Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Memory Testing
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C.C.P. Contact Probes Co., LTD.
Standard and Custom test solutions for RAM, Flash and many other memory chips.
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Product
ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
Module Spectrum
nRF52832 Series
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Raytac nRF52832 module spectrum covers MDBT42Q, MDBT42 and MDBT42V series with both Chip Antenna and PCB Antenna option for selection.
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Product
Arduino CAN Shield
IFB-10003-IWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
Ground Leads Continuity Tester
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Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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Product
Gaussmeter
DX-102
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DX-102 Gaussmeter is a portable gauss meter, based on the latest progress of Hall effect magnetic field measuring instrument, adopted DSP technology. Test probe adopts import GaAs linear Hall chip, the difference between any two probes is small, if damaged, it can be replaced directly. DX-102 Gaussmeter is an ideal DC magnetic field test instrument.
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Product
Chip Test Adapter
RAMCHECK Sync
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The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Product
PROBE CARD
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the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Product
32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
Stone-chip (Gravelometer)
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Trialon routinely tests products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
Low Constant Temperature Trough
DRK6691
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Shandong Drick Instruments Co., Ltd.
Drk6691 small low constant temperature trough is a special product designed for small Abbe refractometer, supporting the use of. It has many advantages such as constant speed, constant temperature, small volume, low noise and convenient operation and so on , so it is a higher price products. This product adopts the technology of the one chip computer, PID selftuning regulation technology;adopts imported platinum resistance temperature (Pt100), so it has high precision of temperature control and temperature fluctuation is small; adopts the semiconductor refrigeration technology, so that it consists of advantages of fast refrigeration, no noise.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
Arria 10 FPGA Card
CP-FPGA-4
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The Arria 10 FPGA PCIe card features a powerful field programmable gate array chip that supports both analog and digital I/O. Each card’s I/O functionality is fully customizable by the user by means of the FPGA Workbench tools. The cards are available with 480K or 1150K logic elements. There are two High Pin Count FMC Style Positions available for the High-Speed Daughter Cards.
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Product
NVIDIA Jetson Solutions
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Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
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The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
RF Signal Generators
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The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Product
Embedded Antennas
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Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.
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Product
SparkFun FM Tuner Basic Breakout
Si4703
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This breakout for the Silicon Laboratories Si4703 FM tuner chip is a little more stripped down than our FM Tuner Evaluation Board. If your project already has an amp and just needs a full-featured FM tuner, this is the board for you. Beyond being a simple FM radio, the Si4703 is also capable of detecting and processing both Radio Data Service (RDS) and Radio Broadcast Data Service (RBDS) information. The Si4703 even does a very good job of filtering and carrier detection. It also enables data such as the station ID and song name to be displayed to the user.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Data Loggers
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Premier Electrosystems has a wide range of data loggers to suit your needs. All our data loggers can be customized as per requirement. Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it. Then the information stored in the data logger is transferred to a computer for analysis.
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
I2C Isolators
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Analog Devices’ family of isolated I2C isolators support a complete isolated I2C interface. This portfolio is based on our iCoupler® chip scale transformer technology. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. By integrating iCoupler channels with semiconductor circuitry, our technology enables a complete, isolated I2C interface with a small form factor. Our I2C isolators covers applications such as central office switching, networking, and power over Ethernet.
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Product
KV CAPS
200 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
