3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
-
product
3D Sensing
The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
-
product
Non-Destructive Test Resonant Inspection Station
RAM-TEST-FIXTURE
The NDT Test Station, Model RAM-TEST-FIXTURE Resonant Inspection System is an ideal choice for testing when repeatable manual inspections are required. The innovative Test Station allows precise control of part positioning with an adjustable table ranging up to 6.25 inches (158.75 mm) in height.
-
product
Universal 3D Metrology Software Platform
PolyWorks
Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
-
product
Automated LED Inspection and Testing
Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
-
product
Automatic Flight Inspection System
AT-920DG
Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
-
product
Conformal Coating Inspection (CI AOI)
They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
-
product
Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
-
product
3D Optical Profiler
7503
Chroma 7503 uses the technology of white light interfaces to measure and analyze the surface profile of micro-nano structures with sophisticated scanning system and innovative algorithms.
-
product
Ground Resistance Inspection Box
AllWin Instrument Science and Technology Co., Ltd.
Check the ground resistance tester each time prior to start work everyday morning and do some relevant records.
-
product
3D Scanners
Pro
Capable of scanning objects of different shapes and sizes by changing the scanner's field of view (FOV). Due to the use of the structured light technology, professional RangeVision 3D scanners provide highly detailed scans of any type of object, from jewelry to large automobiles, with accuracy up to 0.018 mm and resolution up to 0.03 mm.
-
product
Vision Inspection Systems
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
-
product
End Face Inspection Microscopes
D SCOPE EFI – D SCOPE EFI-C – D SCOPE EFI-C LWD
The new D Scope EFI for MTP/MPO and multifibers field connectors is a cost effective microscope for inspecting fiber optic patchcords and cassettes.
-
product
Real-time X-ray Inspection System
JewelBox 70T™
The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
-
product
Digital Ultrasonic Inspection, Information, storage, and retrieval system
ULTRAPROBE® 3000
he Ultraprobe 3000 is a digital ultrasonic inspection, information, storage, and retrieval system that comfortably fits in the palm of your hand.
-
product
WiFi Inspection Cameras
WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
-
product
Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
-
product
Value Inspection Cameras
General's Value Inspection Cameras offer excellent savings on certain Inspection Cameras such as the DCS280 Rugged Video Inspection System & the KT280 Professional Inspection Kit. Take a look & see if one will meet your needs.
-
product
High-precision Surface Inspection for Wind Turbine Blades
waveCHECK™
8tree's waveCHECK is a handheld-portable 3D-inspection tool for inspecting wind turbine blades in manufacturing and operation. Its efficient detection of surface defects and instant visual feedback revolutionize surface inspection.It can detect wrinkles, steps, gaps, rain erosion and any other surface damage.
-
product
Turnkey NDT Corrosion Inspection Services
Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
-
product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
-
-
product
Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
-
product
Fiber Inspection and Cleaning
Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
-
product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
-
product
Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
-
product
Automated X-ray Inspection (AXI)
Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
-
product
Vison Inspection System
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
-
product
Real-time X-ray Medical Device Inspection System
The Bench-X
Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
-
product
Ensenso 3D Cameras
X Series
Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
-
product
Inspection Toolkit
OTK-4000
The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
