Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Infrared Moisture Analyzer
LD-LIMA-A10
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Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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Product
Rocket Motor Initiators
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Our patented Rocket Motor Initiators and Through Bulkhead Initiators are designed to work with single- and multiple-pulse rockets, as well as those platforms that might not currently have MIL-STD-1901A-compliant initiators. Excelitas initiators are designed to work in conjunction with our Ignition Safety Devices and low-energy, low-profile Blue Chip® Detonators to provide a comprehensive and reliable rocket ignition and firing solution.
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Product
OEM CCD Camera
Syncerity BI-NIR Camera
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The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics
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Product
Registered DIMM
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a type of RAM module featuring a hardware register (RCD) between the DRAM chips and the system's memory controller.
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Product
DDR3 SODIMM
SQR-HS3I
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Original Samsung/Micron IC chips adapted, Heatsink attached. Data transfer rate: 1600 MT/s, Operating temperature: -40 °C ~ 85 °C, 3years longevity, Fixed BOM, Lifetime warranty.
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Product
8GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Optical Transimpedance Amplifiers
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Analog Devices optical transimpedance amplifiers offer a complete, high performance, single chip solution for converting photodiode current into a differential voltage input. Supporting data rates from 155 Mbps to 11.1 Gbps, our transimpedance amplifiers are ideally suited for data communications and telecommunications applications supporting lay protocols including 1×, 2×, 4×, and 8× Fibre Channel, 10GBASE-LX4, SONET/SDH up to OC-192 with FEC, and 10 Gigabit Ethernet. Our transimpedance amplifiers feature low input referred noise current, high input current, and low power dissipation.
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Tantalum-Polymer
POSCAP™
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Panasonic Industrial Devices Sales Company of America
Panasonic POSCAP™ Solid Electrolyte Chip Capacitors offer stable capacitance at high frequency and temperature, with low-ESR/ESL. These Capacitors utilize a sintered tantalum anode with a proprietary high-conductivity polymer cathode. Panasonic's innovative construction and processing yields one of the lowest ESR levels in Tantalum-Polymer Capacitor technology, while exhibiting excellent performance in high frequency applications. POSCAP Capacitors are available in various, compact package sizes for a small PCB footprint while offering high volumetric efficiency for capacitance. In addition, Panasonic’s POSCAP parts demonstrate high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
32G SO-DDR4-3200 2GX8 1.2V SAM -20~85℃
AQD-SD4U32GN32-SB2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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Product
Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
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Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
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Product
SparkFun MicroMod Teensy Processor
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The SparkFun MicroMod Teensy Processor leverages the awesome computing power of the NXP iMXRT1062 chip and pairs it with the M.2 MicroMod connector to allow you to plug it into your choice of compatible MicroMod Carrier Board. With the M.2 MicroMod connector, connecting your Teensy Processor is a breeze. Simply match up the key on your processor's beveled edge connector to the key on the M.2 connector and secure it with a screw (included with all Carrier Boards). Adding a Teensy to your desired project has never been easier!
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Product
Pyroelectric Detectors
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Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
IC Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
XMC Display Control Card
XM26001
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LinkedHope Intelligent Technologies Co.,Ltd.
XM26001 is a graphics, image processing and computing single-board computer independently developed by Linghao Intelligent®. It uses the AMD G series APU GX-210HA by default, integrating the CPU, GPU, south bridge and north bridge on one silicon chip.
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Product
Chip Inductors
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Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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Product
Optical Sensors
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Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
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Product
64 Channel Multihit TDC
V1190B-2eSST
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The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Diode Arrays
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a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
