Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Layer Thickness Meter
CHY 113
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It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Thickness Gauge
MX-5
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The MX-5 is a simple to use hand-held Ultrasonic Thickness Gauge. It offers features that make your job easier. An Alarm mode, Differential mode, high speed scanning, and data send are the main features of the MX-5. The MX-5 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Coating & Material Thickness Gauges
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GAOTek’s coating thickness gauges are designed for measuring the thickness of a material and are for sale to the United States, Canada and globally. Our products utilize non-destructive testing techniques that do not permanently affect the material they are testing. They are reliable, high quality, and affordable pieces of equipment that can provide an accurate measurement and offering an efficient and quick means of inspection or testing. Our products emphasize compactness and portability to allow the user to work in complex conditions.
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Product
Thick Film Bleeder
GBR-350
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GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Coating Thickness Meter for Ferrous and Non-Ferrous Materials
CM8826FN
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- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 鍗?-3%n or 鍗?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45閳?/span>(32閳?/span>-104閳?/span>),閳?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Product
Paperboard Thickness Tester
DRK107D
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Shandong Drick Instruments Co., Ltd.
It is used to test thickness of plane sheet samples, widely used in paper, board and other sheet material industry.
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Product
Non Rotating Spindle Type Tooth Thickness Micrometer
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Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Product
Thickness Gauges
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Precision Thickness Gauge is specifically designed to quickly and accurately measure the thickness of a variety of substrates including film, paper, board, foil, tissue and textiles.Operated via an intuitive touch screen interface the instrument will allow the user to define batch size, dwell time & measuring speed.Full test statistics can be easily viewed or printed to label for easy documentation control.
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Product
Metal Thickness Tester
Multigauge 5500 Waist
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Mounts onto a belt or chest harness for hands free use. Bright LED display. Top display for convenient viewing.
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Product
Ultrasonic Thickness Gauges
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Used for measuring thickness and corrosion of pressure vessels,chemical equipment,boilers,oil storage tanks,etc.in industries of petroleum,shipbuilding,power station,and machine manufacturing.
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Product
Flaw Detector & Thickness Gauge
DFX-7+
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Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms.
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Product
Coating Thickness Gauges
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Application of coating thickness gauge:used for measuring thickness and corrosion of pressure vessels, chemical equipment, boilers,oil storage tanks, etc. in industries of petroleum, shipbuilding, power station, and machine manufacturing.
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Product
Paper Thickness Tester
DRK107B
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Shandong Drick Instruments Co., Ltd.
DRK107B Paper Thickness Tester is applied to testing the thickness of paper specimens.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
Underwater Thickness Gauges
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Cygnus have created a range of versatile underwater and subsea thickness gauges for use by divers and engineers. These measuring devices provide a simple and time-saving method of obtaining ultrasonic thickness measurements in underwater conditions.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Ultrasonic Thickness Gauge
45MG
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The 45MG is an advanced ultrasonic thickness gauge packed with standard measurement features and software options. This unique instrument is compatible with the complete range of Olympus dual element and single element thickness gauge transducers, making this innovative instrument an all-in-one solution for virtually every thickness gauge application.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Surveyor Datalogger Thickness Meter
Multigauge 5750
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Has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. Measurements can be stored on the gauge and wirelessly transferred to the PC.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Thickness Gauges for Plastic films & Paper
CHY-CA
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CHY-CA is a highly precise thickness gauge with mechanical contact method, which can be used to measure the thickness of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Product
Precision Coating Thickness Gauge Probe Range
Elcometer 355
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Unique probe modules allow the Elcometer 355 Coating Thickness Gauge to be versatile and flexible for any coating thickness measurement application.
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Product
Inline Thickness Measuring Instrument
TGD
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Thickness and profile measuring system for use in production lines.For cold and hot rolled strips and sheets. Measuring procedure free of contact.
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Product
Wall Measurement Thickness Gauge Wall Thickness Test Instrument
HS160
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Shenzhen Chuangxin Instruments Co., Ltd.
HS160 Wall measurement thickness gauge, wall thickness measuring equipment apply to measure the thickness of all kinds of material, through which the ultrasonic wave can propagate at a constant speed and can get reflection from the back. This instrument can be used for a variety of plate and all kinds of machining parts for accurate measurement. Another important function of this gauge is to monitor all kinds of pipelines and pressure vessels used in the production equipment, monitoring their degree of corroded thinning during the using process. It's widely used in petroleum, chemical industry, metallurgy, shipbuilding, aviation, aerospace and other fields.
