BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Product
Test Socket
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Our test sockets are made for high performance and are of top quality, to guarantee a smooth, effortless process. We believe in providing our partners and customers with effective and intelligent solutions that they can apply with ease. Choose the solutions of TTS Group cater to the needs of detailed and complex systems.
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Product
Test System Replication/Build-to-Print
Test System
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Product
Socket Testers
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Socket testers are portable devices used for testing the wiring of power outlets. These testers are used widely in home and commercial buildings. UNI-T’s socket testers can speed up the testing process considerably and obtain reliable and accurate information socket status.
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Industrial & 3-Phase Socket Testers
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Martindale Electric Industrial & 3-Phase Socket Testers
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6TL60 Rotary Test Handler
H79006010
Test Platform
6TL60 has been designed according to the 6TL philosophy, following the concepts of flexibility, modularity and scalability, and with the aim of improving production efficiency as well as increase production capacity and reduce costs.The 6TL60 is the best production solution to automate test processes to reduce the cycle time and the footprint used in the manufacturing plan
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TEST SOCKET
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IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
Interposer
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
LTE/LTE-Advanced Analysis Using NI PXI RF Test Instruments
NI-RFmx LTE/LTE-Advanced
Test Instrument
Highly optimized RF measurement experiencePerform physical layer analysis on LTE cellular signals including MODACC, ACPR, CHP, OBW, and SEMIncludes support for TDD, FDD, and LTE-Advanced signals specified in 3GPP standards release 12Simple access to advanced measurement parallelism
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PLCC Clips & Socket Plugs
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Ironwood’s family of clips and plugs for PLCC packages can be used for connecting PCBs together or for gaining access to signals for testing.
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Product
Test Fixture
16047E
Test Fixture
Perform impedance evaluation of lead type devices of up to 120 MHz; includes a guard and a shorting plate
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Product
Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Open-Frame Collet Socket with Solder Tail Pins
Series 518
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Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Elevator Strip-Line™ Socket with Bifurcated Contacts
Series 700
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Elevator Strip-Line Sockets with Bifurcated Contacts. Features: For elevated mounting of LCDs and other odd-centered or high pin count components. Any height from .360 to 2.000 [9.14 to 50.80]. ?Optional spacer available for mounting on .300 [7.62], .600 [15.24], .900 [22.86], 1.100 [27.94], and 1.300 [33.02] centers. Consult factory for other sizes.
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Product
6TL29 Semi-Automated Test Platform
AQ377
Test Platform
- Compact, transportable and modular test platform.- Ready for ICT, FCT, Boundary Scan, HiPot, Vision or any combination of the previous technologies.- Mass interconnect 9025 Receiver from Virginia Panel.- 100% Compatibility with Inline Test Fixtures (P/N: AT799, AN133 and EB773).- Free available rack space: 47U height- Multi-stage pressure at 3 levels.- FastATE Technology & YAV Modules compatible.- Phi6 Dispatcher Interface.- CE Compliant.
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Socket Tester
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*Power supply from mains : 200-230V AC*Transmit AC signal through concrete walls; Shielded / armored cable*Internal fuse protection
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Optical BGA Inspection
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Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Functional Testing and Test Engineering
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Customer-supplied or developed in-house• Ruggedization of existing (lab-built) fixtures• Co-develop hardware/software• Deployment, implementation, and training• Engineering evaluation tools• Design verification• Medical device evaluation• Manufacturing test systems• Verification test systems• Go/No-go tests• Serialization, recordkeeping, and datalogging• Troubleshooting failed units with other test platforms
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Product
CPE Design Verification System
Jupiter 310
Test System
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Product
NI Semiconductor Test Systems
Test System
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Product
230V AC Socket Tester(For UK)
1942
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Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon indicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1W*Frequency: 50Hz
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Testing
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Underwriters Laboratories Inc.
Our independent, rigorous testing process helps ensure that your products align with applicable requirements and expectations. We deliver innovative, customized options that aim to streamline testing processes, reduce costs and help speed products to market around the world. And our global team’s knowledge helps you stay ahead of the curve on evolving requirements, materials and technologies.
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Product
40-Pin DIP-to-Socketable PLCC Adaptor
1111163
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40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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Product
DDR3 X16 Non-Stacked DRAM BGA Interposer For Logic Analyzers
W3636A
Interposer
The W3636A DDR4 x16 BGA interposer allows you to gain signal access to the DDR3 signals critical to your debug and validation effort through a logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DDR3 x16 non-stacked DRAM or with an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR3 signals without impacting the performance of your design.
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Socket Tester c/w Buzzer
DL1090
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Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
