3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
Packaged Food X-ray Inspection System
EPX100
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Our revolutionary new x-ray system is so advanced it will not only improve your product safety and meet regulatory compliance but also will optimize and streamline your product inspection.
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Product
AXI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Product
Automated CMM Calibrated for High-Production Shop Floor Inspection
CMM Master
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The CMM Master provides process control by delivering optimal price and performance to your application. The system brings highly repeatable, thermally insensitive, versatile, and programmable inspection to the shop floor.
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Digital Automated Interferometer for Surface Inspection
DAISI
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DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
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Product
Robotic Inspection Made Easy
i-Robot
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The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
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Product
Portable Metrology‑Grade 3D Scanner
Black Series
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The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Product
Connector, 104-Pin D-Type Male, Solder Bucket, 5A
40-960-104-M
D-Sub Male Connector
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell.
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Product
3D Sensing
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The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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Product
3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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Product
X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Product
Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Product
Automated LED Inspection and Testing
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Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
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Product
PosiTector Inspection Kits
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PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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Product
3D Software
Geomagic Design X
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Geomagic Design X is an all-round, professional reverse engineering software with a smart combination of history-based CAD with 3D scan data processing, letting you produce feature-based, editable solid models compatible with your existing CAD software.
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Product
Magnetic Particle Inspection(MPI)
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Magnetic particle inspection is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
DIP Vision Inspection Machine
Optima III
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Landrex Technologies Co., Ltd.
DIP Vision Inspection Machine
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Product
Conformal Coating Inspection
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Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.
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Product
Replacement 30" Matched Cable Set for Use with Dx10 HiTemp Solder Tip Leadset
Dx20-Cable-HiTemp
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Replacement 30" matched cable set for use with Dx20 HiTemp Solder tip leadset
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Product
Process Control, Measurement and Inspection Workstation
ScanINSPECT VPI
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ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
First Article Inspection Machine
Optima III FAI
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Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Product
Conformal Coating Inspection System
TROI 8800 CI
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The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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Product
X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
