Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
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See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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Product
Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Product
Fully Compliant ASi-5 Transceiver ASSP
ASI4U-V5
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The ASI4U-V5 is the industry’s first silicon solution to fulfill the ASi-5 (Actuator-Sensor-Interface version 5) standard for industrial network equipment that enables comprehensive Industry 4.0 applications. The ASI4U-V5 ASSP comes with a completely verified and field-proven firmware that fully implements ASi-5. Hence, integration of ASi-5 into any application is very easy, as the complexity of the fieldbus is hidden by the chip and the firmware.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
Computer on Module
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
JTAG (and IJTAG) Environment Tool Suite
SAJE
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SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Product
High-Speed Digital Output
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High-speed digital output photocouplers (optocouplers) are optically coupled high-speed, totem-pole output isolators containing a GaAlAs LED on the input side and a photodiode and signal processing circuit on the output side in a single chip.
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Product
16 Channel Multihit TDC (25 ps)
V1290N-2eSST
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The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Product
96-CH High-Driving DIO Card
PCI-7396
Analog Input Module
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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Product
Digital I/O Card w/CoS IRQ
mPCIe-DIO-24S
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The mPCIe-DIO-24S is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Product
Embedded Antennas
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Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.
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Product
Empowering Traditional Mass Spec
ZipChip
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The ZipChip™ separations platform uses integrated microfluidic technology to prepare, separate and electrospray biological samples directly into traditional mass spectrometers (MS). In less than 3 minutes per sample, the cost-effective ZipChip system enables analysis of a broad range of matrices from growth media to cell lysates, blood, plasma, urine, and biopharma products. Each chip provides answers on analytes from small molecules up to intact proteins, antibodies and antibody drug conjugates (ADCs). This platform provides better separation quality than most liquid chromatography (LC) instruments – in a fraction of the time – all with full MS identification behind every separations peak.
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Product
Universal Programmer Superpro 7500
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Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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Product
Module Spectrum
nRF52832 Series
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Raytac nRF52832 module spectrum covers MDBT42Q, MDBT42 and MDBT42V series with both Chip Antenna and PCB Antenna option for selection.
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Product
Reliability Testing
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ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Product
3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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Product
High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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Cloud And Networking
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From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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Product
Coating And Finish Durability
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Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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Product
System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Product
Inductor Products
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
