Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Ultra Low Power Radios
IoT
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IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 RadioSingle Stream System (1x1), 20 MHzIntegrated RF front end and PCB trace antennaHostless IoT application development platform with large internal memoryUART AT command set for optional external MCU hostAllJoyn supportWi-Fi Protected Setup SupportIPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host ControllerIdeal for cost effective Internet of Things (IoT) Applications
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Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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IR Sensor
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The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Capacitors - Beam Lead
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Macom Technology Solutions Holdings Inc.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss leveraging nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs beam lead capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long-term stability.
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SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
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The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic connector to easily connect to the I2C data lines but you will also need to connect to two additional lines. This board is very small, measuring at 1in x 0.5in (25.4mm x 12.7mm), which means it will fit nicely on your finger without all the bulk.
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NVIDIA Jetson Solutions
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Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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Solid State Power Amplifiers
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Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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Chip-Type Attenuators
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Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Simics
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With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Step Recovery Diodes
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Macom Technology Solutions Holdings Inc.
MACOM’s Silicon and GaAs varactor multiplier diodes provide broadband performance ranging from 10 MHz to 70 GHz. They are ideal for multiplier circuits and are available in die form, plastic and ceramic packaging. These diodes boast a flip chip series for higher frequency millimeter wave applications; plastic packaged series for microwave frequency surface mount applications; ceramic packaged series for high power waveguide and coaxial applications.
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Programming on-chip flash in your processor
XJDirect
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XJDirect is an advanced and innovative method for programming the internal flash of your processor and implementing some aspects of board test through JTAG when traditional boundary scan techniques cannot be used.
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Isolated Digital I/O Card
mPCIe-IDIO-8
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The mPCIe-IDIO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Product
2.5G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
2.5G DFB Laser Diode Chips by GLSN
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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PC/104 Low-Power SBC with Vortex86DX CPU and Data Acquisition
HELIOS
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Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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PCI Evaluation Board
BCM91250E
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The BCM91250E is a full-length PCI evaluation board with the SiByte® BCM1250 dual-processor System on a Chip. The board is designed for software development and for developing PCI applications that require high-performance processors.
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Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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AFDX®/ARINC664P7 Modules
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AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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ARINC818 Cards
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> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
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E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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IF/RF Receivers
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IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Empowering Traditional Mass Spec
ZipChip
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The ZipChip™ separations platform uses integrated microfluidic technology to prepare, separate and electrospray biological samples directly into traditional mass spectrometers (MS). In less than 3 minutes per sample, the cost-effective ZipChip system enables analysis of a broad range of matrices from growth media to cell lysates, blood, plasma, urine, and biopharma products. Each chip provides answers on analytes from small molecules up to intact proteins, antibodies and antibody drug conjugates (ADCs). This platform provides better separation quality than most liquid chromatography (LC) instruments – in a fraction of the time – all with full MS identification behind every separations peak.
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Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Universal Counter (150MHz - 9GHz)
S4386
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S4386 series universal counter is a kind of high-precision instrument for measurement of frequency and time, which is developed by Saluki Technology. Taking the high-performance AVR single chip microcomputer as the core, this instrument is used for function control, measurement time sequence control, data processing and result display. The reciprocal counting technology is employed to achieve the equal precision measurement within the full range.Due to the characteristics such as stable performance, complete functions, wide range of measurement, high sensitivity, large dynamic range, high precision, small volume, and convenient and reliable operation, S4386 series universal counter is widely used in the fields of industrial production, scientific research, and measurement and metering as the renewal product replacing the traditional electronic counter.
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Microcontrollers (MCUs)
8-bit
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An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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Wideband Transceiver IC
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Analog Devices wideband transceiver ICs offer a complete, high performance RF and mixed-signal system on a chip. ADI’s ISM transceivers for short range wireless systems and wideband transceivers for wireless applications such as UMTS, LTE, and 3G/4G are highly integrated and deliver best-in-class performance and significant BOM savings.
