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Inductively Coupled Plasma
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Inductively Coupled Plasma
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Coupling Decoupling Network
TBCDN-M3
The TBCDN-M3 is a Coupling Decoupling Network for conducted immunity testing according to IEC 61000-4-6.
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UV Plasma Sources
UVS300|UVS 10/35
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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Inductive Load Banks
L-Series
L-series inductive load banks are devices which contain inductive loads, apply the load to an electrical power source and dissipate the reactive power of the electrical source. L-series load banks are designed for portable and fixed applications. Hilkar brand L-series load banks have robust design and are specifically designed for corrosive environments. Load banks can be controlled via local, remote, wireless remote or automatic control systems.
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CDN - Coupling / Decoupling Networks
The Coupling- / Decoupling Networks are used to inject common mode disturbances to Equipment under Test (EuT). Further the CDNs provide sufficient decoupling between Auxiliary Equipment (AE) and disturbance signal. The requirements for CDN and their application are described in the standard IEC 61000-4-6 (Immunity to conducted disturbances, induced by radio-frequency fields). CDNs have a common mode impedance of 150 Ohm and are available for a multitude of cable types and connectors.
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Inductive Sensors (LVDT)
induSENSOR
Micro-Epsilon offers a large range of inductive sensors for displacement and position measurement from conventional LVDT sensors and inductive sensors with integrated controller to customer-specific high-volume versions. The induSENSOR displacement sensors from Micro-Epsilon are used in automated processes, quality assurance, test rigs, hydraulics, pneumatic cylinders and automotive engineering.
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Coupling Decoupling Network
TBCDN-M1
The TBCDN-M1 is a Coupling Decoupling Network for conducted immunity testing according to IEC 61000-4-6.
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Remote Plasma Sources For Process Applications
MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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Inductive Sensor
HFCT Ø 30-39-50mm
Techimp HFCT is an inductive sensor for partial discharge measurements. It is suitable for on/off line PD tests on many electrical systems (cables, transformers, rotating machine, etc..). It has to be applied to the ground connection of the system to be tested.
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Inductive Sensors (eddy Current)
eddyNCDT
Inductive sensors from Micro-Epsilon are based on the eddy current principle and designed for non-contact measurement of displacement, distance, position, oscillation and vibrations. They are particularly suitable when high precision is required in harsh industrial environments (pressure, dirt, temperature). Inductive sensors from Micro-Epsilon offer extremely precise measurements where sub-micron accuracy is required.
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DC Coupled Current Probe
34134A
Measure a wide range of applications with this battery-powered, clamp-on probe; use with DMMs or voltmeters
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Inductively Powered Telemetry Systems
Advanced Telemetrics International
ATi Inductively Powered Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver.
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Coupling Decoupling Network for Communication Lines
CDN61000-5C
• Application Range: ≤4kV, 1.2/50us pulse, 8 wire unshielded twisted pair (UTP) • Test Voltage: Max 4KV, 2 kV (1.2/50 µs pulse when RJ45 connector is connected. Maximum test voltage is 1.5kV when RJ45 female is unconnected or auxiliary terminal is not protected.) • Coupling mode: 90V gas- discharge tube+250ohm Resistor/Each Wire, 8 Wires Simultaneously-Ground (Common Mode) • Input and output interface: RJ45 connector • Terminal layout (RJ45 connector): First pair of lines: pins 1/2 Second pair of lines: pins3/6 Third pair of lines: pins 4/5 Fourth pair of lines: pins 7/8 • Max. operating speed: 1000MBit/s • Max operating voltage: Max 50V DC • Max operating current: Max 1A Related Instruments
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High Power Microwave Plasma System
The High Power Microwave Plasma System features the High Power Microwave Plasma Source, generator (with isolator) and auto-tuning system comprised of the Precision Power Detector and SmartMatch® unit. This comprehensive system delivers a high concentration of radicals with low electron temperatures for the highest dissociation and lowest recombination rates.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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