3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Ultra High Performance 3D CT System
UltraTom
3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Area Scan 3D Camera
3D-A5000 Series
Cognex’s 3D-A5000 series is an area scan 3D camera designed to capture high-resolution 3D images. It features 3D LightBurst technology which rapidly acquires images to maximize throughput. High-resolution 3D images combined with industry-leading Cognex 3D vision tools enable reliable and accurate solutions to applications such as assembly verification, in-line measurement, and robotic guidance.
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Post Wire and Die Bond Inspection Machine
IV-E1700
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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160-Pin DIN41612 Connector, Solder Pin, Male
92-960-160-M
Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
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3D Compliance SAR System
cSAR3D
Schmid & Partner Engineering AG
cSAR3D is our newest and most advanced system for fast, high-precision SAR measurements of wireless devices. We have realized a system concept that has been developed over the last years to meet the demands of our highly valued customers. The system uses a novel sensor concept and advanced reconstruction algorithms. The measurement system has high absolute accuracy due to the determination of all field components in a large region of the head and body phantoms.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Automated Optical Inspection Solutions
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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High Energy Industrial CT X-Ray Inspection System
MeVX Series
The most advanced industrial DR & CT systems in the world are now available with Linear Accelerators. Offered with energies up to 9MeV, the MeVX series of systems provide the same ease of use as our low energy systems in a high energy format. Utilizing our current efX software platform along with the superior service, support & training that we are known for puts these systems in a class of their own.
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Specialist Inline Inspection
NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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Explosion Proof UV Inspection Light
he Labino MB Hercules Ex is an extremely durable product specifically developed for use in areas where the risk of an explosion is high. Offshore Oil Rigs, Refineries, Aerospace, and Defense often require explosion proof products to ensure safety for their inspection teams. The Midbeam Hercules Ex has successfully completed extremely tough tests, including tests for thermal conditioning, Impact Tests, Drop Tests and IP tests that led to the ATEX certification (Certificate: ITS17ATEX402144X). This unique product is suitable for use in extreme weather conditions varying from 104° Fahrenheit (+ 40° Celsius) to minus 4° Fahrenheit (- 20° Celsius).
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The Ultimate Inspection Tool
ULTRAPROBE 9000
The Ultraprobe 9000 Kit Complete is a digital ultrasonic inspection, information storage and retrieval system that is so versatile, so easy (most operators are able to use the Ultraprobe 9000 within 15 minutes) and so much fun to operate, you'll be looking for opportunities to use it every day.
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Digital Inspection Camera
MaxiVIDEO MV108S
It turns your Autel tablet into a video inspection scope, allowing you to examine difficult-to-reach areas hidden from sight. It is capable of recording digital still images and videos. Includes mirror, hook and magnet attachments.
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Cleanliness Inspection System / Microscope
CIX90
The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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eviXscan 3D Suite 2.0
eviXscan 3D Suite 2.0 is a comprehensive software platform that delivers the most powerful and user-friendly tools for scanning and mesh processing within straightforward workflow.With eviXscan 3D Suite 2.0 the scanning process is more easy to use and faster than ever before.The clear workflow will guide the user in all scanning steps from basic configuration to the final mesh processing and will enable to achieve significant productivity gain in work with eviXscan 3D products.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Building Inspection Kit
MR160-KIT2
Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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GPR Bridge Inspection Equipment
BridgeScan
Geophysical Survey Systems, Inc.
BridgeScan™ is a complete, affordable GPR system that is an effective tool for quickly determining the condition of aging bridge decks, parking structures, balconies and other concrete structures. The system is also used to obtain accurate concrete cover depth on new structures.
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X5 XL800 X-Ray Inspection
Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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contact/non-contact portable 3D measurement system
ScanArm
The FARO ScanArm combines all of the advantages of the FaroArm with a hand held laser scanner and is the perfect contact/non-contact measurement system. Unlike other scanning systems, the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data — all in one simple tool.
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Article Inspection Solution
ExtraEye
First article inspection (FAI) in the PCB assembly process is one of the most important steps - left unchecked every mistake from assembly machine setup multiplies into hundreds of incorrectly assembled PCBs. Maximum accuracy in first article inspection is extremely important.
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3D Roughness Measurement System
IF-Profiler
The If-Profiler is a handheld 3D roughness measurement system for high resolution measurement of surface finish. You measure roughness of flat and curved components with only one system. Measurements are performed both profile based (ISO 4287) and areal based (ISO 25178). The measurement system achieves flexible measurements and applications at high measurement speed. Various positions and measurement fields are traceably and intuitively measured. The IF-Profiler is also used to measure geometries with steep flanks and various coatings.
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Protective Inspection Kit for Hazardous Areas
The kit provides all the tools required for the on-site inspection of a coating, including surface profile, dewpoint, relative humidity, both wet and dry film thickness and also adhesive testing.Measurement parameters include:Surface inspectionSurface profileSurface contaminationClimatic conditionsCoating thicknessAdhesion
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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CMOS SoC for mmWave 3D Imaging Sensor
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Vayyar chip covers imaging and radar bands from 3GHz-81GHz with 72 transmitters and 72 receivers in one chip. Enhanced by an integrated, high-performance DSP with large internal memory, Vayyar’s sensor does not need any external CPU to execute complex imaging algorithms.
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SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Mek Selective 3D AOI
Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
