Defect
other than specified, imperfection .
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Solar EL Defect Detector
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Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
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The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Product
Transistor-Level Defect Simulator
Tessent DefectSim
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Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
Software For Visualizing Surface Quality
STATOVISION
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Foerster Instruments, Incorporated
In combination with a STATOGRAPH module, the STATOVISION software enables the visualization of eddy current signals in a clearly arranged C-Scan. This results in an image of the surface quality of the components, allowing surface defects to be precisely localized. A major advantage of the STATOVISION software is the pattern recognition, which can be used for surpressing drill holes on brake discs, for example. The documentation of the entire scan is used for continuous quality assurance.
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Product
MicroDetect Basic
MDb-01
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Hachmann Innovative Elektronik
MicroDetect basic is a handy, exact and simply useable voltage detector and interface-tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-tester warns against defect interfaces.
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Product
Ultrasonic Optical Flaw Detector
MIV-X
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Thanks to Shimadzu’s proprietary light imagining technique, which combines an ultrasonic oscillator with a stroboscope, defects near the surface of a material, including peeling of the bonding and adhesive surfaces of heterogeneous materials, as well as paint, thermal sprays, and coatings can be inspected easily and non-destructively.
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Product
MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
Static Analyzer
Julia
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Julia Static Analyzer is best in class for finding defects and security vulnerabilies in C#, Java and Android applications (for C and C++ languages, please have a look to GrammaTech CodeSonar). By using Julia Static Analyzer, you reduce development and maintenance costs and eliminate risks related to security vulnerabilities and privacy leaks. The powerful analysis technology ensures a maximum precision of results. With advanced dashboarding you can flexibly transform the data into useful information for the different stakeholders.
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Product
Hipot Tester
ET 2670 A
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REOO ET 2670 A Solar Module Testing Machine is designed for PV module manufacturing inspection, enabling faster defect judgment and more stable quality verification during production. Built for solar factories, it supports reliable inspection flow.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
AutoGet auto Focus Portable Fiber Endface Inspector
CA3008
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CA3008 Autoget is an intelligent portable fiber enface inspector. with newest hardware and software, and with functions of auto focus, auto exposure,auto analysis, autogenerate report, auto image transmission, etc. Autoget can clearly find out the defects of fiber endface, such dirts, scratches.
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Product
Environmental Stress Screening (ESS) Chamber
ESS
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Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
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Product
Infrared Microscope
DDR200 & DDR300
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The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required.
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Product
TDR Structural Health Monitoring
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Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Structural-Health Monitoring probes the structural health of a composite part by propagating a fast electrical pulse along a distributed linear sensor which has been fabricated directly in the laminate. The sensor is formed from the native graphite fibers already used in composite manufacture, and constitutes zero defect. Fibers are patterned into a microwave waveguide geometry, or transmission line, and interrogated by a rapid pulse as shown below. Structural faults along the line cause distortions in waveguide geometry, producing reflected pulses similar to radar. Cracking, delamination, disbonds, moisture penetration, marcelling, and strain are all detected by propagation delay, for sensor lengths up to several meters.
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Product
Particle Impact Detection System 10
BW-LPD-DAQ4000HD
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This system is capable of vibration testing up to 10 pounds and detecting defects that produce noise, such as loose screws, particles, etc. Right from the start of PIND testing, B&W patented the first MIL-STD compliant system outperforming the competition by over 30% better detection rate as tested by the NBS (now National Institute of Science and Technology) in a well known 1978 study (NBSIR 78-1590 NASA).
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
400x Bench-Top Optical Fiber Microscope
FTM-400X
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Shanghai Fibretool Technology Co.,Ltd.
With coaxial illumination optic magnify system, FTM-400X can easily find the slight defects and scratches on fiber endface. High resolution image sensor and 8"pure black and white digital TFT LCD can show the most real details of fiber endface.This is an integrated fiber endface inspector, it combines optical microscope and monitor in a body other than separate designs. It has clear images and long life time. it has series of adaptors for various kinds of connectors such as multi fiber connectors, optical components. It is an essential instrument for optical manufacturing.
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Electroluminescence Test Systems
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The products of the SolarModule EL-inline family are integrated into a module production line, before lamination, after lamination or at the end directly after the performance measurement. High-resolution cameras provide excellent image quality and allow the automatic detection of relevant defects. A manual evaluation of images is no longer necessary, which means that considerable costs can be saved. Communication to upstream and downstream processes is flexible and can be adapted to all common interfaces.
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Product
Qualmark HASS Systems
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Advanced environmental test chambers that combine rapid temperature changes with multi-axis vibration to quickly find product weaknesses and eliminate defects in electronics and electromechanical devices.
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Product
Automated Marking Quality Control System
Angara
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The machine vision system ASKKM "Angara" is designed to detect and reject defects in the marking of labels, excise stamps, boxes, vials, ampoules, bottles, etc., which have visual manifestations in the field of permanent or variable printing. It is installed on a conveyor or mounted in a labeling machine. Labels are checked before being applied to the product or marking on the package.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
