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Thickness Check Calix
For the manufacturing of a perfect cold strip, many factors are crucial. Our measuring frames specifically check the thickness-related quality parameters of the strip steel or steel sheet. Free of radioactive radiation, laser sensors are used in the cold strip areas that do not require protection measures with laser class 2, or only low precautions when using laser class 3B sensors. The installation of our measurement systems is quick and uncomplicated for our customers. The CALIX is integrated into the line with its C-shaped frame across the material flow. Our solutions with and without traversing determine all important parameters for quality assurance, including strip thickness, edge thickness, wedge or cambering, and measure the complete thickness profile. Thus, you have full process control in the current production.
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High Voltage Thick Film Chip Resistors
HVTK (HVR)
*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Cross Cut Adhesion Tester
1540
The Elcometer 1540 Cross Cut Adhesion Tester is a simple instrument for quickly determining the coating adhesion of a large variety of paints up to 50µm (2 mils) thickness.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Apertures
ARC possesses the machining techniques, skill and equipment to fabricate a wide variety of apertures in a similarly wide variety of materials. The aspect ratio of aperture opening to material thickness is generally limited to a 1:20 ratio. Shown on the right in Figure 1 is an aperture with a wide series of holes ranging from 15um to 960um.
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Analog Output Series Sensors
Shanghai Pubang Sensor Co.,Ltd.
1. Measured distance is linear to output signals, high accuracy, can precisely indicate position of tested objects2. With the change of detection distance, itcan provide 0-10V or 4-20mA of standard analog signals; widely used for distance measurement, thickness measurement,etc
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Pinhole Detector
NOVOTEST ED-3D
NOVOTEST ED-3D Pinhole Detector was designed for rapid non-destructive testing of the continuity of coating (e.g. porosity of film) with thickness up to 500mkm according to ASTM G62-A.Pinhole Detector is designed for testing the porosity of partially painted places and other discontinuities of protective dielectric coatings on metal products by putting low voltage through a sponge which is soaked in a liquid electrolyte with high penetrating properties.
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kSA RateRat Pro
kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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High Temperature Chip Resistors
ERJ-Hxx Series
Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Thick Film Bleeder
GBR-351
GBR-351 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 965). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Analytical Services
IGC: Inverse Gas Chromatography; Understand surface energies, polarities, acid/base properties and nanomorphology on powders and fibers. ToF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry. Localize your molecules at the first nanos! 2D imaging with resolution up to 200 nm. Highest sensitivity up to 10 ppm. CM: Quarz Crystal Microbalance In-situ observation of thickness and stiffness of any films in liquid environmentSEM: Scanning Electron Microscopy Images say more than words, especially with an artistic eye XPS/ESCA: X-ray Photoelectron Spectroscopy/Electron Spectroscopy for Chemical Analysis.
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Spectroscopic Ellipsometer Software
SpectraRay/4
SpectraRay/4, the SENTECH proprietary spectroscopic ellipsometry software, includes data acquisition, modeling, fitting, and extended reporting of ellipsometric, reflection, and transmission data. It supports variable angle, multi-experiment, and combined photometric measurements. SpectraRay/4 includes a huge library of materials data based on SENTECH thickness measurements and literature data as well. The large number of dispersion models allows modeling of nearly any type of material.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Film and Paper Thickness Gauges
Economical, Accurate, Easy-to-Operate, our line of off-line paper / film thickness gauges are manufactured to meet TAPPI specifications for paper or ASTM specifications for film.
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Capacitive Sensors
capaNCDT
Capacitive sensors are designed for non-contact measurement of displacement, distance and position, as well as for thickness measurement. Due to their high signal stability and resolution, capacitive displacement sensors are applied in laboratories and industrial measurement tasks. In production control, for example, capacitive sensors measure film thickness and application of the adhesive. Installed in machines, they monitor displacement and tool positions.
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Ultrasonic Probes
The probe (transducer) frequency required will be determined by the minimum thickness of the material to be measured. However, the lower the frequency the more effective the ultrasound will be at penetrating corrosion and coatings, if applicable.
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VTAC, Patchcord, ITA, 36", VTAC, DACAR 535, to Rosenberger
7-141702731-036
The density/ thickness of DACAR 535 wire may require a module loading pattern that includes extra slot spacing to prevent wire bend and pressure. See the VTAC User Manual for more information.
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Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Long Edge Wet Film Combs (Stainless Steel)
3238
Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
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Micro XRF
W Series
The W Series Micro XRF uses poly-capillary optics to focus the X-ray beam to 7.5 µm FWHM, the world’s smallest beam size for coating thickness analysis using XRF technology. A 150X magnification camera is used to measure features on that scale; it is accompanied by a secondary, low-magnification camera for live-viewing samples and birds-eye macro-view imaging. Bowman’s dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and pinpoint the feature to be programmed and measured.
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Automotive Inspection Kit
Produced specifically for the automotive aftermarket and Insurance Assessors, 3rd party consultants, body shops and used car sales, these kits provide an instant measure of the coating thickness of panels.An illuminated magnifier is supplied to enable close inspection of bodywork.Measurement parameters include:Surface temperatureSurface inspectionCoating thickness
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Sheet Resistance Measurement
The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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MICRO IRHD System
Hildebrand Prüf- und Meßtechnik GmbH
The MICRO IRHD SYSTEM provides hardness readings on elastomers according to MICRO IHRD. Recommended specimen thickness is 1 to 5 mm. It complies to international standards such as DIN ISO 48, ISO 48 and ASTM D 1415.
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Thin Film Metrology Systems
Gemini Series
The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Metrology
KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Scrub Test Panels
4695
In a typical scrub test, the coating is applied to the Leneta Scrub Test Panel at a specified film thickness, allowed to dry and then subjected to scrubbing with a straight-line scrub tester.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Standard Parameters for Analysis
C-Cell Mono
C-Cell Mono is the original system and comes with the standard parameters for analysis. C-Cell Mono takes 1 image of the sample to produce analytical results such as crust wall thickness, size, shape and location. C-Cell Mono is the entry level model of the C-Cell range and offers all the basic image analysis needs for a baker.
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Ellipsometer
alpha-SE®
For routine measurements of thin film thickness and refractive index, this ellipsometer allows you to mount a sample, choose the model that matches your film, and press "measure". You have results within seconds. Works with your materials - dielectrics, semiconductors, organics, and more.
