Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Product
EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Microcontrollers
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Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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Product
Mixers/Receivers In Terahertz Range
Hot Electron Bolometer (HEB)
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Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz. Advantages: Above about 1 THz Hot Electron Bolometer mixers offer the best sensitivity and lowest noise of all the technology for the coherent detection of radiation.
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Product
SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
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The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic connector to easily connect to the I2C data lines but you will also need to connect to two additional lines. This board is very small, measuring at 1in x 0.5in (25.4mm x 12.7mm), which means it will fit nicely on your finger without all the bulk.
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Product
100μm Flexible PET IDE Sensor Chip
LAF1
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100μm flexible PET interdigitated electrode (IDE) sensor chip with gold electrodes for gas sensing, humidity monitoring, biosensing, and capacitive sensing research.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
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12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
96/48/24-CH Opto-22 Compatible Digital I/O PCI Cards
PCI-7296/7248/7224
Digital I/O Module
ADLINK"s PCI-7296/7248/7224 are high-density parallel digital I/O boards with 96/48/24 I/O channels. The header connectors are fully compatible with industry Opto-22 standard. Thus, PCI-7296/48/24 can utilize the Opto-22 external devices. The PCI-7296/7248/7224 devices emulate mode 0 of the industry standard 8255 programmable peripheral interface (PPI) chips. The PCI-7296/7248/7224 provides 4/2/1 PPI chips respectively. Each PPI offers three 8-bit ports: Port A, Port B and Port C. The Port C is divided into 2 nibble-wide (4-bit) ports. The PCI-7296/7248/7224 devices have programmable timer/counters. One 16-bit counter is available for event counting, while the other 32-bit timer is available for timed interrupt generation. The PCI-7296/7248/7224 devices provide multiple programmable interrupt sources from DIO channels, as well as the output of the timer.
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Product
AMC GBit link card/VITA 57 FMC carrier
SIS8100
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The SIS8100 will be a single width mid height AdancedMC card. It will interface with a single PCI Express lane over a PLX Technology PEX811 PCI Express to local bus bridge chip and have an on board Virtex IV FPGA. The default stuffing option has a Small Form Factor (SFF) optical link medium that can be operated at 1, 2.5 and 4 GBit/s.
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Product
Embedded Antennas
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Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Inductor Tester
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An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Product
Inductors
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Murata offers a broad lineup of chip inductors that fit diverse requirements such as compact size, large current, etc. across applications ranging from consumer use to automotive applications that require high reliability. We are also productizing inductors with superior mountability thanks to their SMD type that are suited to specific applications such as high-frequency circuits, power supply circuits, in-vehicle PoC, short-range wireless communication, etc.
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Product
Software
SSI-TRES
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Product
On-Chip Debugging Emulator
E2 Emulator
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The new E2 emulator is an advanced on-chip debugging emulator and flash programmer developed based on a concept of "improvement of development efficiency". The download speed is up to twice as fast as the E1 emulator. Moreover, new solutions contributing to reduction in development time will be available.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Product
MIPI Video Devices
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The abundance of the MIPI® interface in mobile applications has driven its proliferation into other application areas such as the automotive and broader consumer environments. Analog Devices, an established provider of video products, offers a range of MIPI video devices that provide interfaces to the latest generations of system on chip (SoC) processors. Typical applications for MIPI video devices include the rear-view camera function in the automotive environment and HDMI® output from portable devices featuring a MIPI-capable SoC. The MIPI video device portfolio offers a variety of solutions.
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Product
Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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Product
16GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V16GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
8 Channel DAC FMC Module
DACNF08 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
PCI Evaluation Board
BCM91125E
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The BCM91125E is a full-length PCI evaluation board with the SiByte® BCM1125H MIPS processor System on a Chip (SoC). The board is designed for software development and developing PCI applications, which require high-performance processors. The BCM91125E can be plugged into a PCI slot in any PC, workstation or server, or can be used as a stand-alone device.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
300μm Ceramic Interdigitated Electrode Chip
CIA1
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The CIA1 300um Ceramic Interdigitated Electrode Chip is designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research.
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Product
Microelectro Mechanical Systems And MEMS Sensors
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NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
