high resolution sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 9 is available in 4 models including the ECHO 9, ECHO 9DL, ECHO 9W and ECHO 9DLW.
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Thickness Gauges
CMX
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The CMX has all features of the MX & MMX gauges with a ton of advanced features. Measure material and coating thickness simultaneously, while still detecting pits & flaws in a single mode (PECT). Auto probe zero, auto probe recognition, auto temperature compensation are also included. Selectable Large Digits and B-Scan display options, up to 64 custom user definable setups, selectable transducer table for precision linearity, and material and coating calibration options are also available.
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Product
Coating Thickness Measurement Gauges
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ElektroPhysik Dr. Steingroever GmbH & Co. KG
Handy, universally applicable coating thickness gauge in three versions: Integrated probes, cable probes and interchangeable internal and external probes.
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Product
Pfund Thickness Gauge
3233
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Available in aluminium or stainless steel this instrument consists of two concentric cylinders, one sliding inside the other. A spherical glass lens, which has engraved measurements, is fitted to the end of the central cylinder and when pressed into the wet film, leaves a circular trace.The diameter of the mark on the lens is measured and, using the supplied conversion table, the thickness of the coating can be easily assessed.Ideal for measuring the thickness of wet translucent products such as varnishes, oils etc.Measurement range of 2.25 - 360μm (0.09 - 14.17mils)
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Product
Ultrasonic thickness gauge
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The frequency range of sound that can be heard by the human ear is about 20Hz to 20KHz, and sound waves with higher frequencies are called ultrasonic waves. In general ultrasonic flaw detection equipment, 5MHz is often used in the range of 1MHz to 20MHz as standard.
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Product
Compact Coating Thickness Gauges
MP0 Series
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Ultra compact pocket coating thickness gauges for simple, fast and nondestructive coating thickness measurement on virtually all metals or only on steel/iron
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Thickness Tester
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Shenzhen UYIGAO Electronic Technology Co., Ltd
The coating thickness gauge is designed for non-destructive, fast and precise coating thickness measurement.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
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- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Product
EHC-09 Ultrasonic Corrosion Thickness Gage - Color
EHC-09C
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Danatronics offers our EHC-09 Color Wave series as the top of the line gages for corrosion applications. The EHC-09 Color Wave offers many standard and practical features including a sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, 100K thickness reading datalogger with interface to Microsoft excel. The Color Wave is available in 4 models including the EHC-09C, EHC-09DLC, EHC-09CW and EHC-09DLCW. The vibrate on alarm is a world’s first and is great for loud environments!
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Terahertz Coating Thickness Analysis
TeraCota
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TeraView presents a film thickness gauge designed for the automotive industry. The sensor can determine the individual thickness of multiple paint layers on both metallic and non-metallic substrates and offers significant benefits over existing techniques.
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Product
Wall Thickness Measurement Gauges
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ElektroPhysik Dr. Steingroever GmbH & Co. KG
Portable wall thickness measuring device for non-destructive measurement of up to 24 mm. Thickness measurement of all non-magnetic materials such as glass, synthetic materials, stainless steel and composites; can also be used for objects with complex geometries.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Portable Thickness Gauge
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gauge that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Tooth Thickness Micrometer
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Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Product
Digital Thickness Gauges Paint Gauge Meter
HC-200
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Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc. ,both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
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Thickness Gauges
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Our digital thickness gauges offer a range of features for advanced performance. Explore different options to suit your application needs, from simple handheld gauges to advanced models. All Olympus ultrasonic thickness gauges can measure thickness from one side of a part.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
