BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Probe Tip Ground Lead with 0.8 mm Socket
PK007-024
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Probe Tip Ground Lead with 0.8 mm Socket.
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Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Compression/Tensile Testing
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For testing of strength in tension, compression, bending, shearing, rapture and etc.It can be used for various raw materials, semi-finished and finished products which are essential to manufacturers performing quality control & academic organizations for studying the physical properties of raw materials
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Test & Measurement
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NIF (Dutch Instrument Factory, later Nieaf-Smitt) started in 1900 as one of the first organizations in the world with the design and production of instruments for electrical values. The portfolio of test tools, digital multimeters, current clamps, device testers, installation testers and power analyzers is characterized by quality and reliability.
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Product Testing
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Verification of advertising promotional material in relation to operating, electrical, mechanical, or pneumatic performance; ease of assembly, type of material furnished, general capabilities, and overall safety. Detailed internal and external inspections conducted. Extensive facilities for furniture testing.
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ATE Test Systems
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Introducing the Procyon ATE System! When it comes to ATE Test Systems for a for low- to high-volume production, Intepro has the testing power you require to be successful. For more than three decades, Intepro Systems has designed, built and integrated power supply test equipment for the world’s largest and smallest power supply manufacturers.
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Elastomer Socket
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As a structure made of silicon and conductive powder, elastomer is a good solution for high speed, no ball damage, stable CRES, low force and high frequency testing.
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Cloud Testing
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Cloud-based platforms are increasing enterprises’ ability to reduce time-to-market drastically along with eliminating upfront costs. This has led to increased interest in the adoption of cloud-based solutions. However, it brings unique challenges related to data security, privacy, integration, and application performance. These require comprehensive cloud-based testing to ensure your cloud implementations are successful and you realize complete benefits from the cloud solution.
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Localization Testing
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Localization testing is a method that ensures that an application can be used in a specific area or region. It involves testing the application to verify the accuracy, behavior, and suitability in a specific geographical area.
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Test Connectors
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A wide range of standard test Connectors that can fit many of your applications and services. We offer a ideal solution for your testing needs in automatic or manual mode.
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Semiconductor Test
Ismeca NY32
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32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.
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Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Integration testing
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Integration testing primarily focuses on verifying data communication among different modules of the software project. Integration tests determine the effectiveness and performance of different software modules when they are connected to each other.
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
Interposer
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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IEC60884-1 Plug Socket Switch Life Tester With 3 Stations
CZKS-4
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Shenzhen Chuangxin Instruments Co., Ltd.
1. This test equipment is designed and manufactured according relevant requirement of Standard IEC60884-1,GB2099.1 and GB16915.1,Mainly used to test the service life of household and similar use plugs and sockets or switches. 2. This machine connect to load cabinet and conduct electrical life test ,normal operation and breaking capacity to plug socket and switch.
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Dust Testing
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Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Test Prods
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Test prod with 4mm plug, test prod with 2mm pin, safety test prod, test prod 2mm, test prod 4mm, miniature test prod.
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Test Benches
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Atec has made test equipment throughout all of its 65-year history. Test benches for aerospace and energy uses represent a significant segment of our experience. Atec has produced test benches involving hydraulics, mechanicals, electromechanicals, electronics, pneumatics, motors, and digital automation. Atec test benches have performed for challenging measurements, factory production, problem analysis and component overhaul scenarios. Today, complex test benches have capable data acquisition, control and communication systems integral in their electronics. Atec’s ADAQ™ system, based on COTS components and software, is proven and popular in test bench applications. DCUs, ECUs, FADECs and earlier analog or mechanical control units are easily interfaced.
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ATE Socket
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Design ATE socket according to customer's requirementsUse on auto-test eqiupments and handler.Pitch range from 0.30 to 1.0mm.Pin amount: 2 and above.Key material: Peek,Torlon.etcContact with top pogo pin
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Test Engineering
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TestEdge engineers have an average of 17 years of engineering experience in test, packaging, and fixturing. This experience is across a wide spectrum of products, customers, and ATE platforms. We have experience in all of the following:Digital, analog, mixed-signal, RF Test programming servicesRemote test capability Semi-automatic test generation Automatic data collection and reduction High performance test fixturing Format independant vector translation High power testing with liquid cooling
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On-Site Testing
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Radiometrics Midwest Corporation
At Radiometrics we understand that some products are just to big to bring to us. Radiometrics will travel to you and perform in-situ testing at your facility or your clients location.
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Test Labs
ART-MAN
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ART-MAN uses 285 100% vector sensors per SAM phantom and 390 sensors in the flat body phantom to take accurate measurements based on state-of-the-art near-field theory.
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testing facilities
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Mechanical scanning of the component is required for the automatic imaging ultrasonic testing technology. Depending on the test requirements, the size and shape of the component and the required cycle times, we offer different solutions.
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Hardness Testing
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DeFelsko offers handheld digital hardness tests in compliance with two different recognized hardness scales: Shore and Barcol. Our PosiTector SHD Shore Hardness Durometer is available in both Shore A and Shore D scale to measure the indentation hardness of non-metallic materials. The new PosiTector BHI Barcol Hardness Impressor is ideal for measuring the indentation hardness of soft metals, harder plastics and fiber-reinforced plastics.
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Portable Testing
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Whether you need handheld testers, digital hydrometers, ground fault detectors or discharge testing equipment, we offer the cutting-edge technology you need to stay ahead in managing and maintaining your power systems.
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Bluetooth Tests
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Devices that are equipped with Bluetooth® technology must, on the one hand, meet the respective country-specific regulatory test requirements, such as B. in accordance with FCC, ISED or CE, as well as test requirements of organizations such as the Bluetooth® SIG or the CTIA have to pass and meet in order to obtain market approval.
