Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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VIS-SWIR FPA's
Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.
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Resister
Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Interface
3508 MMS ECM
The 3508 Electrical Conversion Module (ECM) provides six (6) RS-232 outputs and ten (10) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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IGBT Drive
IGBT gate drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, signal processing circuit and power output transistor on the output side in a single chip. This coupler is designed specifically to provide high common mode transient immunity (CMR) and a high output current, and has an active miller clamp and high switching speed, making it ideal for driving IGBTs and MOS FETs.
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Automatic Programmers
SuperBOT is an automatic IC programmer with high performance and reasonable price for large-scale electronic product manufacturing. This programmer can automatically pick up, place, program, take out and pack up chips. SuperBOT 3 is capable of supporting most MCU, CPLD, serial and parallel NOR/NAND FLASH.
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pH 550 Benchtop pH Meter Kit with Probe, Stand, and pH Buffers
The PH 550 benchtop pH meter features a microprocessor chip which provides automatic temperature compensation, data storage, parameter setup, and Max/Min reading display. The meter offers a pH range from 0 to 14 and a three-point automatic calibration, with the ability to recognize standard buffer solutions (USA or NIST series). The advanced digital processing technology improves meter response time and measuring accuracy. A stable reading display icon appears when the measuring value is stable. The 3-in-1 combination pH electrode measures pH and temperature simultaneously. The compact meter includes a detachable electrode holder and three bottles of pH buffer solution. It has a dustproof and spillproof rating of IP54. Connectors are protected by silicone seal caps.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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24-Channel Digital I/O With Digital Integration Features On PCI Express Mini Card
mPCIe-DIO-24A
The mPCIe-DIO-24A is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI and PCI Express digital I/O cards, but also provides for advanced features enabled by the onboard FPGA logic.
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Chrysler CCD Vehicle Bus Comms PC Card
SL100
The SL100 uses a standard 16450 UART with baud rate settings that makes it capable of communicating with a Chrysler CCD Vehicle bus. The SL100 uses a protected interface driver chip, as prescribed by the bus specification, to connect with vehicle peripherals in a robust and highly noise immune way. The card automatically configures to become another COM port by using the built-in O.S. drivers that are tried and tested and are optimized to work in the Windows environment.
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Video Signal Generator
MSPG-6100
Analog was a main item in display device industries at the past time., but from now on, the digital is getting developed with multi-function and large-sized resolution. MSPG-6100 is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV(NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc.. bad program to protect a person under age through the regulation grade.
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Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a broad line of Resistors that include Chip Resistors, Power, High Power, Fuse, EMI Filters, and Arrays and Networks for all applications.Panasonic Resistors have a wide range of features and specifications including conventional Thick Film Chip Resistors or specialized types like Anti-Sulfur, 0201 to 0805 case sized Chip Resistor Arrays, three different types of Power Resistors, Surface Mount and Leaded EMI Filters and one of the smallest Chip Fuses in the industry.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
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Ultrasound Pulser ICs And HV Multiplexers
ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
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Chip Inductors-Multilayer
Bourns Miltilayer chip inductors offer high frequency, nickel barrier, monolithic construction for high reliability, and magnetically shielded construction providing low radiation. They are well-suited for DC-DC converters, and prevention of electromagnetic interference to signals on the secondary side of electronic equipment, among many applications.
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Chip Tester
TL2000
ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Laser Diode
Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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Digital I/O Card w/CoS IRQ
PCIe-DIO-24HS
This product is a x1 lane PCI Express digital I/O board available in two models. The PCIe-DIO-24H is the basic DIO and the PCI-DIO-24HS features advanced change-of-state (COS) detection capabilities. The card emulates an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C can be further broken into two 4-bit nybbles via software and configured as either inputs or outputs.
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25G APD Photodiodes
Macom Technology Solutions Holdings Inc.
MACOM offers the highest sensitivity avalanche photodiodes (APD) on the market to satisfy 28G related applications. The chips are usable from 1250 to 1650 nm for bit rates up to 28 Gb/s and 28 GBd. Proprietary designs enable superior bandwidth, excellent temperature stability and high reliability to support market needs of PAM-4 and 400G Ethernet applications.
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Storage Technologies
We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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Inductors
Murata offers a broad lineup of chip inductors that fit diverse requirements such as compact size, large current, etc. across applications ranging from consumer use to automotive applications that require high reliability. We are also productizing inductors with superior mountability thanks to their SMD type that are suited to specific applications such as high-frequency circuits, power supply circuits, in-vehicle PoC, short-range wireless communication, etc.
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PIN Diodes
The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Chip Resistor Networks/Arrays
Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
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mmWave Sensors
The world’s most precise millimeter wave sensor available today on a single chip. The world’s most precise millimeter wave sensor available today on a single chip. TI’s CMOS single-chip sensors integrate an RF front-end with a DSP and MCU.
