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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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ICP-OES Analyzer
ARCOS
SPECTRO Analytical Instruments GmbH
For the most demanding elemental analyses in industry and research. ARCOS analyzer represents a new pinnacle of productivity and performance for inductively coupled plasma optical emission spectrometers. SPECTRO ARCOS excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensitivity while reducing solvent based interferences such as oxides and hydrides. The Aridus3 is particularly advantageous for small volume and highly corrosive samples such as those generated in the earth sciences and the semiconductor industry.
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Inductively Coupled Plasma
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Multichamber Plasma CVD & RIE Processing Systems
Model MPS-2000
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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UV Plasma Sources
UVS300|UVS 10/35
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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DC Coupled Current Probe
34134A
Measure a wide range of applications with this battery-powered, clamp-on probe; use with DMMs or voltmeters
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RF Plasma Generators & Amplifiers
100 W to 2400 W 13.56 MHz Analog/Digital, RS-232, USB interfaces Low Harmonic Distortion Automatic and Manual Gain Control High Speed Pulsing (Bursting) controls Compatible with T&C''''s Matching Networks GUI Software (complete PC control) Includes all essential RF power/communication cables and mounting brackets Air cooled (Air & Water 1200 W +) Half rack mount or stand alone versions Ideal for: Industrial, Scientific, and Medical Applications
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Plasma CVD & Reactive Ion Etching System
MODEL DRIE-1100-LL-ECR
The Tek-Vac DRIE-1100-LL-ECR series systems are designed for both high-density plasma chemical vapor deposition and reactive ion etching of sub-micron integrated circuits, optical devices and RF microwave electron devices.
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Time-domain Field-Device-Circuit coupled simulator
EM-SUPREME®
Time-domain Field-Device-Circuit coupled simulator for modeling of passive structures, active components, and complete RF & millimeter-wave modules. EM-Supreme is used for EM modeling of power amplifiers, switches, filters, active antennas, and complete RF modules such as antenna-switch, switch-filter, switch-filter-amplifier, and front-end modules with no approximations.
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Plasma Emission Controller
RU-1000
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Ideal Remote Plasma Source For Oxygen-Based Processes
Rapid OX
Reduce recombination effects and extend the lifetime of oxygen radicals thanks to Rapid OX's removable quartz liner. When compared to anodized chambers, the resultant reactive species extended lifetime improves photoresist strip rates. And because the quartz liner is easily installed or removed by the operator, it decreases downtime and significantly lowers replacement costs.
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Microwave Plasma Subsystems
AX2600 And AX2700
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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Digital Dairy Refractometer, Colostrum and Blood Plasma Protein
DD-2
The DD-2 Digital-Dairy Refractometer will provide reliable estimates of the percent solids in waste milk and colostrum quality using the Brix Method, and a blood serum total protein concentration scale can be used to assess failure of passive transfer. The MISCO Digital-Dairy™ refractometers are specifically designed to help professional dairy farmers and calf ranchers to rear healthy calves. They are rugged enough to withstand the demands of farm use, yet precise enough to give laboratory-quality readings.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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Elite™ 13.56 MHz RF Plasma Generators
The elite™ Series of RF plasma generators provides state-of-the art technology in a compact air-cooled package. The elite is designed with high speed closed loop control, a class E RF deck and a switching modulator for superior output performance. The elite design utilizes a single printed circuit board assembly for the full rack product virtually eliminating all internal wires and connectors and thereby providing the highest reliability available.
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2 Channels, MIL-STD-1553, Dual Redundant, Direct Coupled, Assisted Mode Capable (AMC)
FTE
MIL-STD-1553 is a military standard published by the United States Department of Defense that defines the mechanical, electrical, and functional characteristics of a serial data bus. It was originally designed for use with military avionics, but has also become commonly used in spacecraft On-Board-Data-Handling (OBDH) subsystems, both military and civil. It features a dual, redundant, balanced-line, physical layer; a (differential) network interface; time division multiplexing; half-duplex command/response protocol; and up to 31 remote terminals (devices).
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2 MHz RF Plasma Generators
NOVA® Series
The NOVA ; RF Plasma Generators are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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KEINOS™ 2 MHz 5 KW, 11 KW & 13 KW RF Plasma Generators
The KEINOS™ 2MHz plasma generator builds on the solid, reliable attributes of the existing 2MHz design. KEINOS™ incorporates the latest technology from MKS to enable demanding applications of pulsing, fast impedance changes and shorter process steps. KEINOS™ can deliver up to 13kW of power, pulsing up to 50KHz, multiple set point pulsing, pulse shaping and MKS patented frequency tuning. KEINOS™ uses an integrated VI sensor for power accuracy and digital based control for fast response times.
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RF Plasma Generators
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements. From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
